Ventilation analysis was conducted using numerical simulations within the electronic device enclosure.
In the thermal airflow analysis of electronic device enclosures, we conducted ventilation analysis through numerical simulations within the enclosures. With the improvement of technology, electronic components are increasingly shrinking, making thermal issues within electronic device enclosures unavoidable. The placement of high-heat-generating components and ventilation parts such as fans can significantly affect the performance of the devices themselves. We conducted the analysis to gain insights into this. For more details, please download the catalog.
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【Analysis】 - The shapes and positions of the frame, electronic components, fans, etc. inside the enclosure should be represented as faithfully as possible. - It is necessary to correctly input the surface area and other parameters in relation to the heat generation of each electronic component and heat source. - If not correctly input, the heat generation per unit area will differ from reality, leading to different characteristics of the calculated heat convection. - The total number of grids is 106 (X) × 84 (Y) × 46 (Z) = 409,584. - A small grid size is used to represent almost all major structures within the enclosure. 【Analysis Results】 - Inside the enclosure, there is a uniform airflow from the intake fan to the exhaust fan. - Heat from each heat-generating area is efficiently ventilated by this airflow. - Some areas are observed where heat affects non-heat-generating components. - This issue can be resolved by moving the installation position of non-heat-generating components closer to the intake fan. - It is important to create a uniform airflow inside the enclosure and to design the installation positions of heat-generating components along that airflow. ● For more details, please contact us or download the catalog.
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In environmental simulation, we are engaged in the independent development and sale of a three-dimensional fluid analysis program, as well as contract analysis services using this software. For over a decade, we have been involved in thermal fluid analysis in fields such as architecture, civil engineering, machinery, and electronics, handling numerous analyses and accumulating a wealth of know-how and knowledge. Our diverse analysis and visualization functions, honed through practical experience, have received high praise as CFD software from many companies and research institutions. ● Import function for BIM-compatible CAD data such as Revit and DXF ● Import function for geographic information system (GIS) data ● SuperCartesian function that freely represents diagonal boundaries and complex curved surfaces ● High-speed, high-precision radiation calculations and high-precision turbulence analysis using DNS ● Moving boundary problem analysis function that accommodates the movement of multiple objects in space ● User-friendly interface and easy-to-understand animation features Of course, we also provide software support and accept contract analyses. Focusing on air conditioning ventilation and wind environment analysis, we offer high cost-performance solutions for a wide range of problems, from simple and small-scale issues to complex and large-scale analyses. We look forward to your visit, along with our extensive analysis case studies.