【TTL】Microfabrication technology! Applying technologies such as electroplating, silicon etching, and glass etching to the development of various advanced technologies!

Forming bumps (micro-protrusions) with a minimum diameter of Φ20µm at the terminal section of the FPC. The bumps are used as contact points and applied in high-precision circuit inspections, etc. (Flexible substrate)

The bump FPC is a bump generation technology that our company specializes in, applied to the FPC. When combined with our contact clips and hand presses, it is ideal for testing fine-pitch insertion terminals and display lighting tests. *For more details, please refer to the PDF materials or feel free to contact us. #Flexible #FPC #FlexibleCircuitBoard #FlexiblePrintedCircuitBoard #CircuitBoard #PrintedCircuitBoard #Special #Bump #ShortLeadTime #MassProduction

• others

Micron-level ultra-fine processing is possible! It is widely applied in fields such as electronic components and semiconductors.

"Electroforming" is a technology that forms metal products with high precision by depositing a nickel plating layer through electroplating. There are three types of cross-sectional shapes to choose from: the "overhang type," which deposits the product to cover the photoresist; the "straight type," which has a linear thickness direction; and the "laminated type," which consists of multiple layers. It enables ultra-fine processing at the micron level, which is difficult with etching, and is widely applied in electronic components, precision machinery parts, automotive parts, and the semiconductor field. [Features] ■ Enables ultra-fine processing at the micron level, which is difficult with etching ■ Reduces initial costs by eliminating the need for molds, allowing for the formation of three-dimensional cross-sectional shapes ■ Widely applied in electronic components, precision machinery parts, automotive parts, and the semiconductor field *For more details, please refer to the PDF document or feel free to contact us.

• others

【Basic Knowledge - PowerPoint Version Download Available!】The standard manufacturing process of Taiyo Kogyo, which has focused on small quantities and a wide variety, has been compiled into a document!

This document introduces the manufacturing process of FPC (Flexible Printed Circuit) conducted by Taiyo Kogyo Co., Ltd. A PowerPoint version has been added! * The PowerPoint version can be downloaded from 'Sample Software'. How are flexible printed circuit boards made? This material is for those who want to learn about FPC. It explains the manufacturing process after the design of standard specification FPC. [Contents (excerpt)] ■ Exposure ■ Through-hole drilling ■ Copper plating ■ Dry film lamination ■ Exposure * The download will provide a PDF version. * The PowerPoint version can be downloaded from 'Sample Software'. [The urban development and medical food technology site will only provide a PDF version] #CircuitBoard #FlexiblePrintedCircuitBoard #FlexibleCircuitBoard #FPC #Flex #BasicKnowledge

• Piping and electrical wiring materials
• others

Ultra-fine lines, high density, and high-definition flexible printed circuit boards have made it possible to form ultra-fine circuits through the fusion of MSAP technology and via filling techniques!

The miniaturization and high functionality of electronic devices are advancing, and along with this, there is a demand for finer circuit formation. One method for forming wiring by etching copper foil (subtractive method) and a high-resolution circuit formation method is to form wiring by plating on ultra-thin copper foil (semi-additive method). The method we are introducing this time is one of the semi-additive methods, called "MSAP (Modified Semi Additive Process)." By using the MSAP method, it has become possible to achieve ultra-fine lines and high-density pattern formation, which is difficult with the subtractive method. Additionally, by combining it with the "via filling technology," which fills through-hole holes with copper plating, it becomes possible to create wiring on the through-holes, further increasing wiring density. **Features of the MSAP Method:** - Circuit formation through plating deposition enables high-precision fine wiring. - Excellent rectangularity of wiring cross-section contributes to reduced transmission loss. - Superior for high-frequency substrates/IC mounting. By merging these two processing technologies, we have realized "ultra-fine high-density FPC." #FlexibleSubstrate #Substrate #HighResolutionSubstrate #Flex #FlexiblePrintedCircuitBoard

• others

Surface treatment with plating to prevent light reflection, enabling micron-level ultra-fine processing! It is widely applied in fields such as electronic components and semiconductors.

"Electroforming" is a technology that deposits a nickel plating layer through electroplating to form metal products with high precision. There are three types of cross-sectional shapes to choose from: the "overhang type," where the product is deposited to cover the photoresist; the "straight type," which has a linear thickness shape; and the "laminated type," which consists of multiple layers. It enables ultra-fine processing at the micron level, which is difficult with etching, and is widely applied in electronic components, precision machinery parts, automotive parts, and the semiconductor field. [Features] - Enables ultra-fine processing at the micron level, which is difficult with etching - Reduces initial costs by eliminating the need for molds, allowing for the formation of three-dimensional cross-sectional shapes - Widely applied in electronic components, precision machinery parts, automotive parts, and the semiconductor field *For more details, please refer to the PDF document or feel free to contact us.

• others

Are you making progress on measures for the "2024 Problem"? The management of drivers' working hours is becoming stricter, and in the logistics field, reducing "waiting time for loading" has become an urgent issue. To address this challenge, our company, Hotron, proposes the "Vehicle Detection Ultrasonic Sensor 'HM-UX2'," which instantly grasps the availability of loading bays. The 'HM-UX2' contributes to the resolution of waiting times by accurately understanding the availability status, reducing unnecessary waiting and queuing, and shortening waiting times, thereby alleviating the burden on drivers! By replacing the "eyes" of your loading bay management with this high-precision sensor, why not start taking measures against the "2024 Problem"? Take a look at the product features: "Can it accurately detect availability?" "Can we really use it in our company?" "I just want to know the cost, even if it's an estimate." If you have any questions or requests, please feel free to consult us first.

We sincerely apologize for the inconvenience, but we will be closed for summer vacation during the following period. Closure period: August 9 (Saturday) to August 17 (Sunday), 2025 Inquiries received during this period will be addressed sequentially starting from August 18 (Monday). We appreciate your understanding and cooperation.

Thank you very much for visiting our booth at the "High-Performance Materials Week [Osaka] 13th High-Performance Plastics Exhibition." Thanks to you, we had many visitors and were able to conclude the event successfully. In addition to the "PPLB-445" displayed on the day, we have a variety of products available. For those who were unable to measure samples at the venue, we offer a trial measurement service. Furthermore, for those who would like to know more about our products and services, we also accept online meetings. We welcome inquiries from those who attended as well as those who could not make it this time due to scheduling conflicts. Please feel free to contact us.

Aioi System is pleased to announce the release of the low-power wireless display "NW2991-JP," which achieves long battery life. This product supports 920MHz band wireless communication and can be operated in conjunction with wired displays. It can be easily integrated into existing systems by simply adding a master unit. With a high-speed response time of under one second and a variety of display functions for text and barcodes, it supports a wide range of applications. ▼ For more details, please see the press release linked below ▼ ■ Main Features - Maintenance-free design with a battery life of one year (low power consumption) - Compatible with mixed operation with wired displays - High-speed response (under one second) and diverse display formats - Stable communication in the 920MHz band ■ You can see the actual product at the exhibition This product will be displayed at the TOPPAN booth during the International Logistics Comprehensive Exhibition 2025, 4th INNOVATION EXPO. We invite you to visit the venue, see the actual product, and experience its performance. Dates: September 10 (Wed) - 12 (Fri), 2025 Venue: Tokyo Big Sight (Halls 4-8) Booth No: 5-907 (TOPPAN booth) Exhibition official website ▶ linked below We sincerely look forward to your visit.

Thank you very much for visiting our booth at the "Monozukuri World (Measurement, Inspection, and Sensor Exhibition) 2025." Thanks to you, we had many visitors, and the event concluded successfully. In addition to the "PPLB-445" showcased on the day, we have a variety of products available. For those who were unable to conduct sample measurements at the venue, we offer a trial measurement service. Furthermore, for those who would like to learn more about our products and services, we also accept online meetings. We welcome inquiries from those who attended, as well as those who were unable to come this time due to scheduling conflicts. Please feel free to reach out to us.