Compatible with 6-inch and 8-inch wafers! Plasma treatment device using a parallel plate method.
The WLP600S is a plasma processing device using a parallel plate method. It supports 6-inch and 8-inch wafers, achieving low cost and space-saving design. You can switch between two types of plasma modes, DP (Direct Plasma) mode and RIE (Reactive Ion Etching) mode, using only the controls on the panel, making it suitable for various applications such as etching polyimide-based resins and surface modification of photoresists. 【Features】 ○ Easy plasma mode switching ○ High-speed responsiveness ○ Space-efficient footprint ○ Compatible with a wide variety of processes ○ Highly customizable For more details, please contact us or download the catalog.
Inquire About This Product
basic information
【Specifications】 ○ Processing Method: Parallel Plate Plasma Excitation Method (DP/RIE Switchable) ○ Processing Chamber: Made of AL (Single Chamber) ○ RF Power Supply: 600W 13.56MHz Auto Tuning ○ Processing Gases → O2: 1000 SCCM → CF4: 500 SCCM → One additional line can be added (Optional) ○ Purge Gas: N2 ○ Throughput: 3000 wafers / 400 hours (when etching polyimide film at 1μm) ○ Processing Steps: 3 Steps, 10 Recipes ○ Wafer Size: Compatible with 6-inch and 8-inch ○ Wafer Transport Method → Vertical Operation Cassette Elevator (Compatible with 6-inch and 8-inch) → Horizontal and Rotational Operation One-Finger Suction Clean Robot ○ Main Unit Dimensions: W600 × D1500 × H1850 ○ Main Unit Weight: 650 kg ● For more details, please contact us or download the catalog.
Price information
Please contact us.
Delivery Time
※Please contact us.
Applications/Examples of results
For more details, please contact us or download the catalog.
Company information
Esclaf Corporation is a company where experienced expert engineers shape our customers' requests and contribute to the progress and development of society through the supply of excellent products.