(Free) Instron Web Seminar Series: Not Just Punching Tests. New Applications of the Drop Weight Impact Tester - Wedge Delamination Test & Tensile Impact Test

Instrumentation drop weight impact testing machine. It supports a wide range of tests from materials to components, including Charpy, Izod, punching, and CAI tests (compression after impact).

The 9400 series has been developed for customers at the forefront of high-quality advanced materials development, particularly laboratories engaged in the development of high-strength and lightweight products, to provide faster results, fewer errors, and lower costs associated with training. The 9400 series drop weight impact testers comply with all major impact testing standards ranging from 0.3J to 1800J. They feature simple operating procedures, pre-set test conditions and guided testing, streamlined data management, output for analytical data, and compatibility with high-speed cameras. With these features, Instron's 9400 series drop weight impact testers become simpler, smarter, and safer. *For more details, please download the PDF or contact us.*

• Non-destructive testing

High-speed camera shooting is possible! A drop weight impact testing machine that easily synchronizes video and load signals.

The "9400 Series" is a drop weight impact testing machine that can be used not only for punching but also for compression, three-point bending, and tensile-tensile impact testing. As the use of thermoplastics, composite materials, and metal alloys increases as high-performance materials for lightweighting in automotive, aerospace, and defense applications, the need to streamline the product development process and confirm the consistency between simulation and test results is extremely important. The weight is adjusted to maintain a constant strain rate and speed as much as possible throughout the elongation of the specimen during the impact event. 【Features】 ■ Capable of measuring high strain rates at impact speeds of up to 22 m/s ■ Tensile impact fixture test temperature range: -50 to +120°C (standard piezo sensor) ■ Transparent panels are placed around the test area, allowing for high-speed camera recording ■ Easy synchronization of video and load signals ■ DIC analysis to evaluate the longitudinal strain of the specimen after impact in a tensile impact state *For more details, please refer to the PDF document or feel free to contact us.

• Other measuring instruments
• Other Software

Examples of solutions to issues related to impact, such as dashboards and plastic storage containers!

This document introduces examples of how Instron solutions have led to the development and specification of final products and components across a wide range of industries and applications. By reading further, you will understand how we can assist in solving challenges related to real-world impacts specific to your customers. We encourage you to read it. [Content Overview (Partial)] ■ About Instron ■ Beyond Traditional Testing Methods ■ Impact Simulation: Energy, Shape, Environment ■ Instrumented Testing: Benefits of Information ■ Aerospace and Defense Testing *For more details, please refer to the PDF document or feel free to contact us.

• Other measuring instruments

Quickly generate data visualizations! Make shock testing simpler and smarter!

"BLUEHILL IMPACT" is powerful impact testing software equipped with the platform of our flagship software, Bluehill. Designed for touch panel operation, the large touch points on the screen allow for intuitive operation. It enables simpler and smarter testing more efficiently than ever before. Not only does it enhance the flexibility of the previous versions of Instron's impact testing software, but many advanced features have also been added. [Features] - Large touch points on the screen allow for intuitive operation - Enables efficient, simple, and smart testing - Pre-prepared standard testing methods - Real-time display of analog test force indicators that also show digital data - Advanced features such as more user-friendly test result reports and data output functions *For more details, please refer to the PDF materials or feel free to contact us.

• Other Software

We will be exhibiting at the "26th Business Fair" hosted by Seibu Shinkin Bank at the Triangle Plaza, Shinjuku Sumitomo Building on Thursday, October 15, 2026! This event is a corporate exhibition and matching event aimed at expanding business opportunities for small and medium-sized enterprises. Over 300 companies and organizations will participate, promoting their excellent technologies and products to one another.

Paper Logic will be exhibiting at the "AI × DX Solution Fair in Shinjuku," hosted by Otsuka Corporation, on October 20 (Tuesday) at Bellesalle Shinjuku Central Park. We have prepared exclusive and advantageous plans for Otsuka Corporation, so please come and visit us. In addition, we are scheduled to exhibit at several other events hosted by Otsuka Corporation in October! For information on other venues, please check the following note article: https://note.com/paperlogic/n/n106397301b05 *Please note that a Otsuka ID is required to register for any of the events.

Paper Logic will be exhibiting at the "Business IT Forum in OSAKA" hosted by Otsuka Corporation, which will be held on October 20 (Tuesday) and October 21 (Wednesday) at Umeda South Hall. We have prepared special plans exclusively for Otsuka Corporation, so we look forward to your visit. In addition, we plan to exhibit at several events hosted by Otsuka Corporation throughout October! For information on other venues, please check the following note article. https://note.com/paperlogic/n/n106397301b05 *Please note that a Otsuka ID is required to register for any of the events.

Paper Logic will be exhibiting at the "DX Innovation Fair 2026 in Tachikawa," hosted by Otsuka Corporation, on Thursday, October 22, at Hotel Nikko Tachikawa. We have prepared exclusive offers for Otsuka Corporation, so please come and visit us. In addition, we plan to exhibit at several other events hosted by Otsuka Corporation in October! For information about other venues, please check the following note article: https://note.com/paperlogic/n/n106397301b05 *Please note that a Otsuka ID is required to register for any of the events.

Paper Logic will be exhibiting at the "X・DX・Security Solution Fair 2026" hosted by Otsuka Shokai, which will be held on October 23 (Friday) at TODAHALL & CONFERENCE TOKYO. We have prepared special offers exclusively for Otsuka Shokai, so please come and visit us. In addition, we plan to participate in many events hosted by Otsuka Shokai throughout October! For information on other venues, please check the following note article. https://note.com/paperlogic/n/n106397301b05 *Please note that a Otsuka ID is required to register for any of the events.