We can accommodate various bump processing from just one piece, tailored to your specifications and budget.
Bumps are essential for various mounting technologies such as CSP, BGA, and flip chips. At Howa Sangyo Co., Ltd., we can accommodate various bump processing from just one piece, tailored to your specifications and budget. For the stud method (chip compatible only), we offer Au stud bumps in two wire diameters of 18μm and 25μm (you can choose based on bump height and diameter), and we can also handle 2-layer and 3-layer bump processing. In the plating method, we support electroplating with Au, Ni, Cu, Ag, Pt, as well as solder (eutectic and high melting point) and lead-free solder (Sn-Ag, Au-Sn), along with various electroless plating options. Furthermore, we can accommodate substrates made of glass, Si (silicon), and film. For more details, please contact us or refer to our catalog.
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basic information
【Features】 ○ We can accommodate various bump processing from just one piece, tailored to specifications and budget. ○ We can handle substrates such as glass, Si (silicon), and film. 【Support】 ［Stud Method (Chip only)］ ○ Au stud bump → Wire diameters of 18μm and 25μm available (can be selected based on bump height and diameter) → Support for 2-layer and 3-layer bump processing is also available. ［Plating Method］ ○ Electroplating → Au, Ni, Cu, Ag, Pt, etc. → Solder (eutectic, high melting point) → Lead-free solder (Sn-Ag, Au-Sn) → Various electroless plating options are also available. ● For more details, please contact us or refer to the catalog.
Price information
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Delivery Time
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Applications/Examples of results
【Usage】 ○ For IC implementation evaluation: TEG, membrane substrates, cantilevers, probe inspection substrates, etc. ● For more details, please contact us or refer to the catalog.
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Company information
In the future, as represented by MEMS, the research and development department will become indispensable in this industry, where higher precision and greater refinement are increasingly required. Our company will assist with prototyping and development using the know-how we have cultivated over many years. We look forward to inquiries from all industries, not just in the fields of electronics and optics.
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