Optimal for high-temperature lead-free solder materials! Achieved mass production of gold-tin alloy plating, reducing wafer loss costs!
Gold-tin alloy plating shows a eutectic point with a composition of gold 80: tin 20, and a melting point of 280°C. 【Points】 - Gold-tin alloy plating does not subject the wafer to high temperatures during the process, preventing thermal degradation. - It can accommodate control of film thickness, allowing for thin film formation (with a proven cost reduction of 33%). - The alloy ratio can be changed arbitrarily, resulting in a wide range of coating compositions (with proven results of Au 70-90 wt%). - Plating on fine patterns is possible. - It has good oxidation resistance and solderability, enabling high-reliability bonding. - There are few voids and impurities, and since no flux is needed, cleaning after reflow is unnecessary. We welcome any questions or consultations. Please feel free to contact us.
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basic information
Gold-tin alloy plating shows a eutectic point with a composition of gold 80: tin 20, and a melting point of 280°C. The gold-tin alloy plating developed by Mitsuya allows for control of a uniform eutectic composition in the plating film. It enables high-reliability bonding due to the ability to join at high temperatures. As noted in the points above, it generates many advantages.
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Applications/Examples of results
【Application】Semiconductors, Electrical and Electronic - Sensors 【Problems Solved】Good soldering and bonding properties, high conductivity, low contact resistance, cost reduction 【Achievements in Solutions】 Customer Issue: When fusing gold-tin foil to the wafer, the high temperatures during the fusing process caused thermal degradation of the wafer, resulting in wafer loss costs. Despite inquiries to numerous plating manufacturers, there was no company capable of mass-producing gold-tin alloy plating, leading to difficulties. ⇒ Achieved mass production of gold-tin alloy plating! Reduced wafer loss costs by over 10 million yen per year! There were also many inquiries from overseas.
Detailed information
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Gold-tin alloy plating: Plating on fine patterns
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Company information
Mitsuya is a company that specializes in metal surface treatment and plating, founded in 1931. We focus not only on general plating but also on plating for difficult materials, offering around 90 types of plating solutions. Currently, plating has become an essential part of advanced technologies such as IT, electronic devices, ubiquitous computing, next-generation energy, next-generation motorization, and environmental technology. In this context, Mitsuya Co., Ltd. responds to customer needs with a spirit of "let's give it a try" to meet stringent requirements, earning a reputation for being the go-to solution provider, especially among electronic and electrical equipment manufacturers and automotive and transportation equipment manufacturers. We will propose the most suitable plating technology based on your consultation needs. We also accommodate small-scale prototypes starting from just one piece, so please feel free to contact us for any inquiries, no matter how trivial.
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