T-Global high thermal conductivity sheet thermal conductivity 12.5 W/m·K

An ultra-soft thermal conduction sheet that achieves excellent thermal conductivity. It fills the gaps of fine unevenness and efficiently conducts heat.

It is used by placing it between the heat-generating components (such as CPU and GPU) and the heat-dissipating components (such as heat sinks). It is the optimal size for a computer's CPU. 【Features】 ● It efficiently conducts heat, demonstrating high heat dissipation performance. ● It has excellent insulation properties and is a flexible thermal conductive material. ● Being a soft material, it adheres closely to uneven surfaces, preventing the formation of air layers. ● Unlike thermal grease, it is applied by sticking rather than spreading, making the process easier. ● It can be easily cut with scissors or a cutter, allowing for precise size adjustments. ● RoHS compliant product. *Please handle this product with care as it is made of a soft material. For installation, remove one side of the protective sheet and stick the exposed side onto the substrate. After sticking, remove the protective sheet from the other side. This method allows for relatively smooth application.

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