Analyze industry and market trends in semiconductors, focusing on chiplet technology, advanced packaging technology, chiplet packaging techniques, materials, and equipment configuration!
【Features of this Book】 - Characteristics required for glass substrates used in semiconductor packaging, and trends in the development of glass interposers! - Advantages and disadvantages of backside power supply technologies from the three major semiconductor manufacturers, their business strategies, and mass production timelines? - Business strategies of foundries, EMS, fabless companies, OSAT, and semiconductor manufacturing equipment-related companies! - Characteristics and applications of 2D and 3D implementations using chiplets for heterogeneous integration! - Material properties required for 2.5D and 3D packages! Re-routing layers, encapsulants, underfills, etc.! - Types of manufacturing processes for FOWLP/PLP, related companies, and requirements for package component mounting! - Intensifying global competition for HBM market share and the business opportunities for Japanese companies that accompany it! - Performance and technology trends required for underfills, market forecasts, and company-specific shares explored! - Design and quality requirement levels to accommodate chipletization in the manufacturing of copper-plated wiring! 【Table of Contents Structure】 Part I: Introduction to Chiplets Part II: Advanced Packaging Technologies Part III: Technologies, Materials, and Equipment for Chiplet Packaging *For a detailed table of contents, please refer to the related link URL.
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■ Release Date: November 13, 2024 ■ Price: Main edition (paperback) 140,000 yen (tax included 154,000 yen) Main edition + CD (PDF version) 190,000 yen (tax included 209,000 yen) ★ Newsletter subscribers: 10% off the regular price! ■ Format: A4 size, paperback, 200 pages ■ Published by: CMC Research Co., Ltd. ISBN 978-4-910581-60-6
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Main book (booklet version) 140,000 yen (including tax 154,000 yen) Main book + CD (PDF version) 190,000 yen (including tax 209,000 yen)
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Our company monitors market trends for various chemicals, functional materials, and products, and conducts various market research, publishes market information, and supports research and development. Additionally, we also watch market trends in energy, batteries, various chemicals, functional materials, pharmaceuticals, and healthcare. We support research and development through commissioned research, publication of market information, and hosting technical seminars.