【TTL】Microfabrication technology! Applying technologies such as electroplating, silicon etching, and glass etching to the development of various advanced technologies!

Forming bumps (micro-protrusions) with a minimum diameter of Φ20µm at the terminal section of the FPC. The bumps are used as contact points and applied in high-precision circuit inspections, etc. (Flexible substrate)

The bump FPC is a bump generation technology that our company specializes in, applied to the FPC. When combined with our contact clips and hand presses, it is ideal for testing fine-pitch insertion terminals and display lighting tests. *For more details, please refer to the PDF materials or feel free to contact us. #Flexible #FPC #FlexibleCircuitBoard #FlexiblePrintedCircuitBoard #CircuitBoard #PrintedCircuitBoard #Special #Bump #ShortLeadTime #MassProduction

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Micron-level ultra-fine processing is possible! It is widely applied in fields such as electronic components and semiconductors.

"Electroforming" is a technology that forms metal products with high precision by depositing a nickel plating layer through electroplating. There are three types of cross-sectional shapes to choose from: the "overhang type," which deposits the product to cover the photoresist; the "straight type," which has a linear thickness direction; and the "laminated type," which consists of multiple layers. It enables ultra-fine processing at the micron level, which is difficult with etching, and is widely applied in electronic components, precision machinery parts, automotive parts, and the semiconductor field. [Features] ■ Enables ultra-fine processing at the micron level, which is difficult with etching ■ Reduces initial costs by eliminating the need for molds, allowing for the formation of three-dimensional cross-sectional shapes ■ Widely applied in electronic components, precision machinery parts, automotive parts, and the semiconductor field *For more details, please refer to the PDF document or feel free to contact us.

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【Basic Knowledge - PowerPoint Version Download Available!】The standard manufacturing process of Taiyo Kogyo, which has focused on small quantities and a wide variety, has been compiled into a document!

This document introduces the manufacturing process of FPC (Flexible Printed Circuit) conducted by Taiyo Kogyo Co., Ltd. A PowerPoint version has been added! * The PowerPoint version can be downloaded from 'Sample Software'. How are flexible printed circuit boards made? This material is for those who want to learn about FPC. It explains the manufacturing process after the design of standard specification FPC. [Contents (excerpt)] ■ Exposure ■ Through-hole drilling ■ Copper plating ■ Dry film lamination ■ Exposure * The download will provide a PDF version. * The PowerPoint version can be downloaded from 'Sample Software'. [The urban development and medical food technology site will only provide a PDF version] #CircuitBoard #FlexiblePrintedCircuitBoard #FlexibleCircuitBoard #FPC #Flex #BasicKnowledge

• Piping and electrical wiring materials
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Ultra-fine lines, high density, and high-definition flexible printed circuit boards have made it possible to form ultra-fine circuits through the fusion of MSAP technology and via filling techniques!

The miniaturization and high functionality of electronic devices are advancing, and along with this, there is a demand for finer circuit formation. One method for forming wiring by etching copper foil (subtractive method) and a high-resolution circuit formation method is to form wiring by plating on ultra-thin copper foil (semi-additive method). The method we are introducing this time is one of the semi-additive methods, called "MSAP (Modified Semi Additive Process)." By using the MSAP method, it has become possible to achieve ultra-fine lines and high-density pattern formation, which is difficult with the subtractive method. Additionally, by combining it with the "via filling technology," which fills through-hole holes with copper plating, it becomes possible to create wiring on the through-holes, further increasing wiring density. **Features of the MSAP Method:** - Circuit formation through plating deposition enables high-precision fine wiring. - Excellent rectangularity of wiring cross-section contributes to reduced transmission loss. - Superior for high-frequency substrates/IC mounting. By merging these two processing technologies, we have realized "ultra-fine high-density FPC." #FlexibleSubstrate #Substrate #HighResolutionSubstrate #Flex #FlexiblePrintedCircuitBoard

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Surface treatment with plating to prevent light reflection, enabling micron-level ultra-fine processing! It is widely applied in fields such as electronic components and semiconductors.

"Electroforming" is a technology that deposits a nickel plating layer through electroplating to form metal products with high precision. There are three types of cross-sectional shapes to choose from: the "overhang type," where the product is deposited to cover the photoresist; the "straight type," which has a linear thickness shape; and the "laminated type," which consists of multiple layers. It enables ultra-fine processing at the micron level, which is difficult with etching, and is widely applied in electronic components, precision machinery parts, automotive parts, and the semiconductor field. [Features] - Enables ultra-fine processing at the micron level, which is difficult with etching - Reduces initial costs by eliminating the need for molds, allowing for the formation of three-dimensional cross-sectional shapes - Widely applied in electronic components, precision machinery parts, automotive parts, and the semiconductor field *For more details, please refer to the PDF document or feel free to contact us.

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An article has been published about the case of introducing the expense reimbursement system "Rakuraku Seisan" at TSP Corporation. ~ In the case of TSP ~ Before the introduction, there were challenges such as dealing with the "paper" sent from various locations and the reliance on specific individuals for the tasks. After the introduction, the input and checking of FB data, which used to take 2 to 3 hours, can now be completed in just 5 minutes. Additionally, the mindset of the accounting department, which was previously reliant on manual entry, has changed. [Case Overview] ■ Challenges before introduction - Dealing with "paper" sent from various locations, reliance on specific individuals ■ Key points of introduction - A robust support system for setup and operation - Easy to start from a small scale both financially and functionally *For more details, please refer to the related links or feel free to contact us.

The facility operating the nurse call system has made the bed exit sensor wireless, allowing it to notify in conjunction with the nurse call. By simply connecting the mat sensor "Foldable Thin Matt-kun," the body movement call "Ugo-kun," and the wheelchair body movement call "Ayumi-chan" to the transmitter HB-RS, you can make the bed exit sensor wireless. The infrared sensor "Just Place Pole-kun" has the transmitter HB-RS built-in. 【Features】 ○ Wireless conversion by simply connecting existing sensors to the transmitter HB-WSK. ○ The bed exit sensor notifies wirelessly in conjunction with the nurse call. ○ Up to 5 transmitters can be registered with one receiver. ○ The communication distance between the transmitter and receiver is approximately 10 meters. ◎ For more details, please contact us or download the catalog.

Full and empty management refers to the real-time display of parking availability and the management of efficient use of parking spaces. By utilizing Hotron's sensors, drivers can quickly discover available parking spaces, achieving efficient parking lot operations. ■ For large parking lots, the "floor management method" and "block management method," which focus on cost reduction, are recommended. Sensors are installed at regular intervals to count the number of vehicles passing through. This method offers the advantage of easy installation and low costs. 【Target Products】 - Vehicle Count Sensor CCS2 - Ultrasonic Sensor HM-UX2/UW2 ■ For smaller scale operations, the "space management method," which installs sensors in each parking space to display availability with high accuracy, is recommended. By ensuring accurate full and empty displays, it helps prevent unnecessary entry of new vehicles and enables safe parking lot operations. 【Target Products】 - Occupancy Detection Sensor HM-UX2/UW2 - Occupancy/Pass Detection Sensor HM-LC6 - Occupancy Detection Sensor HM-LC7/LC7-FLS - Occupancy/Pass Detection Sensor HM-S6 - Occupancy Detection Sensor HM-S8

The non-contact beam touch sensor "HA-T401/HA-T520" has a compact detection range, making it an ideal automatic door sensor for installation on automatic doors facing narrow corridors or busy streets. Depending on the application and installation location, you can choose between "non-vision mounting type" and "non-vision built-in type." 【Features】 ● With the beam touch sensor, you can open and close the automatic door simply by bringing your hand close without touching it, ensuring hygiene. ● Depending on the installation environment, such as single sliding or bi-parting doors, the detection range can be set in four configurations: left, center, right, and a total of 12 spots. ● Two types of activation row settings are available to reduce unnecessary opening and closing of the automatic door due to cross traffic, contributing to energy-saving effects. ● The touch switch and infrared sensor are integrated, allowing for a switch between beam touch and infrared sensor with a single model. 【Recommended for such locations!】 ☑ Entrance facing a busy corridor ☑ Counter or sign near the door ☑ Buildings facing narrow corridors ☑ Buildings that prioritize aesthetics ☑ Hospitals and facilities that consider hygiene ☑ Large facilities with many doors ◎ For more details, please download the materials or contact us.

Japan is one of the top 10 countries in the world with frequent earthquakes. The 2020 White Paper on Land, Infrastructure, Transport and Tourism has also reported an increase in the probability of major earthquakes occurring. Regarding the Nankai Trough earthquake, the probability of an earthquake with a magnitude of 8 to 9 occurring within the next 30 years is estimated to be 70 to 80%. At Hotron, we recommend the introduction of seismic devices for earthquake countermeasures in buildings and equipment. The seismic device 'HK-2' is a product that automatically performs various controls that have been pre-set when it detects strong shaking equivalent to a seismic intensity of 5 lower or higher. For example, it can automatically execute actions such as: "Open automatic doors and gates to secure evacuation routes and access for emergency vehicles" "Transmit signals to the control room and stop facility equipment" "Unlock the keys to locked lockers" "Automatically play voice guidance" For more details, please download the materials or contact us.