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  4. [Book] Development of Heat Dissipation and Cooling Technologies and Materials for Electronic Devices (No. 2115)
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  • Jul 30, 2021
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Jul 30, 2021

[Book] Development of Heat Dissipation and Cooling Technologies and Materials for Electronic Devices (No. 2115)

技術情報協会 技術情報協会
★ A Comprehensive Explanation of Heat Problem Solutions Associated with High-Speed High-Performance Semiconductors and High-Density Device Implementation! --------------------- ■ Table of Contents Chapter 1: Design of Heat Sinks and Miniaturization with High Thermal Conductivity Chapter 2: Design of Heat Pipes and Miniaturization, Improvement of Thermal Transport Efficiency Chapter 3: Development and Application of Various TIM Materials Chapter 4: Development of High Heat Dissipation and High Thermal Conductivity Substrates Chapter 5: Development of High-Efficiency Cooling Technologies Chapter 6: Thermal Simulation Technologies for Electronic Device Design Chapter 7: Thermal Conductivity, Temperature Measurement, and Know-How Chapter 8: Heat Dissipation Technologies for Printed Circuit Boards Chapter 9: Heat Dissipation and Cooling Technologies for 5G and Information Communication Devices Chapter 10: Thermal Management Technologies in Sensor Design Chapter 11: Heat Dissipation and Cooling Technologies for Power Electronics Chapter 12: Heat Dissipation and Cooling Technologies for EV Batteries Chapter 13: Heat Dissipation Design for Automotive Electronics --------------------- ● Publication Date: July 30, 2021 ● Format: A4, 676 pages ● Authors: 62 ● ISBN: 978-4-86104-852-4 --------------------- * For details, please download the catalog. * "Free Preview" is available.
"Development of Heat Dissipation and Cooling Technology and Materials for Electronic Devices" Book Photo
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[Book] Development of Heat Dissipation and Cooling Technology for Electronic Devices and Components (No. 2115)

[Free trial available - Specialized literature] ★ Thorough explanation of heat problem countermeasures associated with the acceleration of high-performance semiconductors and the high-density implementation of devices.

- Response to 5G, high-speed, and miniaturization - ■ Key Points of This Document Design and Application of Heat Sinks - Resolution of hotspot issues in next-generation power devices - Increase in maximum heat transport per unit - Composite use of graphite and metal materials and application of heat spreaders Development and Application Examples of TIM (Thermal Interface Material) - Orientation technology for transporting large amounts of heat in the thickness direction - Emergence of high thermal conductivity in TIM and reduction of contact thermal resistance - Achievement of high thermal conductivity with less filler content Development of Heat Dissipation Substrates - Improvement of high thermal conductivity and heat shock characteristics in metal-based substrates - Enhancement of thermal conductivity in silicon nitride substrates Prospects for Next-Generation Cooling Technologies - Outlook and challenges of boiling cooling technology - Boiling heat transfer under electric field application Case Studies in Device Heat Dissipation Design - Approaches to thermal design and thermal verification, simulation technology - Response to thermal design based on substrate heat dissipation, component technology - Design and evaluation of submerged processor chips aimed at liquid immersion cooling - Key points in thermal design for mobile devices

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[Book] Development of Heat Dissipation and Cooling Technology for Electronic Devices and Components (No. 2115)

[Book] Development of Heat Dissipation and Cooling Technology for Electronic Devices and Components (No. 2115)

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Ministry of Economy, Trade and Industry | The paperlogic meets the "standards for electronic contracts in the construction industry."

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In February of this year, we inquired about "paperlogic" using the Ministry of Economy, Trade and Industry's gray zone resolution system regarding the "provision of electronic contract services to the construction industry," and received a response stating that "paperlogic meets the standards related to construction contracts under the Construction Business Act Enforcement Regulations (Article 13-4, Paragraph 1, Item 1 (h) and Paragraph 2)." ◆ Accelerating DX in the Construction Industry with 'Official Approval' The construction industry faces challenges in digitizing contract operations due to the complexity of contracts, the presence of numerous stakeholders, and legal requirements and security concerns. However, due to the nature of the industry, detailed contract operations occur frequently. Therefore, by digitizing contract operations, the industry can benefit significantly from cost reductions in stamp duties and labor costs, as well as shortened timeframes for contract execution. ◆ Package Plans for the Construction Industry Available At paperlogic, we also offer the 'paperlogic Construction Document DX Pocket,' designed to facilitate smoother transactions between general contractors and partner companies. Please feel free to try our trial service from the "Service Application" section.

Oct 28, 2025

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Non-contact light touch sensor "HA-T401/HA-T520"

A non-contact light touch sensor "HA-T Series" that realizes "wanting to open in a narrower range and in a limited manner" based on the surrounding environment of automatic doors.

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The non-contact beam touch sensor "HA-T401/HA-T520" has a compact detection range, making it an ideal automatic door sensor for installation on automatic doors facing narrow corridors or busy streets. Depending on the application and installation location, you can choose between "non-vision mounting type" and "non-vision built-in type." 【Features】 ● With the beam touch sensor, you can open and close the automatic door simply by bringing your hand close without touching it, ensuring hygiene. ● Depending on the installation environment, such as single sliding or bi-parting doors, the detection range can be set in four configurations: left, center, right, and a total of 12 spots. ● Two types of activation row settings are available to reduce unnecessary opening and closing of the automatic door due to cross traffic, contributing to energy-saving effects. ● The touch switch and infrared sensor are integrated, allowing for a switch between beam touch and infrared sensor with a single model. 【Recommended for such locations!】 ☑ Entrance facing a busy corridor ☑ Counter or sign near the door ☑ Buildings facing narrow corridors ☑ Buildings that prioritize aesthetics ☑ Hospitals and facilities that consider hygiene ☑ Large facilities with many doors ◎ For more details, please download the materials or contact us.

Oct 28, 2025

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[Free Materials Available] Introducing Useful Information on Vehicle Detection Sensors!

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To customers considering the introduction of vehicle detection sensors for parking lot construction, design, or management: Are you facing any challenges with current issues or selecting the right sensors for parking management? Hotron offers free materials that explain how to utilize vehicle detection sensors and the benefits of their introduction! ▽ Here is the lineup of materials ◉ Vehicle Detection Sensor Basic Guide This guide focuses on the challenges and solutions in parking lot operations, introducing the overview of vehicle detection sensors. ◉ Key Points for Introducing Vehicle Detection Sensors This material discusses the benefits of introduction based on installation locations and specific challenges. ◉ Case Studies of Vehicle Detection Sensor Implementation This document presents the challenges before implementation and the results after introduction. For more details, please download from our website and check it out. https://www.hotron.co.jp/download/

Oct 27, 2025

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[Please introduce this to the management and general affairs department] Update on the introduction case of the attendance management system! We've moved away from manual input of attendance data! With biometric authentication for attendance management, we can now ensure transparency and accuracy.

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An article has been published regarding the case study of the attendance management system "KING OF TIME" implemented at Nichirei Industrial Co., Ltd. ~ In the case of Nichirei Industrial ~ The workload related to attendance management has decreased. With the transition from analog tasks to automated aggregation of working hours and granting of annual leave, we can now focus on our work with peace of mind. Particularly regarding the "punching method," we utilize fingerprint and facial recognition. By using biometric authentication, impersonation is not possible, and I believe the accuracy of attendance has significantly improved. Transparency has been ensured. 【Case Overview】 ■Challenges Before Implementation - Handwritten attendance sheets were used, resulting in input tasks to incorporate data into the payroll system. ■Key Points of Implementation - Systematization has reduced input tasks. Biometric authentication prevents impersonation. *For more details, please refer to the related links or feel free to contact us.

Oct 24, 2025

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Request to publish the product specification table containing the product number, insulation thickness, and thermal resistance values in the shipping notice, and to keep the shipping notice on file.

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As of April 2025, compliance with energy-saving standards for buildings has become mandatory. Accordingly, compliance with energy-saving standards will be added to the items for completion inspection. During the inspection, you may be asked to present shipping documents from the time of delivery to confirm the specifications and installation status of the insulation materials, so please keep them safe until the inspection is completed. For the insulation thickness and thermal resistance values corresponding to our company's insulation product model numbers, please refer to the attached product specification sheet.

Oct 24, 2025

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