SEMICON Japan 2024 Exhibition

Covers UV to NIR from 350 to 1000 nm with a single device. Introduces light field technology. Provides high-resolution imaging data.

The "Hyperspectral Camera ULTRIS X20" is an innovative hyperspectral camera based on light field technology. It is equipped with a 20MP CMOS sensor, allowing for high-resolution data acquisition. The "ULTRIS X20" has an expanded measurement wavelength range compared to the conventional model "ULTRIS 20," now covering a wide range of wavelengths from 350 to 1000 nm, from ultraviolet to near-infrared, all in one device. **Features of ULTRIS X20:** - Capable of capturing hyperspectral imaging data in video format - Measurement wavelength range: 350-1000 nm, 164 spectral bands - High resolution - 410×410 pixels - Compact (60 × 60 × 57 mm), lightweight (350 g) (standard model S20) - Robust housing compliant with IP standards - Capable of underwater shooting With its compact and lightweight design, it can be mounted on general drones. The 164 spectral bands and high spatial resolution of 410×410 pixels make it suitable for a wide range of applications, not only in laboratories and fieldwork but also in UAV applications.

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Covers 350~1000nm with a single unit. A high-resolution, snapshot-type hyperspectral camera specifically designed for UAVs.

The "Hyperspectral Camera ULTRIS X20 Plus" is a hyperspectral camera designed specifically for UAVs, which adds a pan-sharpening method to the "ULTRIS X20," a hyperspectral camera based on light field technology. It has a wider measurement wavelength range than conventional models, capable of covering a broad wavelength range from 350 to 1000 nm, from ultraviolet to near-infrared, all with a single unit. **Features of ULTRIS X20 Plus:** - Capable of capturing hyperspectral imaging data in video format - Equipped with two imaging sensors - Adds a panchromatic sensor to the "ULTRIS X20" using light field technology - High resolution - Panchromatic resolution: 1880×1880 px, spectral resolution: 410×410 px (168,100 spectra) - Compact and lightweight (630g) The "ULTRIS X20 Plus" is a snapshot-type camera that can obtain a complete spectral data cube in seconds without scanning, making it suitable not only for UAV use but also for use as a video hyperspectral camera in laboratories and fieldwork.

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【Suitable for OEM】Ultra-compact and low-cost. A hyperspectral camera capable of video recording.

【Minimum Size of Video Hyperspectral Camera UTLRIS】 - Ultra-compact: 29×29×49 mm - Ultra-lightweight (126 g) - Snapshot-type hyperspectral camera based on light field technology. - Capable of video recording - Covers a wavelength range of 450–850 nm (VNIR region) Suitable for OEM with 【Ultra-compact & Lightweight】 × 【Low Price】 - Opens up new hyperspectral imaging markets in various industrial fields such as food, industry, medical, and recycling. The ultra-compact and lightweight UTLRIS 5 is also suitable for use with UAS.

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Ultra-high sensitivity CCD camera corresponding to the VUV, EUV, soft X-ray, and hard X-ray regions.

This is a super high-sensitivity CCD camera that corresponds to the VUV, EUV, soft X-ray, and hard X-ray regions. It achieves a high signal-to-noise (SN) ratio through high-sensitivity CCD and cooling technology. It is capable of detecting extremely weak signals that cannot be measured with CMOS cameras. ■ Super High Sensitivity The CCD sensor achieves a high quantum efficiency of up to 98%, allowing for the measurement of weak signals. It realizes a high dynamic range with 18-bit digital output, enabling simultaneous measurement of strong and weak signals. The TE cooling system, which cools down to -100°C, achieves an extremely low dark current of 0.00015 e-/pixel/s. ■ High Performance as a Camera It can read out at a maximum frame rate of 5 MHz. It is equipped with multiple interfaces including GigE and USB 3.0. Software and SDK for the camera are provided. ■ Ideal for Use in Vacuum Equipment It is compatible with CF flanges DN63, DN100, and DN160, making it easy to install in vacuum equipment. The design and materials of the camera provide resistance to 80-degree baking, allowing for use in UHV (Ultra High Vacuum) environments.

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Ultra-high sensitivity CCD camera for VUV, EUV, and X-ray regions for use in vacuum chambers.

This is an ultra-high sensitivity CCD camera compatible with the VUV, EUV, and X-ray regions, suitable for use in a vacuum chamber. Thanks to its high-sensitivity CCD and cooling technology, it achieves ultra-low noise and a high signal-to-noise ratio, allowing for the detection of weak signals that cannot be measured with CMOS cameras. It features a stainless steel housing that minimizes outgassing to the utmost, making it usable in UHV (Ultra High Vacuum) environments. The CCD cameras from greateyes possess an overwhelming characteristic of ultra-high sensitivity in the VUV, EUV, and X-ray regions while also exhibiting high performance as a camera, making them ideal for use in vacuum systems.

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In the field of food and health food research and development, an increasing number of companies are facing the following challenges: - Difficulty in exploring new functional materials and differentiation themes, leading to a depletion of research topics. - While they are collecting information from conferences and papers, they struggle to translate this into research themes directly related to their products. - They remain limited to competing similar products and follow-up projects, failing to establish uniqueness. - Although there are seeds of ideas, they struggle to elevate them to scientific hypotheses and build the necessary foundations for internal approval. Behind this lies a "wall of execution" that cannot be overcome by traditional information gathering and research processes. In this webinar, we will introduce a new R&D approach to break through these challenges. It is a next-generation research and development scheme that combines AI-driven hypothesis generation, which has achieved results in drug discovery, with scientific hypothesis verification by a food human trial CRO. This will allow for the transformation of vague ideas into scientifically verifiable projects, simultaneously achieving the construction of persuasive foundations for upper management and differentiation development.

Fujikohsuhou Industrial Co., Ltd. will hold an online seminar titled "Tips for Setting Laser Hardening Conditions" on July 20, 2025 (Wednesday). In laser hardening, factors such as output and speed are related to the quality of hardening. We will explain how output and speed are connected to quality factors. This seminar is aimed at those who are looking to start utilizing laser hardening. 【Recommended for】 ■ Those who want to learn about methods for setting laser hardening conditions ■ Those who want to obtain technical information about laser hardening

Take the 'first step' in DX talent development in Fukuoka. We will hold a free seminar where you can learn reskilling strategies that can be applied in the field through case studies and experiences! 'I've become responsible for DX, but I don't know where to start.' This is a participatory seminar aimed at representatives from small and medium-sized enterprises in Fukuoka City, Fukuoka Prefecture, where you can learn the 'first steps' in DX talent development and implementation support. While introducing case studies of representative DX tools such as Power Automate and Power BI, you will experience hands-on sessions with Copilot, allowing you to grasp practical small-start methods that can be implemented on-site. The content also includes specific success stories from the Fukuoka region, along with tips for promoting understanding and advancement within your organization.

We will be exhibiting at INCHEM TOKYO 2025, which will be held at Tokyo Big Sight from September 17 (Wednesday) to September 19 (Friday). This time, we will host many events, including special project stages and mini-seminars. At our booth, we will introduce our solutions and technologies based on the theme of "Sustainable Plant Engineering" from three different concepts. Please be sure to stop by our booth, East Hall 6, K-17.

The Siemens EDA Tech Forum is a technical event aimed at sharing the latest technological trends, case studies, and solutions to challenges with everyone involved in the design and development of silicon systems and electronic systems, while addressing evolving technologies, the densification and complexity of designs, and various design challenges, all while meeting requirements for quality, safety, and reliability. The goal is to deepen insights and networks towards achieving sustainable business. The forum covers a wide range of topics, from advanced design technologies and methods in fields such as 3D ICs, chiplets, chips for AI and ML (machine learning), and IC packaging, to the design, analysis, and collaborative development of electronic systems, including printed circuit boards, across multiple domains, as well as building ecosystems both internally and externally using digital threads. Through case presentations and explanations of design methods by industry leaders, it supports solutions to challenges faced in daily design work from all directions. This is a free technical event that requires pre-registration. We hope you will participate!