Eliminating customer hassle! We will respond meticulously to various parts procurement needs!
We would like to introduce our "Parts Arrangement" services, which include the procurement of electronic components. For electronic component procurement, we source parts from both domestic and overseas manufacturers. With a wide range of procurement routes, we can respond to short delivery times. In addition to electronic components, we also handle the procurement of various materials such as mechanical parts, wire materials, and resin processed products, and we maintain standard stock of resistors, capacitors, and other components. 【Features】 ■ Procurement of electronic components - Procurement of parts from domestic and overseas manufacturers - Establishment of procurement routes tailored to the project requirements - Quick response capabilities through a wide procurement network - Management of traceability *For more details, please refer to the PDF document or feel free to contact us.
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basic information
【Other Features】 ■ Supports procurement of various components, including mechanical parts, wire materials, and resin processed products. ■ Maintains standard in-house components in stock. ・Holds standard inventory of resistors, capacitors, etc. (sizes 1005 to 2012). ・Also builds standard components for ICs, with information available during component selection. ・Can reduce surplus inventory during prototyping and small lot production. *For more details, please refer to the PDF document or feel free to contact us.
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For more details, please refer to the PDF document or feel free to contact us.
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Company information
Hano Manufacturing Co., Ltd. has manufacturing facilities capable of in-house integrated production of printed circuit boards, focusing on small-batch production of various types. We handle the design and manufacturing of high-density, multi-layer printed circuit boards, as well as the development of electronic products, assembly, and performance testing. We also design and produce various nameplates, film sheets, and panel casing processing that correspond to the exterior of electronic devices, aiming for comprehensive coordination in electronic device development.
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