Notice of Participation in the "Severe Heat and Summer Disaster Prevention Products Exhibition 2019"

[Patent Granted] Reusable multiple times, also serves as a glass panel breakage prevention sheet! Eco-friendly + non-destructive effect. *Sales agents wanted.

The "Pitack Sheet II" is a destruction prevention sheet that can be attached and detached using the sheet's self-adhesive properties without the use of glue, allowing for reapplication multiple times. When applied fully to a window frame, it resists sliding due to its flexibility and further dissipates impact through its full punching effect. When applied to the entire window glass, it is also expected to prevent glass breakage, and even in cases where the contact area is small, such as with partial stickers, it offers advanced performance comparable to standard anti-shatter adhesive PET films. = We are currently seeking sales agents! = 【Features】 1. Detachable using the sheet's self-adhesive properties without glue Can be reapplied multiple times ★ Patent No. 5776914 2. Eco-friendly effect indoors during summer (insulation effect during cold periods) Effectiveness after inkjet and silk processing 3. Prevents indoor color fading by cutting 99.7% of ultraviolet (UV) rays (Measured value of the material before punching processing) 4. Clears shot-back tests for architectural window glass film (JIS A5759) Exhibits non-destructive effects for indoor use when applied to the entire window glass 5. Includes flame-retardant self-extinguishing function in case of fire (special formulation from partner film manufacturers) *For more details, please refer to the PDF materials.

• Heat shielding sheet
• Soundproofing Sheet
• Glass Decoration Materials

Fujikohsuhou Industrial Co., Ltd. will hold an online seminar titled "Tips for Setting Laser Hardening Conditions" on July 20, 2025 (Wednesday). In laser hardening, factors such as output and speed are related to the quality of hardening. We will explain how output and speed are connected to quality factors. This seminar is aimed at those who are looking to start utilizing laser hardening. 【Recommended for】 ■ Those who want to learn about methods for setting laser hardening conditions ■ Those who want to obtain technical information about laser hardening

Take the 'first step' in DX talent development in Fukuoka. We will hold a free seminar where you can learn reskilling strategies that can be applied in the field through case studies and experiences! 'I've become responsible for DX, but I don't know where to start.' This is a participatory seminar aimed at representatives from small and medium-sized enterprises in Fukuoka City, Fukuoka Prefecture, where you can learn the 'first steps' in DX talent development and implementation support. While introducing case studies of representative DX tools such as Power Automate and Power BI, you will experience hands-on sessions with Copilot, allowing you to grasp practical small-start methods that can be implemented on-site. The content also includes specific success stories from the Fukuoka region, along with tips for promoting understanding and advancement within your organization.

We will be exhibiting at INCHEM TOKYO 2025, which will be held at Tokyo Big Sight from September 17 (Wednesday) to September 19 (Friday). This time, we will host many events, including special project stages and mini-seminars. At our booth, we will introduce our solutions and technologies based on the theme of "Sustainable Plant Engineering" from three different concepts. Please be sure to stop by our booth, East Hall 6, K-17.

The Siemens EDA Tech Forum is a technical event aimed at sharing the latest technological trends, case studies, and solutions to challenges with everyone involved in the design and development of silicon systems and electronic systems, while addressing evolving technologies, the densification and complexity of designs, and various design challenges, all while meeting requirements for quality, safety, and reliability. The goal is to deepen insights and networks towards achieving sustainable business. The forum covers a wide range of topics, from advanced design technologies and methods in fields such as 3D ICs, chiplets, chips for AI and ML (machine learning), and IC packaging, to the design, analysis, and collaborative development of electronic systems, including printed circuit boards, across multiple domains, as well as building ecosystems both internally and externally using digital threads. Through case presentations and explanations of design methods by industry leaders, it supports solutions to challenges faced in daily design work from all directions. This is a free technical event that requires pre-registration. We hope you will participate!

The TOPPAN Group, consisting of TOPPAN Edge Inc., TOPPAN Digital Inc., and AiOi System Co., Ltd., will hold a co-hosted webinar aimed at solving challenges in the logistics field on August 20, 2025 (Wednesday). In this webinar, we will introduce a wealth of immediately useful information, including key points of the Comprehensive Logistics Efficiency Act, practical approaches to logistics DX through data utilization, and examples of improvements using subsidies. ▼ Recommended for: - Personnel facing challenges in logistics data analysis for business improvement - Logistics companies aiming to optimize warehouse operations and improve productivity - Companies interested in learning about logistics improvement cases utilizing subsidies - Companies considering the use of RFID in logistics operations ▼ Event Overview Date and Time: August 20, 2025 (Wednesday) 14:00–15:00 Format: Online (pre-registration required) Participation Fee: Free Co-hosted by: TOPPAN Edge / TOPPAN Digital / AiOi System We hope this seminar will serve as an opportunity to consider "what to start with and how to proceed" regarding the challenges faced by the logistics industry. We sincerely look forward to your participation.