T-Global high thermal conductivity sheet thermal conductivity 4.5 W/m·K

An ultra-soft thermal conduction sheet that achieves excellent thermal conductivity. It fills in the gaps of fine unevenness and efficiently conducts heat.

It is used by placing it between the heat-generating components (such as CPU, GPU, etc.) and the heat-dissipating components (such as heat sinks). It is the optimal size for a computer's CPU. 【Features】 ● It efficiently conducts heat, demonstrating high heat dissipation performance. ● It has excellent insulation properties and is a flexible thermal conductive material. ● Being a soft material, it adheres closely to uneven surfaces, preventing the formation of air layers. ● Unlike thermal grease, it is a matter of sticking rather than applying, making the process easy. ● It can be easily cut with scissors or a cutter, allowing for precise size adjustments. ● RoHS compliant. *Please handle this product with care as it is made of a soft material. For installation, remove one side of the protective sheet and stick the exposed side to the substrate. After sticking, remove the protective sheet from the other side. This method allows for relatively smooth application.

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