Manufacturing and Processing Technology of SiC

- Crystal Growth and Processing Technology and Responses to Various Challenges - <Book Edition / Book + PDF Edition (CD-ROM)>

○Understanding the basic characteristics of SiC! 　・From SiC raw powder to single crystals and epitaxial thin films, their features and physical properties. ○Crystal growth process technology and defect reduction strategies 　・From fundamental theories to various methods, efforts towards epitaxial thin film growth technology and defect reduction. 　・Comprehensive coverage of various defect detection and screening methods. ○Deep dive into the processing steps that account for the majority of wafer costs! 　・What are the requirements for each process such as cutting, polishing, CMP, and cleaning? What are the efforts involved? 　・Various inspection methods and simulation techniques to evaluate the impact and damage of processing. 　・Comprehensive coverage of related device processing technologies such as annealing treatment, dicing, and bonding processes. ○Control and evaluation methods for various characteristics related to the quality of SiC power devices such as SBD and MOSFET. 　・Various degradation mechanisms including bipolar conduction degradation and their countermeasures. 　・Measurement and evaluation methods for interface characteristics, defects, carrier lifetime, and various simulations. 　・What is the impact of crystal defects, processing damage, and various degradation phenomena on quality? ○Trends and various efforts towards the mass production and expansion of SiC. 　・Market and price trends for SiC wafers and expected future applications. 　・Comparative study with silicon wafer manufacturing and processing processes.

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