Specialized Book: Guidelines for the Design and Development of Components, Materials, and Devices for 5G Compatibility
What can be addressed from the perspective of material and component design in preparation for the upcoming 5G era? An explanation of the key points required during the design and development phase, along with examples from companies.
**Market Trends and Key Points to Watch for 5G-Related Services and Devices** ● What changes are expected with the 5G transformation of base stations, smartphones, and other devices? Trends in the market and directions toward practical implementation. **Key Technological Elements Driving the Expansion of 5G** ● "Consideration of Semiconductor Speedup": A key technology for 5G! Explanation of the thinning of connection circuits and encapsulation technology, which are important factors for speedup. 〇 "Massive MIMO": A key technology for communication systems! Technical challenges for hardware realization and proposals for specific configurations. ● "High-Speed Compatible FPC": Methods and material selection for high-speed transmission. 〇 "5G Antennas": Structure, design examples, and essential points for arraying millimeter-wave planar array antennas. ● Concerns about smartphones in the 5G era: Required characteristics for enclosures and antenna materials, with a breakdown of two 5G-compatible products to explain design points! **Guidelines Required for Designing 5G-Compatible Materials, Development/Applications/Assessment Methods** ● Types and characteristics of low-loss materials. Summary of major handling companies and price information. ○ Material characteristics required in high-frequency environments and the reasons for them, along with key points during design and development. **Approaches to Applying Existing Materials and Technologies to 5G** Development of curing agents, electromagnetic wave shielding coatings, high-strength dissimilar joining technologies, etc.
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Publication Date: September 17, 2019 Price: 50,000 yen + tax Format: B5 size, 213 pages ISBN: 978-4-86502-175-2 Chapter 1: Trends in New Technologies/Services and Material-Related Markets for 5G Chapter 2: Key Technological Elements Driving the Expansion of 5G ~Packaging Technology, Communication, Material Design, Compatible Devices Chapter 3: Design Technologies and Evaluation Methods for Millimeter Wave Absorbers and Electromagnetic Shielding Materials Required for 5G Chapter 4: Approaches to Utilize Existing Material Technologies for 5G Chapter 5: Evaluation Methods for Electrical Properties in High-Frequency Materials ~Dielectrics, Shielding Materials, Electromagnetic Absorbing Materials
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List price: 50,000 yen + tax
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List of Authors (Honorifics omitted) - Kotaro Fukushima (Kawasaki Techno Research Co., Ltd.) - Shigeru Koshibe (iPack Co., Ltd.) - Minso Kashio (Formalhaut Techno Solutions, Inc.) - Kentaro Nishimori (Niigata University) - Fukuro Koshichi (Tokyo University of the Arts) - Hirofumi Matsumoto (Nippon Mectron Co., Ltd.) - Hiroyuki Fukunaga (Shinko Photo Service Co., Ltd.) - Kaoru Sudo (Murata Manufacturing Co., Ltd.) - Tomoya Hosoda (AGC Inc.) - Takashi Tasaki (Arakawa Chemical Industries, Ltd.) - Masayuki Hoden (Nitto Denko Corporation) - Takashi Yamamoto (National Defense Medical College) - Masaaki Tomikawa (Toray Industries, Inc.) - Kazuro Arita (DIC Corporation) - Takeshi Suga (Fujikura Kasei Co., Ltd.) - Yoshiko Nakamura (National Institute of Advanced Industrial Science and Technology) - Tetsuo Tsuchiya (National Institute of Advanced Industrial Science and Technology) - Yosuke Suzuki (Keycom Corporation)
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The information organization aims to contribute to industry development through technology seminars in fields such as chemistry, pharmaceuticals, electronics, machinery, environment, cosmetics, and food, as well as the publication of technical books, correspondence education courses, and DVDs that record seminars.