Introduction to the underfood cooling module and analysis of the liquid flow circuit.
"GT-SUITE" is a tool for modeling vehicle cooling systems, applicable to liquid circuits that remove heat from various components such as engines and transmissions, as well as under-hood cooling modules that dissipate heat to the atmosphere. It also includes a 3D preprocessing tool that allows for the efficient creation of liquid flow circuit models directly from 3D CAD data. This approach enables more accurate predictions of pressure losses at various branching points in the system based on geometry. 【Features】 ■ 3D tool for automatic meshing of under-hood heat exchangers, fans, and air spaces ■ Pseudo-3D Navier-Stokes-based approach for under-hood cooling modules, handling uneven flow and temperature distribution ■ 3D tool for characterizing liquid flow circuits from CAD data ■ Thermal effects included in liquid flow analysis, with the possibility of zero flow conditions *For more details, please refer to the PDF materials or feel free to contact us.
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【Other Features】 ■ Single component model for verification and optimization ■ Layout of cooling modules corresponding to specified installation space, component size settings ■ Key components of cooling modules selected by suppliers ■ Steady operating points and unsteady operating cycles ■ Analysis of the effects of structural elements on airflow *For more details, please refer to the PDF document or feel free to contact us.
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For more details, please refer to the PDF document or feel free to contact us.
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While focusing on MBD and CAE technologies and their surrounding technical areas, we specialize in building virtual products and collaborative design processes through cutting-edge digital engineering. We form partnerships with leading-edge software vendors of the era, providing a comprehensive engineering environment necessary to solve our customers' increasingly diverse and complex challenges using top-level domestic digital engineering technologies, including thermal fluid analysis, structural analysis, electromagnetic field analysis, acoustic analysis, system simulation, optimization technologies, embedded software development environments, and simulation process data management (SPDM) solutions.