Notice of Participation in EVEX (EV/PHV Popularization and Utilization Technology Exhibition 2020) from November 4 (Wednesday) to November 6 (Friday), 2020.

Easy to replace storage! It's a compact fanless PC!

The "POC-200 Series" is a super compact fanless embedded computer. It is active in the fields of robot vision, surveillance/security, and inspection devices. ■Features - Manufacturer: Neousys - Compact: 149mm x 105mm x 53mm - Equipped with E3845 1.91 GHz quad-core processor - 3x USB 3.0 ports - Fanless - Wide range power input (8~35V) - Easy-swap HDD tray for 2.5” HDD/SSD Neousys is a manufacturer specializing in the development of reliable embedded products for industrial use. Our company, Helvetia, has a cooperative relationship as a domestic agent in Japan and has a proven track record of delivering many embedded products to domestic manufacturers.

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This is a compact fanless PC equipped with Apollo Lake, featuring PoE+ ports and USB 3.0 ports!

The "POC-300 Series" is an ultra-compact fanless embedded computer. It is active in the fields of machine vision, surveillance/security, and inspection devices. ■Features - Manufacturer: Neousys - Compact: 56mm x 108mm x 153mm - Equipped with E3950 1.6/2.0 GHz quad-core processor - 2x PoE ports - 2x USB 3.0 ports - 4x serial ports - Fanless - Wide range power input (8~35V) Neousys is a manufacturer specializing in the development of reliable embedded products for industrial use. Our company, Helvetia, has a cooperative relationship as a domestic agent in Japan and has a proven track record of delivering many embedded products to domestic manufacturers.

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High durability! Compatible with 120W NVIDIA GPU and Intel 9th/8th generation Core processors.

The "Nuvo-7160GC series" is a robust GPU-enabled edge computing platform designed for new machine learning applications such as autonomous driving, facial recognition, and machine vision. It supports GPUs with a maximum power of 120W and provides 4 to 6 TFLOPS of computational power for inference. Additionally, it achieves up to a 50% improvement in CPU performance over the previous generation with Intel's 9th/8th generation Coffee Lake Core 8/6 core CPUs. [Features] - Supports NVIDIA GPU graphics cards with a maximum TDP of 120W - Patented thermal design enabling operation in a wide temperature range of -25°C to 60°C - Compatible with Intel 9th/8th generation Core 35W/65W LGA1151 CPUs - Supports up to 6x GigE ports with 9.5 KB jumbo frame support Neousys is a manufacturer of reliable embedded products for industrial applications. Helvetia has a cooperative relationship as a domestic agent in Japan and has a proven track record of delivering many embedded products to domestic manufacturers. *For more details, please refer to the PDF document or feel free to contact us.

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In the field of food and health food research and development, an increasing number of companies are facing the following challenges: - Difficulty in exploring new functional materials and differentiation themes, leading to a depletion of research topics. - While they are collecting information from conferences and papers, they struggle to translate this into research themes directly related to their products. - They remain limited to competing similar products and follow-up projects, failing to establish uniqueness. - Although there are seeds of ideas, they struggle to elevate them to scientific hypotheses and build the necessary foundations for internal approval. Behind this lies a "wall of execution" that cannot be overcome by traditional information gathering and research processes. In this webinar, we will introduce a new R&D approach to break through these challenges. It is a next-generation research and development scheme that combines AI-driven hypothesis generation, which has achieved results in drug discovery, with scientific hypothesis verification by a food human trial CRO. This will allow for the transformation of vague ideas into scientifically verifiable projects, simultaneously achieving the construction of persuasive foundations for upper management and differentiation development.

Fujikohsuhou Industrial Co., Ltd. will hold an online seminar titled "Tips for Setting Laser Hardening Conditions" on July 20, 2025 (Wednesday). In laser hardening, factors such as output and speed are related to the quality of hardening. We will explain how output and speed are connected to quality factors. This seminar is aimed at those who are looking to start utilizing laser hardening. 【Recommended for】 ■ Those who want to learn about methods for setting laser hardening conditions ■ Those who want to obtain technical information about laser hardening

Take the 'first step' in DX talent development in Fukuoka. We will hold a free seminar where you can learn reskilling strategies that can be applied in the field through case studies and experiences! 'I've become responsible for DX, but I don't know where to start.' This is a participatory seminar aimed at representatives from small and medium-sized enterprises in Fukuoka City, Fukuoka Prefecture, where you can learn the 'first steps' in DX talent development and implementation support. While introducing case studies of representative DX tools such as Power Automate and Power BI, you will experience hands-on sessions with Copilot, allowing you to grasp practical small-start methods that can be implemented on-site. The content also includes specific success stories from the Fukuoka region, along with tips for promoting understanding and advancement within your organization.

We will be exhibiting at INCHEM TOKYO 2025, which will be held at Tokyo Big Sight from September 17 (Wednesday) to September 19 (Friday). This time, we will host many events, including special project stages and mini-seminars. At our booth, we will introduce our solutions and technologies based on the theme of "Sustainable Plant Engineering" from three different concepts. Please be sure to stop by our booth, East Hall 6, K-17.

The Siemens EDA Tech Forum is a technical event aimed at sharing the latest technological trends, case studies, and solutions to challenges with everyone involved in the design and development of silicon systems and electronic systems, while addressing evolving technologies, the densification and complexity of designs, and various design challenges, all while meeting requirements for quality, safety, and reliability. The goal is to deepen insights and networks towards achieving sustainable business. The forum covers a wide range of topics, from advanced design technologies and methods in fields such as 3D ICs, chiplets, chips for AI and ML (machine learning), and IC packaging, to the design, analysis, and collaborative development of electronic systems, including printed circuit boards, across multiple domains, as well as building ecosystems both internally and externally using digital threads. Through case presentations and explanations of design methods by industry leaders, it supports solutions to challenges faced in daily design work from all directions. This is a free technical event that requires pre-registration. We hope you will participate!