Detecting defects in implemented circuit boards with ultra-high-speed inspection. An evolved in-circuit tester.

basic information

To ensure that electronic devices function correctly, the electronic circuit board within the device must operate normally. The electronic circuit board becomes operational when electronic components are correctly mounted on the printed circuit board (substrate) and power is supplied. The process of contacting a specialized probe to the electronic circuit board, which has electronic components mounted on it, and applying minute electrical signals for inspection is called In-Circuit Testing (ICT), and the device used for this inspection is referred to as an In-Circuit Tester. This method allows for the inspection of "connection reliability between electronic components and the substrate," "the constants of individual mounted electronic components (such as resistors and capacitors)," and "diode polarity," without imposing unnecessary loads on the substrate itself. It is also known as MDA (Manufacturing Defect Analyzer). Main inspection contents: ● Solder shorts and opens ● Pattern disconnections ● Missing components ● Incorrect component values ● Reverse insertion of polarized components ● Lifted leads of ICs and connectors ● Operation verification of digital transistors, optocouplers, and Zener diodes ● Other simple function tests

Price range

Delivery Time

Applications/Examples of results

【Adopted Industries】 　EMS, EMDS companies 　Semiconductor manufacturing equipment 　Communication infrastructure and servers 　Automotive, aircraft, and marine 　Medical devices 　Industrial machinery and robots 　FA machine tools 　Power generation and power systems 【Use Cases】 ■ Inspection of mass-produced products 　Connected to loaders/unloaders for automated/unmanned inspection even in large lots ■ Inspection of multi-variety small quantity substrates 　No need for dedicated jig manufacturing costs; easy identification of defective areas ■ Inspection of prototype substrates 　Function tests responsive to design changes (applying voltage to the substrate to confirm circuit operation (ON/OFF) and measuring direct current) ■ Implementation confirmation inspection during model switching 　Verification of the mounting program for the first lot and checking for setup errors during model changes ■ Defect analysis inspection 　Inspection of substrates that failed functional tests and defect analysis of substrates that failed in the market We have a proven track record of being utilized in various other applications as well. For more details, please contact your sales representative.

Detailed information

• 

  【Vertical Probe System】 By adding a vertical probe to the standard inclined probe, it becomes possible to make contact with points between tall components, as well as vias, through-holes, and upward connectors, which were previously inaccessible, thereby enhancing defect detection capabilities. Furthermore, with the addition of a dual Z-axis option that automatically switches between two different vertical probes, manual probe replacement is no longer necessary, allowing for more efficient inspections.

• 

  【Inline Model】 By collaborating with loaders, unloaders, and inversion machines, it enables automatic and unmanned inspections in mass production processes. Additionally, when used in conjunction with other companies' 3D AOI (automated optical inspection machines), the flying probe tester can handle inspections of microbridges and other issues that cannot be detected by AOI, effectively utilizing the unique features of each system to eliminate false reports and improve inspection capabilities and speed.

• 

  【IC Solder Joint Inspection】 Equipped with a system that uses a uniquely developed sensor probe to rapidly detect issues such as lifted leads in BGA, QFP, SOJ, and solder defects. It can electrically detect lifted leads of narrow pitch ICs and lifted balls in BGA without damaging the IC itself.

• 

  【LED Emission Inspection Using a Color Sensor】 By illuminating the LED and using a uniquely developed color sensor, we can perform stable inspections with clear judgment criteria based on numerical comparisons. Visual inspections of LEDs can lead to variability due to the inspector's subjective assessment and raise concerns about potential damage to the operator's eyes; however, with this measurement method, such issues do not arise. Additionally, there is no need for the hassle or cost of creating dedicated fixtures.