To maximize the effectiveness of the product.
The effects obtained by incorporating "groove processing (pitch)" into the grinding pad are as follows: - It allows the grinding slurry to reach the inner circumference of the grinding machine, achieving uniform grinding. - It leads to an improvement in the grinding rate. - The discharge of grinding debris (such as sludge) becomes smoother. - By changing the pitch width on the upper and lower plates, it reduces the suction phenomenon of the substrate and workpiece. Regarding the groove specifications, you can specify the groove width, pitch width, depth, and type (concave, U-shaped), according to your preferences. *The basic groove type is "grid-shaped grooves," but other embossing processes can be discussed. Additionally, "drilling of abrasive particle holes" is also possible upon request. This can help with cumbersome tasks on-site and contribute to safety management. *For more details, please feel free to contact us.
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Since its establishment in 1937 (Showa 12), Yachiyo Micro Science has been a specialized trading company for grinding and polishing materials, while also continuously engaging in product development related to grinding and polishing through its research and development department. We also operate the technical information sites "Grinding and Polishing .COM" and "Aglutinants .COM." Please take a look.