Introducing examples of DX promotion! Announcement of a web seminar [Event by Osaka Prefecture DX Promotion Partners]

Easy for anyone, non-contact two-dimensional measurement! Introducing the common specifications of 'SmartEdge'.

The SmartEdge series is a two-dimensional automatic measurement device that automatically measures the dimensions of thin materials such as films and sheets. It uses a non-contact method with a camera, making it easy for anyone to use. Once the measurement points are programmed during the initial setup, only mouse operations are needed thereafter. With a rich lineup, we can offer proposals tailored to various applications, and for items not in the lineup, we can accommodate custom-made solutions. **Features** - Intuitive and easy-to-understand operability by simply selecting icons on the screen - High-resolution images are obtained through the use of a 1/1.8 CCD (2 million pixels) and high-resolution telecentric lenses - Easily move the camera to the desired location by importing drawings or photos of the workpiece and clicking on the screen - With tilt correction functionality, you can rest assured even if the workpiece is placed at an angle *For more details, please refer to the related links or feel free to contact us.*

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With an optical resolution of "1.8μm," it enables very high-precision inspections. It can also accommodate dimensional measurements and inspect two-dimensional punched products, among others.

This is a two-dimensional inspection device using a high-resolution camera and a high-precision X-Y stage. It is suitable for inspecting surface scratches and foreign objects on optical films, sheets, and touch panels, as well as for defect inspection. With an optical resolution of "1.8μm," it enables very high-definition inspections. It can also accommodate dimensional measurements and inspect two-dimensional punched products. 【Features】 - Automatically saves inspection data and images - Camera resolution: 9 million pixels - High optical resolution (1.8μm) allows for clear viewing of fine inspection areas - Ideal for inspecting peripheral electrodes of touch panels and disconnections or short circuits in fine wiring of printed circuit boards *For more details, please download the materials or contact us.

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In the field of food and health food research and development, an increasing number of companies are facing the following challenges: - Difficulty in exploring new functional materials and differentiation themes, leading to a depletion of research topics. - While they are collecting information from conferences and papers, they struggle to translate this into research themes directly related to their products. - They remain limited to competing similar products and follow-up projects, failing to establish uniqueness. - Although there are seeds of ideas, they struggle to elevate them to scientific hypotheses and build the necessary foundations for internal approval. Behind this lies a "wall of execution" that cannot be overcome by traditional information gathering and research processes. In this webinar, we will introduce a new R&D approach to break through these challenges. It is a next-generation research and development scheme that combines AI-driven hypothesis generation, which has achieved results in drug discovery, with scientific hypothesis verification by a food human trial CRO. This will allow for the transformation of vague ideas into scientifically verifiable projects, simultaneously achieving the construction of persuasive foundations for upper management and differentiation development.

Fujikohsuhou Industrial Co., Ltd. will hold an online seminar titled "Tips for Setting Laser Hardening Conditions" on July 20, 2025 (Wednesday). In laser hardening, factors such as output and speed are related to the quality of hardening. We will explain how output and speed are connected to quality factors. This seminar is aimed at those who are looking to start utilizing laser hardening. 【Recommended for】 ■ Those who want to learn about methods for setting laser hardening conditions ■ Those who want to obtain technical information about laser hardening

Take the 'first step' in DX talent development in Fukuoka. We will hold a free seminar where you can learn reskilling strategies that can be applied in the field through case studies and experiences! 'I've become responsible for DX, but I don't know where to start.' This is a participatory seminar aimed at representatives from small and medium-sized enterprises in Fukuoka City, Fukuoka Prefecture, where you can learn the 'first steps' in DX talent development and implementation support. While introducing case studies of representative DX tools such as Power Automate and Power BI, you will experience hands-on sessions with Copilot, allowing you to grasp practical small-start methods that can be implemented on-site. The content also includes specific success stories from the Fukuoka region, along with tips for promoting understanding and advancement within your organization.

We will be exhibiting at INCHEM TOKYO 2025, which will be held at Tokyo Big Sight from September 17 (Wednesday) to September 19 (Friday). This time, we will host many events, including special project stages and mini-seminars. At our booth, we will introduce our solutions and technologies based on the theme of "Sustainable Plant Engineering" from three different concepts. Please be sure to stop by our booth, East Hall 6, K-17.

The Siemens EDA Tech Forum is a technical event aimed at sharing the latest technological trends, case studies, and solutions to challenges with everyone involved in the design and development of silicon systems and electronic systems, while addressing evolving technologies, the densification and complexity of designs, and various design challenges, all while meeting requirements for quality, safety, and reliability. The goal is to deepen insights and networks towards achieving sustainable business. The forum covers a wide range of topics, from advanced design technologies and methods in fields such as 3D ICs, chiplets, chips for AI and ML (machine learning), and IC packaging, to the design, analysis, and collaborative development of electronic systems, including printed circuit boards, across multiple domains, as well as building ecosystems both internally and externally using digital threads. Through case presentations and explanations of design methods by industry leaders, it supports solutions to challenges faced in daily design work from all directions. This is a free technical event that requires pre-registration. We hope you will participate!