Book: Development and Implementation Technology of Printed Circuit Board Materials (No. 2054BOD)

■Table of Contents (Excerpt)
Chapter 1: Future Trends of Implementation Components
Chapter 2: Heat Resistance and Vibration Resistance of In-Vehicle Equipment Boards
Chapter 3: Car Electronics and In-Vehicle Boards
Chapter 4: Development of Board Materials for Power Electronics Equipment
Chapter 5: High Heat Resistance Implementation Technology for Power Electronics Applications
Chapter 6: Development of High-Frequency Board Materials
Chapter 7: Design of High-Frequency Boards
Chapter 8: Development of Flexible Printed Wiring Boards
Chapter 9: Development of Embedded Component Board Technology
Chapter 10: Printed Circuit Boards for Miniaturization and Thin Layering
Chapter 11: Improvement of Connection Reliability
Chapter 12: Fine Wiring Formation Technology
Chapter 13: Via Formation for Board Stacking
Chapter 14: Noise Countermeasure Technology
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●Publication Date: May 29, 2020 ●Authors: 65 ●Format: A4 Size, 713 Pages
Hardcover Edition: Price: 88,000 yen (tax included) ISBN: 978-4-86104-787-9
↓↓ The hardcover edition is out of print ↓↓
On-Demand Edition Available
Price: 44,000 yen (tax included) ISBN: 978-4-86798-012-5
After receiving your order, we will perform simple printing and binding.
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