Analyze industry and market trends in semiconductors, focusing on chiplet technology, advanced packaging technology, chiplet packaging techniques, materials, and equipment configuration!
【Features of this Book】 - Characteristics required for glass substrates used in semiconductor packaging, and trends in the development of glass interposers! - Advantages and disadvantages of backside power supply technologies from the three major semiconductor manufacturers, their business strategies, and mass production timelines? - Business strategies of foundries, EMS, fabless companies, OSAT, and semiconductor manufacturing equipment-related companies! - Characteristics and applications of 2D and 3D implementations using chiplets for heterogeneous integration! - Material properties required for 2.5D and 3D packages! Re-routing layers, encapsulants, underfills, etc.! - Types of manufacturing processes for FOWLP/PLP, related companies, and requirements for package component mounting! - Intensifying global competition for HBM market share and the business opportunities for Japanese companies that accompany it! - Performance and technology trends required for underfills, market forecasts, and company-specific shares explored! - Design and quality requirement levels to accommodate chipletization in the manufacturing of copper-plated wiring! 【Table of Contents Structure】 Part I: Introduction to Chiplets Part II: Advanced Packaging Technologies Part III: Technologies, Materials, and Equipment for Chiplet Packaging *For a detailed table of contents, please refer to the related link URL.
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■ Release Date: November 13, 2024 ■ Price: Main edition (paperback) 140,000 yen (tax included 154,000 yen) Main edition + CD (PDF version) 190,000 yen (tax included 209,000 yen) ★ Newsletter subscribers: 10% off the regular price! ■ Format: A4 size, paperback, 200 pages ■ Published by: CMC Research Co., Ltd. ISBN 978-4-910581-60-6
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Main book (booklet version) 140,000 yen (including tax 154,000 yen) Main book + CD (PDF version) 190,000 yen (including tax 209,000 yen)
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We provide the latest industrial insights to our clients. By conducting market trend analysis, publishing technology‑related books and research reports, and organizing and managing seminars, we support research and development across a wide range of industries, with a primary focus on manufacturing. Our coverage spans diverse fields such as energy, batteries, chemicals, and biotechnology.
