(Free) Instron Web Seminar Series: Not Just Punching Tests. New Applications of the Drop Weight Impact Tester - Wedge Delamination Test & Tensile Impact Test

Instrumentation drop weight impact testing machine. It supports a wide range of tests from materials to components, including Charpy, Izod, punching, and CAI tests (compression after impact).

The 9400 series has been developed for customers at the forefront of high-quality advanced materials development, particularly laboratories engaged in the development of high-strength and lightweight products, to provide faster results, fewer errors, and lower costs associated with training. The 9400 series drop weight impact testers comply with all major impact testing standards ranging from 0.3J to 1800J. They feature simple operating procedures, pre-set test conditions and guided testing, streamlined data management, output for analytical data, and compatibility with high-speed cameras. With these features, Instron's 9400 series drop weight impact testers become simpler, smarter, and safer. *For more details, please download the PDF or contact us.*

• Non-destructive testing

High-speed camera shooting is possible! A drop weight impact testing machine that easily synchronizes video and load signals.

The "9400 Series" is a drop weight impact testing machine that can be used not only for punching but also for compression, three-point bending, and tensile-tensile impact testing. As the use of thermoplastics, composite materials, and metal alloys increases as high-performance materials for lightweighting in automotive, aerospace, and defense applications, the need to streamline the product development process and confirm the consistency between simulation and test results is extremely important. The weight is adjusted to maintain a constant strain rate and speed as much as possible throughout the elongation of the specimen during the impact event. 【Features】 ■ Capable of measuring high strain rates at impact speeds of up to 22 m/s ■ Tensile impact fixture test temperature range: -50 to +120°C (standard piezo sensor) ■ Transparent panels are placed around the test area, allowing for high-speed camera recording ■ Easy synchronization of video and load signals ■ DIC analysis to evaluate the longitudinal strain of the specimen after impact in a tensile impact state *For more details, please refer to the PDF document or feel free to contact us.

• Other measuring instruments
• Other Software

Examples of solutions to issues related to impact, such as dashboards and plastic storage containers!

This document introduces examples of how Instron solutions have led to the development and specification of final products and components across a wide range of industries and applications. By reading further, you will understand how we can assist in solving challenges related to real-world impacts specific to your customers. We encourage you to read it. [Content Overview (Partial)] ■ About Instron ■ Beyond Traditional Testing Methods ■ Impact Simulation: Energy, Shape, Environment ■ Instrumented Testing: Benefits of Information ■ Aerospace and Defense Testing *For more details, please refer to the PDF document or feel free to contact us.

• Other measuring instruments

Quickly generate data visualizations! Make shock testing simpler and smarter!

"BLUEHILL IMPACT" is powerful impact testing software equipped with the platform of our flagship software, Bluehill. Designed for touch panel operation, the large touch points on the screen allow for intuitive operation. It enables simpler and smarter testing more efficiently than ever before. Not only does it enhance the flexibility of the previous versions of Instron's impact testing software, but many advanced features have also been added. [Features] - Large touch points on the screen allow for intuitive operation - Enables efficient, simple, and smart testing - Pre-prepared standard testing methods - Real-time display of analog test force indicators that also show digital data - Advanced features such as more user-friendly test result reports and data output functions *For more details, please refer to the PDF materials or feel free to contact us.

• Other Software

The housing industry is currently facing a significant turning point due to factors such as population decline, a reduction in demand for new construction, and intensified price competition. This seminar will clearly explain the "business model transformation strategies" necessary for construction companies to survive and continue to grow in such a challenging environment. We will introduce specific approaches that can be immediately applied on-site, along with a roadmap to success.

Nitto Kohki will hold the "2025 Attack Fair in Meiko" for two days from July 23 (Wednesday) to July 24 (Thursday), 2025, at the "Kowa Seminar Plaza 2F Training Room No. 12 (inside Kowa Sports Land)." The Attack Fair is an exhibition where you can actually "see, touch, and operate" Nitto Kohki's products. Additionally, there will be wonderful souvenirs for attendees and many fun activities prepared. We look forward to welcoming everyone!

ODS Corporation, a manufacturer of business information terminals (headquartered in Chiyoda-ku, Tokyo, President: Kiyoshi Sunanaga), in collaboration with Magconn Corporation (headquartered in Kokubunji City, Tokyo, President: Satoshi Inoue), will showcase its business tablets at the "HCJ2026 International Hotel and Restaurant Show" to be held at Tokyo Big Sight from February 17 (Tuesday) to 20 (Friday), 2026. We will present the Android model "TA2C-NF8" equipped with an NFC reader/writer, which can be utilized in restaurants and hotels, as well as the Windows model "TW2A-NF9LTA" with an NFC reader/writer, which will be unveiled for the first time at this exhibition and is scheduled for release in March. By combining these products with Magconn's charging system, which allows for stable charging with a one-touch magnetic attachment, we aim to propose improvements in operational efficiency and the creation of new business opportunities utilizing NFC solutions.

The Practical Solution Fair is one of Japan's largest IT comprehensive exhibitions, hosted by Otsuka Shokai, held once a year. This year's theme is "Expanding with AI! Complete DX." The venue will showcase the latest business efficiency tools utilizing AI, and Paperlogic will exhibit "Electronic Contracts" and "Construction Document DX Pocket." ■ Date February 18, 2026 (Wednesday) 10:00 AM - 5:00 PM (last entry) February 19, 2026 (Thursday) 9:30 AM - 5:00 PM (last entry) Applications for attendance are accepted until 5 PM on each day. ■ Venue Grand Cube Osaka (Osaka Prefectural International Conference Hall): 5-3-51 Nakanoshima, Kita Ward, Osaka City, Osaka Prefecture ■ Participation method: Free, registration required https://it-event.otsuka-shokai.co.jp/osaka/ ▼ For details on the Tokyo venue, click here https://note.com/paperlogic/n/nb096d59149dc

We will be exhibiting at "JAPAN SHOP 2026," which will be held at Tokyo Big Sight from March 3 (Tuesday) to March 6 (Friday), 2026.