[Free comprehensive catalog available!] Board-to-board (FPC) connectors
P/N 20842-0**E-21 (Plug) / 20843-0**E-21 (Receptacle)
The substrate-to-substrate (FPC) connector with a mating height of 1.5 mm has achieved high retention force and a clear click feel through its dedicated design.
The design incorporates a metal hold-down to enhance the rigidity of the connector while also featuring a mechanism to prevent partial mating. Additionally, wiring space has been secured at the bottom of the connector, increasing the flexibility of circuit design. The product design allows for visual confirmation of the mating state (when the receptacle is mounted on the FPC).
Inquire About This Product
basic information
Pitch: 0.35 mm Height: 1.5 mm (max. 1.56 mm) Width: 2.66 + (0.35 * number of pins / 2) mm Depth: 2.8 mm Number of poles variation: 10 - 50 Please check the "lineup" for the number of poles and product numbers. Rated current: 0.3 A/pin (Signal pin) 3.0 A/pin x2 (power pin)
Price range
Delivery Time
Applications/Examples of results
Small electronic devices such as notebook PCs, digital cameras, and smartphones.
Detailed information
-
Visual confirmation of the mating condition When the receptacle is implemented on the FPC, the mating condition with the plug can be confirmed through a small window.
Line up(4)
Model number | overview |
---|---|
20842-010E-21 / 20843-010E-21 | |
20842-030E-21 / 20843-030E-21 | |
20842-040E-21 / 20843-040E-21 | |
20842-050E-21 / 20843-050E-21 |
catalog(1)
Download All CatalogsCompany information
I-PEX is a "manufacturing solution expert" that provides value in the form of inspiration and surprise in the global market. Founded in 1963 as "Daiichi Seiko," a precision mold manufacturer in Kyoto, I-PEX has engaged in challenging manufacturing through the refinement of technology centered on in-house production of molds and manufacturing equipment, resulting in numerous world-first and unique products and solutions. Under the I-PEX brand, we develop, manufacture, and sell connectors, sensors, semiconductor manufacturing equipment, and also engage in contract manufacturing of automotive parts, precision molded products, and various manufacturing equipment to supply to the market. The image of the company building is the exterior of our headquarters in Kyoto.