We will exhibit at the "International Logistics Comprehensive Exhibition 2020 -INNOVATION EXPO-".
TOPPANエッジ
We will be exhibiting at the "International Logistics Comprehensive Exhibition 2020 -INNOVATION EXPO-" held at Tokyo Big Sight (Tokyo International Exhibition Center) from February 19 (Wednesday) to 21 (Friday), 2020.
This time, under the theme of 'INNOVATION EXPO', it will be held as a specialized exhibition where advanced information on logistics and logistics, which are essential as infrastructure for economic activities, can be gathered. Although it has been held every other year until now, due to its popularity, it will be held for the second consecutive year this time.
Toppan Forms will provide a wide range of solutions from low temperature to room temperature, as well as from manufacturing to transportation and storage, under the keyword 'Low Temperature Logistics Support Solutions'. We look forward to your visit.
[Exhibition Content] Low Temperature Logistics Support Solutions
● Temperature Management System (Ontracis Cloud)
● Three Temperature Zone Linerless Label Solution
● Opening Trace Label/Cutting Trace Label
● Battery-less Electronic Paper Label "Digitag"

Date and time | Wednesday, Feb 19, 2020 ~ Friday, Feb 21, 2020 10:00 AM ~ 05:00 PM |
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Capital | International Logistics Comprehensive Exhibition 2020 - INNOVATION EXPO - Date: February 19 (Wednesday) to February 21 (Friday), 2020 Time: 10:00 AM to 5:00 PM Venue: Tokyo Big Sight (Tokyo International Exhibition Center) West Hall 1 & 2 [Booth Number: West Hall 1 1S-23] Organizers: Japan Industrial Machinery Manufacturers Association, Japan Industrial Vehicles Association, Japan Pallet Association Japan Transport Vehicle Equipment Association, Japan Logistics System Equipment Association Japan Logistics System Association, Japan Management Association Admission Fee: 3,000 yen (including tax) *Free for invited guests and pre-registered attendees |
Entry fee | Charge 3,000 yen (including tax) *Invited guests and pre-registered participants are free. |
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