A sequencer that is low-cost yet equipped with high performance, capable of managing various assembly conditions, offering excellent cost performance.
We have adopted a small power matching method, achieving faster plasma matching. By reducing the matching time, we have realized a decrease in charge-up damage to the device during plasma ignition. Additionally, we have achieved space-saving by using only the PUMP aside from the main unit.
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basic information
【Specifications】 ○ Processing Method: Coaxial Barrel Type ○ Processing Chamber: Cylindrical, Vertical, Quartz Chamber ○ RF Power Supply: 600–2000W, 13.56MHz, Auto-Tuning ○ Processing Gas: O2, 1 additional line can be added (optional) ○ Purge Gas: N2 ○ Processing Steps: 10 recipes (3 steps) + 10 heater recipes ○ Wafer Size ● For other functions and details, please contact us.
Price information
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Delivery Time
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Applications/Examples of results
【Applications】 ○ Ash removal with low damage (ashing) ○ Surface modification ○ Usable for various other process applications ● For other functions and details, please contact us.
Company information
Esclaf Corporation is a company where experienced expert engineers shape our customers' requests and contribute to the progress and development of society through the supply of excellent products.