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Book Title: Latest Technologies for Optimal Design of Compatibility and Dispersion Conditions in Polymer Alloys/Blends, Evaluation and Applications --- ★ "Strength and Lightweight," "Heat Resistance and Transparency," "Hardness and Flexibility with Molding Speed" ... Tips for Overcoming "Trade-offs" in Heterogeneous Polymer Composites --- ■ Key Points of This Book ★ Mechanisms of Alloys/Blends and Control of Molecular Structure - Concept of Phase Separation Structure - Differentiation between Compatible and Incompatible - Contributions of Polymer Viscoelasticity, SP Values, etc. to Compatibility - Types of "Compatibilizers" and Their Usage ★ Manufacturing Technologies, Quality Evaluation, and New Initiatives - Twin-screw Extrusion Mixing, Equipment for Reactive Processes, and Prevention of Dispersion Variability - Functional Evaluation through Various Analytical Instruments, Visualization of Alloys - Utilization of MI, AI, Experimental Design Methods, and Computational Chemistry in Alloys/Blends ★ Functional Enhancement and Its Applications - High Strength (Automobiles, Aircraft, Construction, Various Casings, etc.) - Thermal, Optical, and Electrical Properties (Electronic Devices, Displays, Medical Applications, etc.) - Functional Supplementation of Biodegradable Resins and Biopolymers
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■Table of Contents (Excerpt) Chapter 1: Overview Chapter 2: Nanopolymer Alloys, Compatibility Control Chapter 3: Improvement of Compatibility, Compatibilizers Chapter 4: Immiscible Polymer Blends Chapter 5: Mixing and Dispersion Processes Chapter 6: Control of Low Warpage, Impact Resistance, Mechanical Properties Chapter 7: Control of Heat Resistance, Thermal Properties Chapter 8: Control of Electrical Properties, Optical Properties Chapter 9: Control of Wettability, Coating Adhesion, and Viscoelasticity Chapter 10: Plant-Derived Materials, Bioplastics Chapter 11: Evaluation of Composition, Structure, and Physical Properties Chapter 12: Applications of Materials Informatics Chapter 13: Patent Trends －－－－－－－－－－－－－－－－－－－－－－－－－－ ●Publication Date: November 30, 2020 ●Authors: 53 ●Format: A4, 666 pages Hardcover Edition: Price: 88,000 yen (tax included) ISBN: 978-4-86104-813-5 ↓↓ The hardcover edition is out of print ↓↓ On-Demand Edition Available Price: 44,000 yen (tax included) ISBN: 978-4-86104-964-4 After receiving your order, we will perform simple printing and binding. －－－－－－－－－－－－－－－－－－－－－－－－－－
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The Technical Information Association works to shape information for engineers and researchers. We research what kind of information engineers and researchers active in fields such as "research and development," "materials," "electronics," and "pharmaceuticals/medical devices" need, and create products such as seminars, books, and distance learning courses!