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  4. We will exhibit a corporate booth at the 39th Electronics Packaging Society Spring Conference. (Takushoku University Bunkyo Campus)
SEMINAR_EVENT
  • Dec 23, 2024
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Dec 23, 2024

We will exhibit a corporate booth at the 39th Electronics Packaging Society Spring Conference. (Takushoku University Bunkyo Campus)

タカヤ タカヤ
Takaya Corporation will exhibit a corporate booth at the 39th Electronics Packaging Society Spring Conference, which will be held from March 11 (Tuesday) to March 13 (Thursday), 2025, at the Bunkyo Campus of Takushoku University. This conference is held annually under the management of the Japan Electronics Packaging Society, providing a platform for the presentation and exchange of the latest research and development results in electronics packaging technology. Starting in 2023, a hybrid format of on-site participation and online attendance has been implemented, attracting around 700 participants, primarily from industry and academia involved in electronics packaging technology. When you visit, please be sure to stop by Takaya's booth. (Registration and payment of participation fees are required for attendance.)
Date and time Tuesday, Mar 11, 2025 ~ Thursday, Mar 13, 2025
Capital Shizuoka University Bunkyo Campus & Online Hybrid Event 〒112-8585 3-4-14 Kohinata, Bunkyo-ku, Tokyo
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Flying Probe Tester APT-2400F / 2600FD

[39th NePCON Japan Domestic Debut] Supports inspection of high-density printed circuit boards with industry-leading accuracy! New model of flying probe tester.

Takaya Corporation announces the new model of its flying probe tester, "APT-2400F/APT-2600FD series," which reliably detects various defects in printed circuit boards through ultra-fast inspection. Equipped with cutting-edge inspection technology that can check fine component placements and connections with high precision, it ensures that even minor defects and risks are not overlooked, strongly supporting product quality improvement. Additionally, thanks to our unique control mechanisms and sensing technology, reliable inspections can be achieved even in fluctuating environments, contributing to quality management by reducing recall risks. Furthermore, the user-friendly interface allows anyone to operate it intuitively, helping to alleviate burdens in workplaces where labor shortages are becoming serious, while still ensuring high inspection accuracy and contributing to increased productivity. *For more details, please download the PDF document or feel free to contact us.*

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Flying Probe Tester APT-2400F

Equipped with a high-performance measurement system and a variety of functions, it contributes to quality improvement from prototyping to mass production!

The APT-2400F boasts industry-leading probing accuracy capable of inspecting high-density mounted circuit boards, and through its unique control mechanisms and sensing technology, it achieves highly reliable electrical testing in all environments. It is the next-generation flying probe tester. We accept evaluation tests at our demo rooms in Okayama headquarters and Tokyo branch, where you can bring in your circuit boards. We can conduct a series of tests including the creation of inspection programs, testing with actual circuit boards, and summarizing evaluation results. *For more details, please feel free to contact us.

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Flying Probe Tester APT-2400F-SL

Equipped with a high-performance measurement system and a variety of functions, it contributes to quality improvement from prototype to mass production!

The APT-2400F-SL is a large model that retains the basic performance of the APT-2400F while expanding the compatible board size to W635×D610mm. Additionally, by adding an optional split inspection function, it can inspect long boards up to W985×D610mm. It can accommodate component heights of 60mm on the top and 120mm on the bottom, and can handle board weights of up to 15kg, making it suitable for inspecting large and heavy boards such as those used in automotive, aerospace, medical devices, power supply boards, and probe cards. We accept evaluation tests at our demo rooms in Okayama headquarters and Tokyo branch, where you can bring your boards for testing. A complete testing process is possible, including the creation of inspection programs, inspection using actual boards, and summarizing evaluation results. *For more details, please feel free to contact us.

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Dual Side Flying Probe Tester APT-2600FD

A new innovation in substrate manufacturing. Achieving improved production efficiency and inspection accuracy!

The APT-2600FD is a next-generation dual-side flying probe tester that can perform combination testing with up to 6 probes using both upper and lower flying probes simultaneously. It improves test coverage while reducing the risk of product damage due to board flipping operations, significantly shortening inspection time. Equipped with a high-performance measurement system and a variety of features, it contributes to quality improvement from prototype to mass production. We accept evaluation tests at our demonstration rooms in Okayama headquarters and Tokyo branch, where you can bring in your boards. A complete testing process is possible, including the creation of inspection programs, testing using actual boards, and summarizing evaluation results. *For more details, please feel free to contact us.

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Dual Side Flying Probe Tester APT-2600FD-SL

A new innovation in substrate manufacturing. Achieving improved production efficiency and inspection accuracy!

The APT-2600FD-SL is a large model that maintains the basic performance of the APT-2600FD while expanding the compatible board size to W635×D610mm. Furthermore, by adding an optional split inspection function, it can inspect long boards up to W985×D610mm. It can accommodate components with a height of up to 60mm and board weights of up to 15kg, making it suitable for inspecting large and heavy boards such as those used in automotive, aerospace, medical devices, power supply boards, and probe cards. We accept evaluation tests at our demonstration rooms in Okayama headquarters and Tokyo branch, where you can bring your boards for testing. A complete flow of testing is possible, including the creation of inspection programs, testing with actual boards, and summarizing evaluation results. *For more details, please feel free to contact us.

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Integration with boundary scan testing using a flying probe tester.

We will create new value through the mutual complementarity of ICT and BST.

In-circuit testing with flying probe testers excels at inspecting the electrical characteristics of implemented electronic components in analog circuits. However, components that cannot be probed make electrical testing difficult, and functional testing of digital circuits is challenging. On the other hand, boundary scan testing allows for quick interconnection testing between LSI pins and on-board programming for FPGAs, but it can only test digital circuits around ICs that comply with the boundary scan standard, and it also requires dedicated fixtures for connections. At Takaya Corporation, we possess technology that uses flying probes instead of fixtures that connect 4 to 5 scan-compatible pins and measuring instruments required for boundary scan testing. This allows for boundary scan testing even when the counterpart of a boundary scan-compliant IC is a non-boundary scan-compliant IC or passive components (such as connectors), by enabling the flying probe to function as a virtual boundary scan cell. With a single flying probe tester, it is possible to conduct comprehensive testing of both digital and analog circuits, thereby significantly enhancing testing efficiency compared to before.

  • Measurement and Inspection

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Special Feature Article Published in the Electronics Packaging Technology Journal

We have received permission to publish the feature article that appeared in the only domestic magazine specializing in implementation technology, "Electronics Implementation Technology." You can view it here.

Featured Content ■ Latest Trends in BGA Implementation Board Inspection Hybrid Inspection of Flying Probe Testers and JTAG Testing Andor System Support Co., Ltd. / Masazumi Taniguchi Takaya Co., Ltd. / Kohei Yanagida Overview BGA (Ball Grid Array) components have become widely used in various electronic devices, ranging from consumer products to industrial equipment, and more recently, automotive devices. However, a reliable method for inspecting boards with BGA components (hereafter referred to as BGA implementation boards) has not been established. This is because every inspection method has its advantages and disadvantages, and it is impossible to conduct a complete test using only one inspection method. Therefore, inspecting BGA implementation boards has become a challenge for many companies. In this article, we will introduce the latest technological trends in hybrid inspection that combines flying probe testers and JTAG (Joint Test Action Group) boundary scan as one solution to this issue. 1. Introduction 2. Inspection and Challenges of BGA Implementation Boards 3. Possibilities of Electrical Testing 4. In-Circuit Testing 5. JTAG Boundary Scan Testing 6. Hybrid Testing 7. Conclusion

  • Measurement and Inspection

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Accelerating the inspection of flying probe testers using deep reinforcement learning.

We have presented a joint research report with Ehime University.

Takaya Corporation is conducting joint research with the Graduate School of Science and Engineering at Ehime University on accelerating inspections of flying probe testers using deep reinforcement learning. At the Ehime University booth during the JPCA Show 2023 / 2023 Microelectronics Show held at Tokyo Big Sight from May 31 (Wednesday) to June 2 (Friday), the report on this research was displayed and introduced. You can download and view the report that was exhibited on that day from here. We encourage everyone to take a look.

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Related catalog(6)

[Press Release] Takaya Corporation Announces New Models of Flying Probe Tester "APT-2400F/APT-2600FD Series"

[Press Release] Takaya Corporation Announces New Models of Flying Probe Tester "APT-2400F/APT-2600FD Series"

TECHNICAL
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Flying Probe Tester APT-2400F

Flying Probe Tester APT-2400F

PRODUCT
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Dual Side Flying Probe Tester APT-2600FD

Dual Side Flying Probe Tester APT-2600FD

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Latest trends in hybrid inspection systems combining JTAG testing and flying probe testers.

Latest trends in hybrid inspection systems combining JTAG testing and flying probe testers.

TECHNICAL
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  • Catalog download

Contact this catalog

Hybrid inspection system combining JTAG testing and flying probe testers.

Hybrid inspection system combining JTAG testing and flying probe testers.

TECHNICAL
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Company Profile Takaya Corporation

Company Profile Takaya Corporation

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Information and Communications
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We will be exhibiting at the JAPAN DIY HOMECENTER SHOW 2026 held from August 27 to 29.

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  • SEMINAR_EVENT

We will be exhibiting at the "62nd JAPAN DIY HOMECENTER SHOW 2026." This year, the largest exhibition in the industry will be held with the theme "Let's Go to the DIY Festival in Summer!" Please be sure to visit our booth (No. M31). ■ Introduction of Exhibited Product: Insulation Material "SS Premier" We are introducing "SS Premier" with the concept of moving away from the existing 20mm thick insulation materials. [The secret of 5mm. Maintaining performance while being overwhelmingly thin, light, and easy to install.] - Achieves insulation performance equivalent to RW50mm with a thickness of just 5mm, making it possible to install in limited spaces. - As a sheet material, it can accommodate both round and square ducts. - Lightweight and flexible, making transportation and handling easy, reducing the burden on the job site. Compared to conventional products, it offers advantages in installation space, transportability, and retail display. It has numerous implementation records across the country, including government projects such as the Shibuya Ward Office reconstruction project, as well as universities, hospitals, and large-scale new construction projects. At the venue, you can take a look at actual product samples. All of our staff are sincerely looking forward to your visit at booth No. M31.

Aug 21, 2026

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28th Automatic Recognition Comprehensive Exhibition 2026

Notice of Participation in the 28th Automatic Identification Comprehensive Exhibition 2026 from September 9 (Wednesday) to September 11 (Friday), 2026.

  • NEW
  • SEMINAR_EVENT

Kou Alpha X Co., Ltd. will be exhibiting at the "Automatic Identification Comprehensive Exhibition" held at Tokyo Big Sight. At our booth, we will showcase a wide range of products, including metal-compatible RFID tags (PMT series), "keychain-type tags," and "rugged, environment-resistant tube tags." We look forward to your visit.

Aug 21, 2026

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Notice of Participation in SEMICON TAIWAN 2026

  • NEW
  • SEMINAR_EVENT

North Engineering, the Taiwanese agent of Tokkyo Kiki Co., Ltd., will exhibit at the international exhibition "SEMICON TAIWAN 2026" held in Taiwan. At "SEMICON Taiwan," we will showcase products for micro-vibration and magnetic field countermeasures for semiconductor manufacturing plants, as well as seismic isolation devices for transformers and vibration-damping devices for air conditioning outdoor units as earthquake countermeasures. Event Dates: September 2 (Wednesday) - September 4 (Friday), 2026 Venue: Taipei Nangang Exhibition Center (TaiNEX Hall 1 & 2, Taipei City, Taiwan) Booth Number: K2568 (TaiNEX 1, 1st Floor)

Aug 21, 2026

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How does the MA vendor use its own MA? - A full disclosure of the operation screen, including settings that didn't go well -

  • NEW
  • SEMINAR_EVENT

"I don't have anyone in the company to ask if this is the right way to segment." "I can't decide whether it's okay to delete the scenarios set up by my predecessor." I often hear such voices from those in charge of operating MA tools. In this seminar, Shannon, as an MA vendor, will publicly share how they operate MA within their own marketing department, using the actual management screen. Please note that this seminar will not be recorded or archived. It will be presented only to the 15 companies that attend in person. [Screens to be viewed on the day] (tentative) 1: Conditions for segmentation 2: Flow and branches of scenarios 3: Discarded settings [Recommended for those who] - Are almost solely responsible for operating MA tools - Have not been able to make changes to the settings inherited from their predecessor - Feel that they are not using MA as they had originally intended - Want to know how other companies are actually operating at the screen level - Are considering reviewing their current MA tools

Aug 20, 2026

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Notice of Participation in the High-Performance Materials Week Osaka Exhibition by Our Handling Manufacturer, Shirok.

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  • SEMINAR_EVENT

Our manufacturer, Shirok, will be exhibiting at the High-Performance Materials Week Tokyo Exhibition held at Makuhari Messe, with participation from Kō Alpha X Co., Ltd. We plan to showcase various silicone products, including silicone prepolymers, at our booth. We sincerely look forward to your visit. Register for attendance here: https://www.material-expo.jp/tokyo/ja-jp/register.html

Aug 20, 2026

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