Uniform thermal conductivity! Ultra-low density paper that pursues cushioning properties.
"Low-density paper (cushion paper)" is a thick paper with low density (0.50g/cm3) and high cushioning properties. It has uniform thermal conductivity and allows for a reduction in the number of layers compared to craft paper types, thereby reducing the hassle of stacking and waste. There are examples of its use in laminated press for double-sided and multi-sided printed circuit boards, as well as industrial process paper. [Features] ■ Low density (0.50g/cm3) with high cushioning properties ■ Uniform thermal conductivity ■ Corrosion resistance ■ Reduction in the number of layers possible *For more details, please refer to the PDF document or feel free to contact us.
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basic information
【Lineup】 ■ Cushion: Basic type ■ Cushion Paper N: Low-density type, made with mechanical pulp ■ Cushion Paper LS: Neutral type with reduced sulfur content *For more details, please refer to the PDF document or feel free to contact us.
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Applications/Examples of results
【Case Studies】 ■ For laminated pressing of double-sided and multi-layer printed circuit boards ■ For laminated pressing of PVC resin for ATM cards, etc. ■ Sterilization indicators ■ Other industrial process papers, etc. *For more details, please refer to the PDF document or feel free to contact us.
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Here, technology and craftsmanship that expand possibilities are present. A history and track record of creating high added value. "Paper," which has supported important information culture. With the changes of the times, the concept of "paper" has also broadened, and it is now being asked to provide new functions in various industrial fields. As part of the Daio Paper Group, we at Daio Paper have been pursuing the possibilities of manufacturing special paperboard in the paper-producing region of Fuji. Leveraging our technology and development capabilities backed by a solid track record, as well as the latest equipment, we strive to create high added value products that meet customer needs.
