100% focus on BATCHSPRAY technology! Significantly reduces water, exhaust, and chemicals [Wet chemical equipment for the semiconductor industry] Fully automatic equipment.
This 4-chamber system is characterized by its ability to achieve excellent process results by combining mixed chemicals at the time of use with a patented retainer comb treatment system. By using SicOzone instead of peroxides or sulfuric acid for sustainable processes such as cleaning and resist stripping, it can reduce the consumption of chemicals and deionized water by up to 90%. 【Features】 ■ Throughput of up to 600 wph ■ Four process chambers ■ Installation area of less than 12 m² ■ Highly diluted disposable chemicals ■ No need for sulfuric acid or peroxides *For more details, please refer to the PDF document or feel free to contact us.
Inquire About This Product
basic information
【Products Offered】 ■BATCHSPRAY Clean Autoload ■BATCHSPRAY Acid Autoload ■BATCHSPRAY Solvent Autoload ■BATCHSPRAY Acid/Solvent Autoload ■BATCHSPRAY Acid/Clean Autoload ■BATCHSPRAY Acid ■BATCHSPRAY Solvent *For more details, please refer to the PDF document or feel free to contact us.
Price range
Delivery Time
Applications/Examples of results
For more details, please refer to the PDF document or feel free to contact us.
catalog(2)
Download All CatalogsCompany information
Siconnex, headquartered in Europe, is a global manufacturer of wet chemical equipment for the semiconductor industry and related fields. We provide BATCHSPRAY equipment for preparing the surfaces of a wide range of end products, including MEMS, power semiconductors, analog/mixed-signal semiconductors, and III-V semiconductors. Our equipment establishes industry standards through safety, automation, compact footprint, high throughput, and efficient use of economic resources. There is a growing demand for our solutions as follows: - Environmentally friendly: Cleaning and resist stripping with ozone - Optimal for small quantities and diverse products with a small footprint for various processes - Automatic detection of etching endpoint with EPD