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  3. 太洋テクノレックス 本社 和歌山
  4. 【TTL】Microfabrication technology! Applying technologies such as electroplating, silicon etching, and glass etching to the development of various advanced technologies!
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  • Nov 07, 2024
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Nov 07, 2024

【TTL】Microfabrication technology! Applying technologies such as electroplating, silicon etching, and glass etching to the development of various advanced technologies!

太洋テクノレックス 太洋テクノレックス 本社 和歌山
Microfabrication technology (photofabrication) plays an important role as a production technology, producing precision machined components such as lead frames, HDD suspensions, encoders, TAB tapes, various filters, and decorative items. Additionally, based on photofabrication technology, current advanced technologies such as printed circuit boards, photomasks for LSI, color filters for color liquid crystal display devices, and semiconductors are also being developed. 【*Source: Photofabrication Association_Technical Explanation】
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Bump FPC

Forming bumps (micro-protrusions) with a minimum diameter of Φ20µm at the terminal section of the FPC. The bumps are used as contact points and applied in high-precision circuit inspections, etc. (Flexible substrate)

The bump FPC is a bump generation technology that our company specializes in, applied to the FPC. When combined with our contact clips and hand presses, it is ideal for testing fine-pitch insertion terminals and display lighting tests. *For more details, please refer to the PDF materials or feel free to contact us. #Flexible #FPC #FlexibleCircuitBoard #FlexiblePrintedCircuitBoard #CircuitBoard #PrintedCircuitBoard #Special #Bump #ShortLeadTime #MassProduction

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Electroforming technology

Micron-level ultra-fine processing is possible! It is widely applied in fields such as electronic components and semiconductors.

"Electroforming" is a technology that forms metal products with high precision by depositing a nickel plating layer through electroplating. There are three types of cross-sectional shapes to choose from: the "overhang type," which deposits the product to cover the photoresist; the "straight type," which has a linear thickness direction; and the "laminated type," which consists of multiple layers. It enables ultra-fine processing at the micron level, which is difficult with etching, and is widely applied in electronic components, precision machinery parts, automotive parts, and the semiconductor field. [Features] ■ Enables ultra-fine processing at the micron level, which is difficult with etching ■ Reduces initial costs by eliminating the need for molds, allowing for the formation of three-dimensional cross-sectional shapes ■ Widely applied in electronic components, precision machinery parts, automotive parts, and the semiconductor field *For more details, please refer to the PDF document or feel free to contact us.

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[Presentation of Materials] Until FPC is Completed... (PowerPoint Version)

【Basic Knowledge - PowerPoint Version Download Available!】The standard manufacturing process of Taiyo Kogyo, which has focused on small quantities and a wide variety, has been compiled into a document!

This document introduces the manufacturing process of FPC (Flexible Printed Circuit) conducted by Taiyo Kogyo Co., Ltd. A PowerPoint version has been added! * The PowerPoint version can be downloaded from 'Sample Software'. How are flexible printed circuit boards made? This material is for those who want to learn about FPC. It explains the manufacturing process after the design of standard specification FPC. [Contents (excerpt)] ■ Exposure ■ Through-hole drilling ■ Copper plating ■ Dry film lamination ■ Exposure * The download will provide a PDF version. * The PowerPoint version can be downloaded from 'Sample Software'. [The urban development and medical food technology site will only provide a PDF version] #CircuitBoard #FlexiblePrintedCircuitBoard #FlexibleCircuitBoard #FPC #Flex #BasicKnowledge

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Ultra-fine line high-density FPC (high-precision flexible printed circuit board)

Ultra-fine lines, high density, and high-definition flexible printed circuit boards have made it possible to form ultra-fine circuits through the fusion of MSAP technology and via filling techniques!

The miniaturization and high functionality of electronic devices are advancing, and along with this, there is a demand for finer circuit formation. One method for forming wiring by etching copper foil (subtractive method) and a high-resolution circuit formation method is to form wiring by plating on ultra-thin copper foil (semi-additive method). The method we are introducing this time is one of the semi-additive methods, called "MSAP (Modified Semi Additive Process)." By using the MSAP method, it has become possible to achieve ultra-fine lines and high-density pattern formation, which is difficult with the subtractive method. Additionally, by combining it with the "via filling technology," which fills through-hole holes with copper plating, it becomes possible to create wiring on the through-holes, further increasing wiring density. **Features of the MSAP Method:** - Circuit formation through plating deposition enables high-precision fine wiring. - Excellent rectangularity of wiring cross-section contributes to reduced transmission loss. - Superior for high-frequency substrates/IC mounting. By merging these two processing technologies, we have realized "ultra-fine high-density FPC." #FlexibleSubstrate #Substrate #HighResolutionSubstrate #Flex #FlexiblePrintedCircuitBoard

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Introduction to "Low Reflection Plating" Electroforming Technology

Surface treatment with plating to prevent light reflection, enabling micron-level ultra-fine processing! It is widely applied in fields such as electronic components and semiconductors.

"Electroforming" is a technology that deposits a nickel plating layer through electroplating to form metal products with high precision. There are three types of cross-sectional shapes to choose from: the "overhang type," where the product is deposited to cover the photoresist; the "straight type," which has a linear thickness shape; and the "laminated type," which consists of multiple layers. It enables ultra-fine processing at the micron level, which is difficult with etching, and is widely applied in electronic components, precision machinery parts, automotive parts, and the semiconductor field. [Features] - Enables ultra-fine processing at the micron level, which is difficult with etching - Reduces initial costs by eliminating the need for molds, allowing for the formation of three-dimensional cross-sectional shapes - Widely applied in electronic components, precision machinery parts, automotive parts, and the semiconductor field *For more details, please refer to the PDF document or feel free to contact us.

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"Low Reflective Coating" Electroforming Technology

"Low Reflective Coating" Electroforming Technology

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The photo and article of the "Civil Engineering Watching - Infrastructure Encyclopedia: Collection of Civil Engineering Structures" (Germany's Saale Valley Bridge) have been published.

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"Civil Engineering Watching - Infrastructure Encyclopedia: Collection of Civil Engineering Structures" is a portal site for images and information about civil engineering structures that form social infrastructure facilities. We have recently published photos and articles about the "Saale Valley Bridge." The "Saale Valley Bridge" was constructed at the border between Saxony-Anhalt and Thuringia, in Bad Kösen, Naumburg. Boasting an impressive height of up to 60 meters, this structure spans a total length of 1.2 kilometers and a width of 12.5 meters, harmoniously blending with the surrounding landscape designated as a nature reserve. In addition to the "Saale Valley Bridge," various civil engineering projects, photos, and articles related to civil engineering are also featured, so we hope you will take a look. Please check from the "Related Links" (Civil Engineering Watching - Infrastructure Encyclopedia: Collection of Civil Engineering Structures). Perry Japan Co., Ltd.

Aug 28, 2026

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Microphone, amplifier, and speaker all in one device: "TOMOT-AMP"

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Published in the Nikkan Kogyo Shimbun on June 24.

Aug 27, 2026

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[Information] Shirutoku Report 122 #Points of Caution for Technical Compliance of Wi-Fi 6 Compatible Products

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Many customers wish to obtain technical standards conformity certification (Giteki) and construction design certification to use imported Wi-Fi products domestically. However, since radio laws differ from country to country, it is important to note that adjustments to transmission power may be necessary to comply with Japan's radio law. Among these, we will introduce products that require special attention, specifically those compatible with IEEE802.11ax (Wi-Fi 6).

Aug 27, 2026

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Installed a commercial diffuser of Majesta Fragrance in the fitness gym! Balancing sweat odor control and branding!

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We have introduced the Majesta Fragrance commercial diffuser to a fitness gym located in the city. Gyms and sports clubs tend to trap sweat and humidity, making them spaces where odor issues can easily arise. That’s why "scent design (branding)" that dramatically changes the overall impression of the space is highly effective. - The diffuser being used is the [MF-01]. It is a stylish tower-type diffuser available for a monthly fee of 8,800 yen (tax included). This model is space-saving and blends well with any interior. - The scent being diffused is [Forest Green]. It is a refreshing fragrance that blends the crispness of bergamot with the natural scent of green, creating a clean and pleasant atmosphere. It enhances concentration during exercise while providing a refreshing and comfortable space. A free trial installation is available. "I don’t know what scent would suit my gym." "I want to try out the different scents available." For such stores, Majesta Fragrance offers a free trial installation. If you are considering space branding or odor control, please feel free to contact us.

Aug 27, 2026

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Exhibition at the 133rd Annual Meeting of the Geological Society of Japan (September 13-15)

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We will be exhibiting at the 133rd Annual Meeting of the Geological Society of Japan. In addition to introducing services such as sediment surveys and chemical analysis of samples, we will also showcase products like core samplers. Please feel free to ask the booth staff about new graduate recruitment and experienced hires for the 2028 fiscal year. We look forward to seeing you all. Date: September 13 (Sunday) to September 15 (Tuesday), 2026 Location: Kanazawa University, South Area of Kakuma Campus (1st floor of the Natural Science Lecture Building, Kanazawa City, Ishikawa Prefecture)

Aug 27, 2026

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