Image Sensing Exhibition 2022

"Compact × High Performance" Proven results in component analysis, quality control, and research applications! Accommodates various measurement needs.

■ Line scan type hyperspectral camera ■ Compact and lightweight, easy for field measurements ■ Acquires spectral data for each image pixel. ■ A wealth of accessories to enhance measurements ≪Measurement wavelength range product lineup≫ ・330–800nm ・400–1000nm ・420–980nm ・900–1700nm ・1000–2500nm 《Configuration items》 ■ Benchtop system (for research) Hyperspectral camera Movable stage Tower Lighting Software (capture and analysis) Dedicated PC ■ Field system (for outdoor shooting) Hyperspectral camera Rotating scanning stage Tripod tray for dedicated laptop Battery Software (capture and analysis) Dedicated laptop

• Analysis and prediction system

High-resolution, high-precision 3D imaging system

The 3D imaging system Depth Scan is a system capable of capturing high-resolution, high-precision 3D color images and videos at high speed. It is ideal for machine vision and measurement applications. 【Features】 - High precision (depth accuracy of less than 100μm) - High resolution (1824×2280 [4MP]) - Acquires color information (RGB) - High throughput (30Hz [low resolution], 2Hz [high resolution]) - Wide working distance (25~150cm) - Capable of outputting to 3D CAD

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【Suitable for OEM】Ultra-compact and low-cost. A hyperspectral camera capable of video recording.

【Minimum Size of Video Hyperspectral Camera UTLRIS】 - Ultra-compact: 29×29×49 mm - Ultra-lightweight (126 g) - Snapshot-type hyperspectral camera based on light field technology. - Capable of video recording - Covers a wavelength range of 450–850 nm (VNIR region) Suitable for OEM with 【Ultra-compact & Lightweight】 × 【Low Price】 - Opens up new hyperspectral imaging markets in various industrial fields such as food, industry, medical, and recycling. The ultra-compact and lightweight UTLRIS 5 is also suitable for use with UAS.

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Mobile-type hyperspectral camera that easily and quickly acquires VNIR (500-1000nm) spectral data on-site.

The HAIP BlackMobile hyperspectral camera is a handheld hyperspectral camera that allows for quick and easy acquisition of hyperspectral data in the field. ■ Mobile-type hyperspectral camera - Easy operation and result display in the field with a touch panel display. - Built-in LED lighting - Wavelength range: 500~1000nm, 100 spectral bands - High signal-to-noise ratio in the NIR region - Also equipped with a 4K RGB sensor

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Drone-compatible, compact, lightweight hyperspectral system. Can be mounted on DJI drones (Matrice 300 RTK, Mavic 2).

The HyperSlit from Spectro-AG is a drone-compatible spectral system that can simultaneously capture spectra and RGB images spatially. ■ Compact and lightweight, compatible with DJI drones It can be mounted on DJI drones such as the Matrice 300 RTK. ■ Product models covering ultraviolet, visible, and near-infrared wavelength ranges It supports applications from UV to near-infrared for precision agriculture, vegetation, forestry, and minerals. ■ Calibration radiance sensor The compact and lightweight (380g) drone-compatible HyperSlit is equipped with a radiance sensor and can provide uniquely calibrated spectra across 1,000 bands.

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High-resolution SWIR (1100-1650nm) compact hyperspectral camera suitable for research applications.

The SNAPSCAN SWIR from imec is a compact and lightweight hyperspectral camera capable of rapidly acquiring high-resolution SWIR hyperspectral data. With high spatial and spectral resolution, it can be used for the characterization of materials with properties in the SWIR region. ■ Wavelength range: SWIR (1100-1650nm) ■ Snapshot capability Thanks to the built-in scanning mechanism, snapshot imaging is possible without the need for external moving parts. ■ High resolution ■ Achieves high SN ratio An active cooling system and advanced software features achieve a high signal-to-noise ratio. ■ Compact and lightweight < Evaluation Kit > In addition to the hyperspectral camera, an evaluation kit is available that includes key components such as lighting, tripod mounts, and analysis software.

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Automatically build classification models using machine learning.

perClass Mira<R> is analysis software for hyperspectral imaging. It quickly interprets spectral images obtained from hyperspectral cameras and automatically builds classification models using machine learning. - Automatic model creation through machine learning - Simple operability and user-friendly software - High-quality labeling through active learning - Excellent model creation possible through learning and validation from multiple images

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We provide a complete set of systems optimized for remote sensing for aircraft installation.

The Pika UAV, a hyperspectral camera system for UAVs, is a lightweight and compact device that is equipped with sufficient functionality. We offer it as a set, ensuring good compatibility and making it easy to implement for remote sensing applications.

• Analysis and prediction system

Ultra-compact camera available for short delivery times and low prices due to standard specifications.

■Smart Series We offer a range of products from those focused on size to industrial and commercial full HD quality camera modules used in machine vision and robotics. The Smart Series camera modules achieve cost efficiency and short delivery times, available in three pre-configured standard specifications. Our ultra-compact cameras come in three types: S (the smallest), M (compact but achieves HD quality), and L (small but the highest performance). Each camera is capable of capturing color video and still images equipped with a CMOS sensor. The standout difference from other manufacturers' cameras lies in the optical system. The ultra-compact, high-quality lenses developed independently by the manufacturer, which is also a lens maker, can be purchased separately. If you are considering a high-quality lens that fits this camera, please feel free to contact us.

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The housing industry is currently facing a significant turning point due to factors such as population decline, a reduction in demand for new construction, and intensified price competition. This seminar will clearly explain the "business model transformation strategies" necessary for construction companies to survive and continue to grow in such a challenging environment. We will introduce specific approaches that can be immediately applied on-site, along with a roadmap to success.

Nitto Kohki will hold the "2025 Attack Fair in Meiko" for two days from July 23 (Wednesday) to July 24 (Thursday), 2025, at the "Kowa Seminar Plaza 2F Training Room No. 12 (inside Kowa Sports Land)." The Attack Fair is an exhibition where you can actually "see, touch, and operate" Nitto Kohki's products. Additionally, there will be wonderful souvenirs for attendees and many fun activities prepared. We look forward to welcoming everyone!

ODS Corporation, a manufacturer of business information terminals (headquartered in Chiyoda-ku, Tokyo, President: Kiyoshi Sunanaga), in collaboration with Magconn Corporation (headquartered in Kokubunji City, Tokyo, President: Satoshi Inoue), will showcase its business tablets at the "HCJ2026 International Hotel and Restaurant Show" to be held at Tokyo Big Sight from February 17 (Tuesday) to 20 (Friday), 2026. We will present the Android model "TA2C-NF8" equipped with an NFC reader/writer, which can be utilized in restaurants and hotels, as well as the Windows model "TW2A-NF9LTA" with an NFC reader/writer, which will be unveiled for the first time at this exhibition and is scheduled for release in March. By combining these products with Magconn's charging system, which allows for stable charging with a one-touch magnetic attachment, we aim to propose improvements in operational efficiency and the creation of new business opportunities utilizing NFC solutions.

The Practical Solution Fair is one of Japan's largest IT comprehensive exhibitions, hosted by Otsuka Shokai, held once a year. This year's theme is "Expanding with AI! Complete DX." The venue will showcase the latest business efficiency tools utilizing AI, and Paperlogic will exhibit "Electronic Contracts" and "Construction Document DX Pocket." ■ Date February 18, 2026 (Wednesday) 10:00 AM - 5:00 PM (last entry) February 19, 2026 (Thursday) 9:30 AM - 5:00 PM (last entry) Applications for attendance are accepted until 5 PM on each day. ■ Venue Grand Cube Osaka (Osaka Prefectural International Conference Hall): 5-3-51 Nakanoshima, Kita Ward, Osaka City, Osaka Prefecture ■ Participation method: Free, registration required https://it-event.otsuka-shokai.co.jp/osaka/ ▼ For details on the Tokyo venue, click here https://note.com/paperlogic/n/nb096d59149dc

We will be exhibiting at "JAPAN SHOP 2026," which will be held at Tokyo Big Sight from March 3 (Tuesday) to March 6 (Friday), 2026.