[Book] Development of Heat Dissipation and Cooling Technologies and Materials for Electronic Devices (No. 2115)

★ A Comprehensive Explanation of Heat Problem Solutions Associated with High-Speed High-Performance Semiconductors and High-Density Device Implementation!
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■ Table of Contents
Chapter 1: Design of Heat Sinks and Miniaturization with High Thermal Conductivity
Chapter 2: Design of Heat Pipes and Miniaturization, Improvement of Thermal Transport Efficiency
Chapter 3: Development and Application of Various TIM Materials
Chapter 4: Development of High Heat Dissipation and High Thermal Conductivity Substrates
Chapter 5: Development of High-Efficiency Cooling Technologies
Chapter 6: Thermal Simulation Technologies for Electronic Device Design
Chapter 7: Thermal Conductivity, Temperature Measurement, and Know-How
Chapter 8: Heat Dissipation Technologies for Printed Circuit Boards
Chapter 9: Heat Dissipation and Cooling Technologies for 5G and Information Communication Devices
Chapter 10: Thermal Management Technologies in Sensor Design
Chapter 11: Heat Dissipation and Cooling Technologies for Power Electronics
Chapter 12: Heat Dissipation and Cooling Technologies for EV Batteries
Chapter 13: Heat Dissipation Design for Automotive Electronics
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● Publication Date: July 30, 2021 ● Format: A4, 676 pages
● Authors: 62 ● ISBN: 978-4-86104-852-4
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