Achieving a minimum cutting width of 60μm! A 3D fiber laser processing machine capable of flat processing thanks to a flat processing table.
The SCF5113 model is a 3D fiber laser processing machine that adds a high-precision three-dimensional drive axis for ultra-precision machining. It features a high-speed moving table that operates at 50 meters per minute. The all-in-one structure, which incorporates the oscillator and CNC device, achieves a space-saving design. By adopting offline teaching (optional), setup time can be significantly reduced. 【Features】 ■ Achieves a minimum cutting width of 60μm (when equipped with SFX500) ■ Utilizes a high-speed moving table operating at 50 meters per minute ■ All-in-one structure with built-in oscillator and CNC device ■ Capable of flat processing with a flat processing table ■ Significant reduction in setup time through the adoption of offline teaching ■ Additional non-contact guiding axis can be added *For more details, please refer to the related links or feel free to contact us.
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【Specifications (Partial)】 ■ Equipped Oscillator: SFX500 ■ Rated Output: 500W ■ Processing Range: 800(X)×500(Y)×300(Z)mm ■ Rapid Feed Rate: 50m/min ■ Number of Control Axes: 5 axes (X, Y, Z, A, C) + W (optional) ■ Drive Method: AC Servo Motor ■ Minimum Input Unit: 0.001mm *For more details, please refer to the related links or feel free to contact us.
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For more details, please refer to the related links or feel free to contact us.
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Model number | overview |
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SCF5113/SFX500 | Rated output 500W 3D processing range 800×500×200mm |
SCF5113/SFX1000B | Rated output 1000W 3D processing range 800×500×200mm |
SCF5113/SFX2000B | Rated output 2000W 3D processing range 800×500×200mm |
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Our company is headquartered in Kanazawa City, Ishikawa Prefecture, and has sales offices and factories both within and outside the prefecture. We focus on the bottling business, which involves filling beverages and other products, and we are expanding into various fields such as solid-liquid mixing and dispersion systems, laser processing machines (including fiber lasers and CO2 lasers), and semiconductor assembly equipment (taping machines, multifunctional test handlers, ball mount machines, bonders, etc.). Please feel free to contact us if you have any inquiries.