Cost reduction examples in transportation, packaging, and logistics: In-process trays for circuit board manufacturing.
Many achievements in the Tohoku region! Achieving prevention of lateral displacement during transportation! We will introduce examples of cushioning design.
We will introduce a case study of a cushioning design for an internal transport tray in substrate engineering. In this case, we received product data from the customer and designed it to fit the product shape, achieving prevention of lateral displacement during transport. Additionally, since it serves as the base for electronic components, it is designed with reliefs to ensure that the surface does not come into contact with packaging materials, which is also a key point. 【Case Study Overview】 ■ By Application: Cushioning/Protection/Storage/Process ■ By Industry: Electronics/Precision Equipment/Semiconductors ■ By Material Function: Logistics Efficiency ■ Classification List by Packaging Name: Precision Equipment/Working Machines/Tools ■ By Packaging Material: Foam Materials/Cardboard ■ By Purpose: To Protect Products *For more details, please refer to the PDF document or feel free to contact us.
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Whether it is [one-way] or [commuting], whether cushioning is necessary, and the effects related to static electricity... the optimal materials vary depending on the contents. We will propose improvements to the packaging format for the 2024 issue. Tohoku Ueno Co., Ltd. will utilize the many packaging examples we have cultivated so far, along with various new materials developed in recent years to address environmental issues, to offer the best combination. We will consider all aspects, including cost, material selection, processing methods, and environmental factors, to meet our customers' needs. We will conduct drop tests using the drop test machine from Ransomont, analyze the shock waveforms with test partners, and propose the optimal cushioning packaging design.