A thorough explanation of semiconductor packaging from the basics to applications! Valuable practical knowledge is also introduced!
**Features of this Book** - Carefully explains the fundamentals to applications of semiconductor packaging! - Provides detailed insights into the noteworthy 2.5D/3D packaging and chiplet technologies! - Introduces valuable practical knowledge accumulated by the author over many years in the field! - Explains specific examples of defects and evaluation/analysis methods during prototyping and development! - What are the efforts towards RoHS and PFAS in response to environmental regulations? - A book that looks towards the future of semiconductor packaging! **Table of Contents** Part 1: Basics of Backend Processes, Assembly, and Design in Semiconductor Manufacturing 1. Introduction 2. Fundamentals of Semiconductor Packaging - Evolution and Development of Packages 3. Packaging Processes (Representative Examples) 4. Technologies and Key Points of Each Manufacturing Process 5. Testing Processes and Their Key Points 6. An Example of Assembly and Implementation-Related Defects Experienced in the Past 7. Examples of Evaluation and Analysis Methods During Prototyping and Development 8. RoHS and Green Compliance 9. Future of 2.5D/3D Packaging and Chiplet Technologies 10. Conclusion Part 2: Integration of Existing Chips through Chiplet Technology: Advantages, Disadvantages, and Technical Challenges Part 3: PFAS in Semiconductor Backend Processes *For a detailed table of contents, please refer to the related link URL.*
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■ Release Date: September 10, 2025 ■ Author: Yosuke Hirumuta ■ Price: Print Edition (Paperback) 70,000 yen (tax included 77,000 yen) Print + CD (PDF Edition) 120,000 yen (tax included 132,000 yen) ★ Newsletter subscribers: 10% off the listed price! ■ Format: A4 size, paperback, 112 pages ■ Published by: CMC Research Co., Ltd. ISBN 978-4-910581-68-2
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Main body (booklet version) 70,000 yen (including tax 77,000 yen) Main body + CD (PDF version) 120,000 yen (including tax 132,000 yen)
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