The substrate surface is a full flat design without steps! It is a substrate compatible with flip chip LED mounting!
The "FLIP CHIP LED PWB" is a product of Shirato Printed Circuit Board Manufacturing Co., Ltd., which engages in the manufacturing of various printed circuit boards, circuit design for printed circuit boards, and assembly of electronic components. The surface of the substrate is designed to be fully flat without any steps, and it supports copper foil thicknesses starting from 105μm. The heat dissipation material can be selected from aluminum or copper. 【Features】 ■ Weather-resistant white ink with a reflectivity of over 95% (in the visible light range) ■ Copper foil thickness supports from 105μm ■ Conductors are designed with half-etching specifications for heat dissipation and high current handling ■ Insulation layer thermal conductivity supports over 5W ■ Heat dissipation material can be selected from aluminum or copper *For more details, please request documentation or view the PDF data available for download.
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Our company is a specialized manufacturer of printed circuit boards, engaged in the development and production of a diverse range of printed circuit boards for over 50 years since our founding in 1963. In addition to handling general substrates such as single-sided, double-sided, and multilayer boards, we have a wealth of experience in prototyping and mass production of high thermal conductivity metal substrates, thick copper metal substrates, high-frequency compatible substrates, ultraviolet compatible substrates, and deep ultraviolet compatible substrates. If you have any challenges related to substrates, please feel free to leave it to Shirato Printed Circuit Manufacturing.