We will exhibit a corporate booth at the 39th Electronics Packaging Society Spring Conference. (Takushoku University Bunkyo Campus)

[39th NePCON Japan Domestic Debut] Supports inspection of high-density printed circuit boards with industry-leading accuracy! New model of flying probe tester.

Takaya Corporation announces the new model of its flying probe tester, "APT-2400F/APT-2600FD series," which reliably detects various defects in printed circuit boards through ultra-fast inspection. Equipped with cutting-edge inspection technology that can check fine component placements and connections with high precision, it ensures that even minor defects and risks are not overlooked, strongly supporting product quality improvement. Additionally, thanks to our unique control mechanisms and sensing technology, reliable inspections can be achieved even in fluctuating environments, contributing to quality management by reducing recall risks. Furthermore, the user-friendly interface allows anyone to operate it intuitively, helping to alleviate burdens in workplaces where labor shortages are becoming serious, while still ensuring high inspection accuracy and contributing to increased productivity. *For more details, please download the PDF document or feel free to contact us.*

• Other measuring instruments

Equipped with a high-performance measurement system and a variety of functions, it contributes to quality improvement from prototyping to mass production!

The APT-2400F boasts industry-leading probing accuracy capable of inspecting high-density mounted circuit boards, and through its unique control mechanisms and sensing technology, it achieves highly reliable electrical testing in all environments. It is the next-generation flying probe tester. We accept evaluation tests at our demo rooms in Okayama headquarters and Tokyo branch, where you can bring in your circuit boards. We can conduct a series of tests including the creation of inspection programs, testing with actual circuit boards, and summarizing evaluation results. *For more details, please feel free to contact us.

• Other measuring instruments

Equipped with a high-performance measurement system and a variety of functions, it contributes to quality improvement from prototype to mass production!

The APT-2400F-SL is a large model that retains the basic performance of the APT-2400F while expanding the compatible board size to W635×D610mm. Additionally, by adding an optional split inspection function, it can inspect long boards up to W985×D610mm. It can accommodate component heights of 60mm on the top and 120mm on the bottom, and can handle board weights of up to 15kg, making it suitable for inspecting large and heavy boards such as those used in automotive, aerospace, medical devices, power supply boards, and probe cards. We accept evaluation tests at our demo rooms in Okayama headquarters and Tokyo branch, where you can bring your boards for testing. A complete testing process is possible, including the creation of inspection programs, inspection using actual boards, and summarizing evaluation results. *For more details, please feel free to contact us.

• Other measuring instruments

A new innovation in substrate manufacturing. Achieving improved production efficiency and inspection accuracy!

The APT-2600FD is a next-generation dual-side flying probe tester that can perform combination testing with up to 6 probes using both upper and lower flying probes simultaneously. It improves test coverage while reducing the risk of product damage due to board flipping operations, significantly shortening inspection time. Equipped with a high-performance measurement system and a variety of features, it contributes to quality improvement from prototype to mass production. We accept evaluation tests at our demonstration rooms in Okayama headquarters and Tokyo branch, where you can bring in your boards. A complete testing process is possible, including the creation of inspection programs, testing using actual boards, and summarizing evaluation results. *For more details, please feel free to contact us.

• Other measuring instruments

A new innovation in substrate manufacturing. Achieving improved production efficiency and inspection accuracy!

The APT-2600FD-SL is a large model that maintains the basic performance of the APT-2600FD while expanding the compatible board size to W635×D610mm. Furthermore, by adding an optional split inspection function, it can inspect long boards up to W985×D610mm. It can accommodate components with a height of up to 60mm and board weights of up to 15kg, making it suitable for inspecting large and heavy boards such as those used in automotive, aerospace, medical devices, power supply boards, and probe cards. We accept evaluation tests at our demonstration rooms in Okayama headquarters and Tokyo branch, where you can bring your boards for testing. A complete flow of testing is possible, including the creation of inspection programs, testing with actual boards, and summarizing evaluation results. *For more details, please feel free to contact us.

• Other measuring instruments

We will create new value through the mutual complementarity of ICT and BST.

In-circuit testing with flying probe testers excels at inspecting the electrical characteristics of implemented electronic components in analog circuits. However, components that cannot be probed make electrical testing difficult, and functional testing of digital circuits is challenging. On the other hand, boundary scan testing allows for quick interconnection testing between LSI pins and on-board programming for FPGAs, but it can only test digital circuits around ICs that comply with the boundary scan standard, and it also requires dedicated fixtures for connections. At Takaya Corporation, we possess technology that uses flying probes instead of fixtures that connect 4 to 5 scan-compatible pins and measuring instruments required for boundary scan testing. This allows for boundary scan testing even when the counterpart of a boundary scan-compliant IC is a non-boundary scan-compliant IC or passive components (such as connectors), by enabling the flying probe to function as a virtual boundary scan cell. With a single flying probe tester, it is possible to conduct comprehensive testing of both digital and analog circuits, thereby significantly enhancing testing efficiency compared to before.

• Measurement and Inspection

We have received permission to publish the feature article that appeared in the only domestic magazine specializing in implementation technology, "Electronics Implementation Technology." You can view it here.

Featured Content ■ Latest Trends in BGA Implementation Board Inspection Hybrid Inspection of Flying Probe Testers and JTAG Testing Andor System Support Co., Ltd. / Masazumi Taniguchi Takaya Co., Ltd. / Kohei Yanagida Overview BGA (Ball Grid Array) components have become widely used in various electronic devices, ranging from consumer products to industrial equipment, and more recently, automotive devices. However, a reliable method for inspecting boards with BGA components (hereafter referred to as BGA implementation boards) has not been established. This is because every inspection method has its advantages and disadvantages, and it is impossible to conduct a complete test using only one inspection method. Therefore, inspecting BGA implementation boards has become a challenge for many companies. In this article, we will introduce the latest technological trends in hybrid inspection that combines flying probe testers and JTAG (Joint Test Action Group) boundary scan as one solution to this issue. 1. Introduction 2. Inspection and Challenges of BGA Implementation Boards 3. Possibilities of Electrical Testing 4. In-Circuit Testing 5. JTAG Boundary Scan Testing 6. Hybrid Testing 7. Conclusion

• Measurement and Inspection

We have presented a joint research report with Ehime University.

Takaya Corporation is conducting joint research with the Graduate School of Science and Engineering at Ehime University on accelerating inspections of flying probe testers using deep reinforcement learning. At the Ehime University booth during the JPCA Show 2023 / 2023 Microelectronics Show held at Tokyo Big Sight from May 31 (Wednesday) to June 2 (Friday), the report on this research was displayed and introduced. You can download and view the report that was exhibited on that day from here. We encourage everyone to take a look.

• Measurement and Inspection

The WSG (Web Sustainability Guidelines) provides best practices for web sustainability based on the latest evidence and research. In this seminar, we will discuss the social background that necessitates the WSG, the structure and content of the WSG based on the latest draft, and surrounding trends. ■ Recommended for: - Web personnel from companies that focus on providing products or services aimed at solving social issues. - Web personnel from organizations actively working on Sustainable Development Goals (SDGs). - Web personnel looking for new themes or approaches to further enhance the quality of their company's website. *Please refrain from applying if you are from a competing company or an individual. ■ Agenda: 1. What are the Web Sustainability Guidelines (WSG)? 2. Background necessitating the WSG. 3. Structure and content of the WSG (UX design/Web development/Hosting, infrastructure, systems/Business strategy and product management). 4. Future trends of the WSG and the future of sustainable web design. 5. Q&A session. *Please note that the content of the above agenda may change without prior notice. Thank you for your understanding.

G-Smart Co., Ltd. will hold a recorded webinar to publicly share the recorded footage of the live stream "Building Management DX Business Demo WEEK" for a limited two-week period in July. Smart Attack V3 is a no-code field reporting app that allows users to complete reporting tasks on their smartphones and share and manage the report content in real time. In this webinar, we will introduce the methods for creating and managing reports using Smart Attack V3, focusing on reporting tasks related to building management, with a different theme each day over the two-week period, accompanied by easy-to-understand demonstrations. Please take this opportunity to register. ★★★ Recommended for ★★★ - Those who manage reports for cleaning, move-in/move-out, equipment inspections, etc., using paper or Excel. - Those who feel challenges in unifying and digitizing reports that differ by task. - Those considering a no-code reporting tool that fits their company's operations. ★★★ Event Schedule ★★★ Period: July 6 (Monday) to July 17 (Friday) from 15:00 to 15:30 * Each theme will be held on different days of the week. Monday: Equipment Inspection, Tuesday: Cleaning, Wednesday: Security, Thursday: Meter Reading, Friday: Move-in/Move-out Check.

Decarbonization is currently shifting its positioning from "cost management" to "enhancing competitiveness," and we are entering an era where mere regulatory compliance is no longer sufficient. With the strengthening of sustainability labeling regulations and the EU's Carbon Border Adjustment Mechanism (CBAM), the environmental value of products has transcended corporate responsibility and become a crucial element in market competition. On the other hand, many companies are facing challenges such as: - The complexity of CFP calculation and environmental labeling requirements makes it difficult to know how to proceed. - How to balance regulatory compliance with enhancing competitiveness (differentiation). - Difficulty in prioritizing ISCC certification and CBAM compliance. In this seminar, we will invite Wastebox Co., Ltd., which has extensive consulting experience in the environmental field, to introduce ideas and specific examples on how to connect responses to decarbonization and the circular economy to business growth from both "offensive" and "defensive" perspectives. ■ Part 1: "Understanding the Environmental Value of Products from Offensive and Defensive Perspectives: How to Leverage Decarbonization and the Circular Economy for Differentiation and Regulatory Compliance" ■ Part 2: "Why Are We Entering an Era of Product Environmental Value Now? (Tentative Title)" ■ Part 3: "Introduction of Services Supporting the Reliability of Product Environmental Value"

The requirements for quality management systems in the automotive industry are becoming increasingly sophisticated year by year, and a more nuanced understanding and appropriate response are required for obtaining and maintaining IATF 16949 certification. In particular, the application of Rules 6th Edition has led to changes in the audit process and certification requirements, making it essential to understand these accurately. In this webinar, we will clearly explain the latest trends in IATF 16949 certification and the key points of Rules 6th Edition from the perspective of auditors, directly relating to practical applications.

In the food industry, as the importance of ensuring quality and safety continues to rise, there is a growing demand for understanding international food safety standards and appropriately responding to the latest requirements. In FSSC 22000 Ver. 7, aspects such as "food safety culture," "risk-based thinking," "unannounced audits," and "supplier management" have been strengthened, making corporate responses crucial. In this webinar, Mr. Hiroshi Ideta, Regional Representative for Japan and Korea at the FSSC Foundation, will explain the latest trends in domestic and international food safety standards and the trends of certified companies. Bureau Veritas will introduce the key points of the FSSC 22000 Ver. 7 revision. If you are considering how to respond to the standard revision or want to understand the latest trends, please join us. ■ Part 1: "Domestic and International Trends Surrounding Food Safety Standards and Trends of FSSC 22000 Certified Organizations" 　　　　Mr. Hiroshi Ideta, Regional Representative for Japan and Korea, FSSC Foundation ■ Part 2: "Explanation of Key Points of FSSC 22000 Ver. 7 Revision" 　　　　Bureau Veritas Japan Co., Ltd., System Certification Business Division, Technical Department 　　　　ISO/FSSC22000 Auditor, Koichi Mukai