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  6. High-frequency compatible flexible substrate (MPI specifications)

High-frequency compatible flexible substrate (MPI specifications)

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last updated:Apr 23, 2024

太洋テクノレックス 本社 和歌山
太洋テクノレックス 本社 和歌山
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Supports low transmission loss and impedance matching! There are various applications such as mobile electronic devices and IoT devices.

The "High-Frequency Compatible FPC (MPI Specification)" is a product designed to support low transmission loss and impedance matching. 〇 It has excellent heat resistance and can accommodate solder mounting and bonding. 〇 It allows for high flexibility in processing, similar to standard polyimide. ● FPC high-frequency analysis service (optional) It can be used for various applications. 【Examples of Applications】 ■ Mobile electronic devices such as smartphones ■ Optical communication modules ■ IoT devices ■ Video equipment (4K/8K) ■ Other alternatives to coaxial cables #Flexible #FPC #FlexibleCircuitBoard #FlexiblePrintedCircuitBoard #CircuitBoard #PrintedCircuitBoard #HighFrequency #Impedance #ShortLeadTime #MassProduction

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高周波MPI.png

High-frequency compatible flexible substrate (MPI specifications)

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高周波MPI.png

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*Field beer cross-section photo*

【TAIYO】FPC Manufacturing Technology: "Notice Regarding the Development of All-Polyimide Build-Up Substrates"

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We are pleased to announce that we have established core filled via technology for the development of build-up substrates using polyimide as the insulating layer, aimed at miniaturization, thinning, and lightweighting of multilayer substrates in our main business, the electronic substrate business. In electronic devices, which are becoming lighter, more compact, and more functional, substrates (build-up substrates) capable of high-density wiring and high-density mounting are in demand. However, typically, rigid boards are used for the core layer of build-up substrates, which increases the thickness of the substrate and hinders the lightweight and compact design of electronic devices. The filled via technology we have established involves filling holes (vias) opened with a laser in flexible printed circuit boards (FPC) with polyimide as the insulating layer with copper, and flattening the surface of the filled areas. By using this FPC as the core layer or outer layer of build-up substrates, it becomes possible to achieve both high-density wiring and high-density mounting while maintaining thinness. We plan to start providing build-up substrates using this technology within the fiscal year 2022, and furthermore, by applying this technology to our strength in high-frequency compatible FPCs, we will respond to the demand for miniaturization of communication devices.

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太洋テクノレックス

太洋テクノレックス 本社 和歌山

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Taiyo TechnoRex Co., Ltd. continues to operate in the fields of prototype development of flexible printed circuit boards (FPC) and printed circuit board testing systems. Since FPC is fundamentally related to the structure of hardware, both high precision quality and shortened development time are required. We have extensive experience and know-how in the manufacturing processes of single-sided FPC, double-sided FPC, multilayer FPC, and their advanced variants, and we continuously improve and enhance our technology, resulting in consistent evaluations of our delivery times and quality. Additionally, while we are advancing further miniaturization and high density technically, we are also undertaking new initiatives such as bump-type and electroplating with special materials. On the other hand, our printed circuit board testing systems mainly consist of electrical inspection systems and final appearance inspection systems, which are adopted in mass production sites for FPC and package/module-type substrates. They operate day and night in quality control settings for substrates used in smartphones, automotive applications, and various electronic devices. We will continue to respond to the increasingly diverse market needs in the future. *On December 21, 2023, the company name was changed from "Taiyo Kogyo Co., Ltd." to "Taiyo TechnoRex Co., Ltd."*

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