This product is a parallel plate type plasma treatment device.
This product is a parallel plate type plasma treatment device. With just the operation on the control panel, you can switch between two plasma modes: DP (Direct Plasma) mode and RIE (Reactive Ion Etching) mode, making it suitable for various process applications such as improving adhesion and sealing in die attach during assembly processes like BGA.
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basic information
【Specifications】 ○Processing Method: Parallel Plate Plasma Excitation Method (DP/RIE switchable) ○Processing Chamber: Made of Aluminum (A5052) ○Number of Stages: Standard 3 stages (Optional: can accommodate 1 additional stage) ○Chamber Dimensions: Width 500 × Depth 580 × Height 500 mm ○Stage Dimensions: Width 340 × Depth 420 mm ○RF Power Supply: 600 W, 13.56 MHz, Auto-tuning ○Processing Gases: O2, Ar (Optional: can add 1 line) ○Purge Gas: N2 (with slow line) ○Processing Steps: 10 recipes (3 steps) ○Vacuum Pump: Rotary Pump, 1300 L/min ○Main Unit Dimensions: Width 880 × Depth 880 × Height 1600 mm ○Main Unit Weight: Approximately 400 kg ●For other functions and details, please contact us.
Price information
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Delivery Time
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Applications/Examples of results
【Applications】 ○ Surface modification of plastic packages, hybrid ICs, etc. ○ Photoresist etching ○ Surface modification of fibers and polymer materials ● For other functions and details, please contact us.
Company information
Esclaf Corporation is a company where experienced expert engineers shape our customers' requests and contribute to the progress and development of society through the supply of excellent products.