Kabetuyoshi Design and Construction Training Seminar | Tokyo: December 14 (Friday) | Free participation fee

No need for ceiling and floor demolition and restoration work. Shorten the construction period and reduce costs!

- This is a seismic reinforcement kit that allows for the installation of internal walls to strengthen the building without breaking the existing floors and ceilings of wooden houses. - All necessary surface materials and screws for reinforcement are included in the set. There is no need to order screws individually; please order one set for each panel. - The seismic board is equipped with various specifications (large wall, true wall, post-installed columns) to accommodate different construction situations. - Obtained technical evaluation from the Japan Building Disaster Prevention Association (Evaluation Number DPA-Ju-Technical-13-2). - Since large-scale ancillary work, such as exterior wall reinforcement, is not required, we have achieved a cost reduction of 1/2 to 1/3 compared to exterior wall reinforcement.

• Dismantling and moving

Direct finishing on the surface material is possible. "Moist Wall Tsuyoshi" excels in workability.

This is a seismic reinforcement kit that allows for the installation of internal walls to strengthen the building without destroying the existing floors and ceilings of wooden houses. [Features unique to Mois Kabetsuyoshi!] - Can be finished directly with plaster or wallpaper - Can accommodate openings under beams up to 400mm - By using the "non-cutting kit for long beams," installation can be done without cutting the long beams - Excellent fire resistance, and no toxic gases are produced even when burned - Additionally, it exhibits moisture absorption, desorption, and gathering effects.

• Juraku Wall

Available for both new construction and renovation! Vibration-absorbing damping system.

■Strong against repeated earthquakes! After a major earthquake, aftershocks occur repeatedly. By absorbing those tremors, we reduce damage to homes. ■Maintenance-free The TRC damper has a durability of approximately 60 years. ■We conduct seismic simulation! We offer "analysis simulations" that visually explain the effects of seismic control through graphs. Please contact us if you are interested. ■Obtained technical evaluation from the Japan Architectural Disaster Prevention Association! We have obtained the technical evaluation from the Japan Architectural Disaster Prevention Association, which is necessary to receive subsidies from local governments for seismic renovations. ◎For more details, please refer to the PDF or feel free to contact us.

• Anti-vibration rubber
• Vibration isolation, vibration control, and earthquake resistance construction

In the field of food and health food research and development, an increasing number of companies are facing the following challenges: - Difficulty in exploring new functional materials and differentiation themes, leading to a depletion of research topics. - While they are collecting information from conferences and papers, they struggle to translate this into research themes directly related to their products. - They remain limited to competing similar products and follow-up projects, failing to establish uniqueness. - Although there are seeds of ideas, they struggle to elevate them to scientific hypotheses and build the necessary foundations for internal approval. Behind this lies a "wall of execution" that cannot be overcome by traditional information gathering and research processes. In this webinar, we will introduce a new R&D approach to break through these challenges. It is a next-generation research and development scheme that combines AI-driven hypothesis generation, which has achieved results in drug discovery, with scientific hypothesis verification by a food human trial CRO. This will allow for the transformation of vague ideas into scientifically verifiable projects, simultaneously achieving the construction of persuasive foundations for upper management and differentiation development.

Fujikohsuhou Industrial Co., Ltd. will hold an online seminar titled "Tips for Setting Laser Hardening Conditions" on July 20, 2025 (Wednesday). In laser hardening, factors such as output and speed are related to the quality of hardening. We will explain how output and speed are connected to quality factors. This seminar is aimed at those who are looking to start utilizing laser hardening. 【Recommended for】 ■ Those who want to learn about methods for setting laser hardening conditions ■ Those who want to obtain technical information about laser hardening

Take the 'first step' in DX talent development in Fukuoka. We will hold a free seminar where you can learn reskilling strategies that can be applied in the field through case studies and experiences! 'I've become responsible for DX, but I don't know where to start.' This is a participatory seminar aimed at representatives from small and medium-sized enterprises in Fukuoka City, Fukuoka Prefecture, where you can learn the 'first steps' in DX talent development and implementation support. While introducing case studies of representative DX tools such as Power Automate and Power BI, you will experience hands-on sessions with Copilot, allowing you to grasp practical small-start methods that can be implemented on-site. The content also includes specific success stories from the Fukuoka region, along with tips for promoting understanding and advancement within your organization.

We will be exhibiting at INCHEM TOKYO 2025, which will be held at Tokyo Big Sight from September 17 (Wednesday) to September 19 (Friday). This time, we will host many events, including special project stages and mini-seminars. At our booth, we will introduce our solutions and technologies based on the theme of "Sustainable Plant Engineering" from three different concepts. Please be sure to stop by our booth, East Hall 6, K-17.

The Siemens EDA Tech Forum is a technical event aimed at sharing the latest technological trends, case studies, and solutions to challenges with everyone involved in the design and development of silicon systems and electronic systems, while addressing evolving technologies, the densification and complexity of designs, and various design challenges, all while meeting requirements for quality, safety, and reliability. The goal is to deepen insights and networks towards achieving sustainable business. The forum covers a wide range of topics, from advanced design technologies and methods in fields such as 3D ICs, chiplets, chips for AI and ML (machine learning), and IC packaging, to the design, analysis, and collaborative development of electronic systems, including printed circuit boards, across multiple domains, as well as building ecosystems both internally and externally using digital threads. Through case presentations and explanations of design methods by industry leaders, it supports solutions to challenges faced in daily design work from all directions. This is a free technical event that requires pre-registration. We hope you will participate!