[Book] Trends in Advanced Semiconductor Manufacturing Processes and Miniaturization (No. 2220)
2220 Semiconductor Manufacturing Process
[Available for preview] - Film formation technology, lithography, etching, CMP, cleaning -
Book Title: Latest Trends in Advanced Semiconductor Manufacturing Processes and Miniaturization Technologies Amidst the calls for the limits of Moore's Law, how far will the development of miniaturization technologies continue? A comprehensive book covering the latest technologies in the "front-end" of advanced semiconductor manufacturing, where new structures and materials are being applied. Key Points of This Book: - Latest trends in EUV lithography and technical challenges related to resists, masks, and light sources. - Development history and future challenges of metal resists that break conventional wisdom. - Recent development cases of atomic layer processes (ALD, ALE) that are rapidly gaining momentum in research and development. - Latest trends in nanoimprint systems aimed at mass production applications for next-generation semiconductor memory devices. - Latest trends in film deposition technologies and process optimization in semiconductor multilayer wiring. - Cleaning performance required for advanced semiconductor manufacturing, the reality of contamination, and the latest cleaning technologies. - Latest technologies and process control for high aspect ratio etching that enables the miniaturization of integrated circuits. - CMP processes and consumable materials that respond to advancements in miniaturization and new materials, along with required performance for post-cleaning.
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■ Table of Contents Chapter 1: Polishing and Processing Technologies for Semiconductor Wafers and Ion Implantation Chapter 2: Trends in Film Formation Technology and Production of High-Quality Thin Films Chapter 3: Trends in the Development of Resist Materials and Coating and Removal Technologies Chapter 4: Trends in the Development of Next-Generation Lithography Technologies and Miniaturization Techniques Chapter 5: Trends in the Development of Dry Etching Technologies and Process Control Chapter 6: Trends in the Development of Wet Etching Technologies Chapter 7: Trends in the Development of CMP Processes and Analysis and Evaluation Techniques Chapter 8: Cleaning Technologies for Semiconductors, Mechanisms, and Analysis and Evaluation Techniques －－－－－－－－－－－－－－－－－－－－－ ● Publication Date: September 29, 2023 ● Format: A4, 630 pages ● Authors: 58 individuals ● ISBN: 978-4-86104-982-8 －－－－－－－－－－－－－－－－－－－－－
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