It is possible to inspect a 300mm wafer in 4 seconds per side.
We will introduce the automatic appearance inspection case of "semiconductors" by Technos Corporation.
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basic information
【Features】 ◯ Capable of inspecting 300mm wafers in 4 seconds per side ◯ Stable detection of so-called marks ◯ Capable of inspecting cracks and chips on edge surfaces ◯ Supports not only smooth surfaces but also rough surfaces ● For more details, please contact us or refer to the catalog.
Price information
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Delivery Time
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Applications/Examples of results
Silicon wafers, dicing sheets, raw glass, polishing sheets, silicon wafer edges, etc.
Company information
We specialize in systems for visual inspection areas and pattern inspections where the target patterns share the same trend. We can conduct inspections of the exterior of automobile bodies and materials such as stainless steel, copper, and titanium, as well as inspections of glass, tiles, and materials like paper and film. Our systems can be installed on any line from materials to processes to products, allowing for exterior inspections. Tekunos has achieved performance that far exceeds visual inspection through our uniquely developed high-sensitivity electronic cameras for inline use and our proprietary supercomputer that performs 8.8 billion calculations per second. This enables us to replace visual inspections and periodic pattern inspections with a general-purpose system.