Cushioning material for 12-inch frame shipping cases (for semiconductor inter-process transport)
We developed cushioning materials for safely transporting frame shipping cases for 12-inch dicing frames between semiconductor processes.
Introduction of "Cushioning Material for 12-Inch Frame Shipping Cases." We have developed cushioning material to safely transport frame shippers for 12-inch dicing frames between semiconductor processes. Designed with PAOSS (Cushioning Simulation) technology. Actual drop tests have been confirmed to meet JIS Z0200 Level I! It can be nested, saving space. Please feel free to contact us when you need it. 【Specifications (Excerpt)】 ■ Material: Santech Foam (Polyethylene) ■ Actual Drop Test: Confirmed to meet JIS Z0200 Level I ■ Compatible Models: E400-276-101-0615 ■ Packaging Specification: 5 sets/PE bag ■ Packaging Size: Approximately 540×345×1050H *For more details, please refer to the PDF document or feel free to contact us.
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Detailed information
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The size of the cushioning material during assembly will be 540mm x 354mm x 571mmH.
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Packaging: We will deliver 5 sets in a plastic bag. Packaging size: 540mm x 354mm x 1050mm h
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Company information
Our company, as a proposal development-oriented trading company, absorbs various needs of the semiconductor market and offers transportation materials from the front-end to the back-end in a one-stop manner, covering everything from design to manufacturing to sales. Our distinctive feature is that, in addition to the trading functions of Oji Holdings, we leverage both generic and high-performance materials to propose optimal packaging specifications, and we can provide a one-stop solution for mass production systems through our own production capabilities and collaboration with partner companies. From cushioning design to proposals for returnable materials, we believe we can demonstrate our "comprehensive strength" and provide our customers with the forms they truly seek.