Reduction of Initial Costs for Printed Circuit Boards" - "Support for Small Lot Production of Flexible PCBs

You don't have to pay unnecessary initial costs! We have achieved coverlay processing and outline processing of flexible substrates using NC machines with our unique know-how.

At K2 Corporation, we have achieved coverlay processing and outline processing of flexible substrates using NC machines with our unique know-how. This enables shorter lead times and significant reductions in initial costs for flexible substrate manufacturing. The processing accuracy and surface finish, which were challenges with NC machine processing, are now comparable to that of mold processing. Typically, manufacturing flexible substrates requires molds or Thomson dies (Victoria dies) for coverlay and outline processing, regardless of the quantity. As a result, the lead times are longer and initial costs are significantly higher compared to standard rigid substrates due to the time and expense associated with molds. Our company uses NC machines for coverlay and outline processing without the need for molds, thereby reducing the time and costs required for mold creation. Of course, the processing accuracy and finished shapes are on par with those of mold processing. For more details, please contact us or download our catalog.

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