Specialized Book: Component Technologies and Evaluation Guidelines Required in the Beyond 5G/6G Era

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last updated：Mar 13, 2024

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Guidelines for the design of materials for Beyond 5G/6G compatibility, explained alongside examples of the development of each material, trends, and evaluation technologies.

- Overview of the market, learning the necessary high-frequency knowledge from the basics for involvement in 5G/6G. - What are the required characteristics and design policies for high performance of each component in preparation for Beyond 5G/6G? ⇒ Shielding materials, electromagnetic wave absorption materials, polyimide resins, materials for printed wiring boards/substrates, 3D printing materials, fluororesin substrates, film materials, resin hardeners, foams, etc. ⇒ What are the necessary conditions for materials such as transmission loss, relative permittivity, dielectric loss tangent, flame retardancy, processability, etc.? What are the selection criteria for materials? ⇒ Composition of components and the reasons for it, design design, manufacturing methods, evaluation results, etc. - Measurement methods for dielectric properties and how to differentiate them, measurement and calculation methods for permittivity/relative permittivity/dielectric loss tangent. - Methods for improving interfacial adhesion and adhesion, technologies for enhancing the adhesion of difficult-to-bond materials through surface treatment, packaging technologies in 5G/6G, etc.

Related Link - https://johokiko.co.jp/publishing/BC240301.php

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basic information

○Publication Date: March 2024 ○Format: B5 size, 309 pages Chapter 1: Trends and Standardization Scenarios of 5G/6G Chapter 2: Basic Knowledge of High-Frequency Engineering Necessary for Understanding 5G/6G Chapter 3: Low Dielectric Material Technologies and Required Characteristics of Various Materials Section 1: Overall Direction and Design Guidelines for Necessary Characteristics, Parameters, and Additional Functionalities on the Component Side Section 2: Design Considerations and Development Cases for Electromagnetic Wave Absorbers in 5G/6G Applications Section 3: Concepts and Basic Design of Electromagnetic Wave Absorbers in the 5G/B5G Gigahertz Band Section 4: High-Frequency Corresponding Technologies for Each Material Section 5: Material Evaluation Chapter 4: Adhesion, Joining, and Processing Technologies Section 1: Interface Adhesion Strength of High-Frequency Substrate Materials and Conductors for 5G/Beyond 5G Communication Section 2: Technologies for Improving Adhesiveness of Fluororesins Section 3: Methods for Enhancing Adhesion of Difficult-to-Bond Materials through Surface Modification Section 4: Direct Adhesion Technology Free of Adhesives and Pretreatment through Plasma Surface Modification Section 5: Packaging Technologies for 5G/6G

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○List price: ¥66,000 (including tax (10% consumption tax))

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※Orders placed by 3 PM will be shipped on the same day (for products that have already been published).

Applications/Examples of results

Recommended for the following individuals: - Those who want to understand the material properties and requirements needed for high-speed and large-capacity communication. - Those who want to learn about transmission loss, dielectric loss, and conductor loss. - Those who want to know about adhesive and bonding technologies from the basics to applications.