Software for coupled analysis of magnetic fields and heat conduction using the finite element method, performing static analysis and transient response analysis.
This is a software for coupled analysis of magnetic fields/magnetic fields and heat conduction using the finite element method, capable of performing static analysis and transient response analysis. It can handle three-dimensional, two-dimensional, and axisymmetric problems. ■□■Features■□■ ■Since it is integrated with the PHOTO series dedicated pre- and post-processing, data creation, analysis, and result processing can be performed as a series of operations. ■A groundbreaking speedup has been achieved through the combined use of edge element method and ICCG method (dozens of times faster than conventional finite element methods). ■The use of finite element method ensures stable solutions, making it safe for beginners to use. ■Since EDDY (magnetic field analysis module) and THERMO (heat conduction module) are integrated, the transfer of heat generation density is automatically executed without the need for files. ■It is also possible to use EDDY and THERMO independently.
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basic information
■ It is possible to conduct analyses that consider the temperature dependence of relative permeability and electrical conductivity at each time step in thermal conduction analysis. (Strong coupling) ■ Since we can consider eddy currents caused by induced electromotive force, we can address issues that could not be handled in frequency response analysis. ■ Linear, nonlinear, anisotropic, and hysteresis models of permeability can be considered. ■ Analyses considering linear and anisotropic electrical conductivity can be performed. ■ The temperature dependence of permeability and electrical conductivity can be taken into account. (3D) ■ Nonlinear analysis with temperature-dependent thermal conductivity and specific heat can be performed. ■ Electromagnetic forces acting on magnetic materials and currents are calculated using Maxwell's stress, Lorentz force, and nodal force methods. ■ The slide interface allows for the handling of mutually moving objects. ■ Analyses that consider eddy currents generated in conductors within a varying magnetic field can be performed. ■ The influence of the skin effect on primary side current can be considered. ■ The external field function allows for easy movement of magnets and coils. ■ Analysis of superconductors can be performed. A highly flexible input for superconducting properties is available (when using user subroutines). ■ The skin layer creation function allows for easy creation of skin meshes.
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Applications/Examples of results
■□■Applicable Fields■□■ Fields where simulation of phenomena involving eddy currents is necessary. Linear motors, magnetic heads, non-destructive testing (eddy current testing), induction heating, free electron lasers, induction machines, RFID-related applications, superconductors, etc.
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At Photon, we are developing "electromagnetic field analysis software" that models and simulates products and components utilizing electromagnetic phenomena on computers. In traditional design and development environments, the process has primarily revolved around trial and error through prototypes based on the experience of engineers and experiments with those prototypes. However, conducting experiments with actual prototypes and analyzing the results requires significant time and cost. Moving forward, transitioning from an experimental and prototype-based approach to an analysis-based design is a critical issue for improving productivity, and establishing simulation technology as the core of analysis-based design techniques is a challenge. In this context, Photon is developing and providing "analysis software" focusing on electromagnetic fields, as well as heat, vibration, and sound fields. By utilizing Photon’s software, efficient development and design of various industrial products can be achieved. In this way, Photon aims to reduce the number of prototypes and development costs, shorten development periods in the manufacturing sites of our users, and ultimately support the enhancement of our users' competitiveness.