【TTL】Microfabrication technology! Applying technologies such as electroplating, silicon etching, and glass etching to the development of various advanced technologies!

Forming bumps (micro-protrusions) with a minimum diameter of Φ20µm at the terminal section of the FPC. The bumps are used as contact points and applied in high-precision circuit inspections, etc. (Flexible substrate)

The bump FPC is a bump generation technology that our company specializes in, applied to the FPC. When combined with our contact clips and hand presses, it is ideal for testing fine-pitch insertion terminals and display lighting tests. *For more details, please refer to the PDF materials or feel free to contact us. #Flexible #FPC #FlexibleCircuitBoard #FlexiblePrintedCircuitBoard #CircuitBoard #PrintedCircuitBoard #Special #Bump #ShortLeadTime #MassProduction

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Micron-level ultra-fine processing is possible! It is widely applied in fields such as electronic components and semiconductors.

"Electroforming" is a technology that forms metal products with high precision by depositing a nickel plating layer through electroplating. There are three types of cross-sectional shapes to choose from: the "overhang type," which deposits the product to cover the photoresist; the "straight type," which has a linear thickness direction; and the "laminated type," which consists of multiple layers. It enables ultra-fine processing at the micron level, which is difficult with etching, and is widely applied in electronic components, precision machinery parts, automotive parts, and the semiconductor field. [Features] ■ Enables ultra-fine processing at the micron level, which is difficult with etching ■ Reduces initial costs by eliminating the need for molds, allowing for the formation of three-dimensional cross-sectional shapes ■ Widely applied in electronic components, precision machinery parts, automotive parts, and the semiconductor field *For more details, please refer to the PDF document or feel free to contact us.

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【Basic Knowledge - PowerPoint Version Download Available!】The standard manufacturing process of Taiyo Kogyo, which has focused on small quantities and a wide variety, has been compiled into a document!

This document introduces the manufacturing process of FPC (Flexible Printed Circuit) conducted by Taiyo Kogyo Co., Ltd. A PowerPoint version has been added! * The PowerPoint version can be downloaded from 'Sample Software'. How are flexible printed circuit boards made? This material is for those who want to learn about FPC. It explains the manufacturing process after the design of standard specification FPC. [Contents (excerpt)] ■ Exposure ■ Through-hole drilling ■ Copper plating ■ Dry film lamination ■ Exposure * The download will provide a PDF version. * The PowerPoint version can be downloaded from 'Sample Software'. [The urban development and medical food technology site will only provide a PDF version] #CircuitBoard #FlexiblePrintedCircuitBoard #FlexibleCircuitBoard #FPC #Flex #BasicKnowledge

• Piping and electrical wiring materials
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Ultra-fine lines, high density, and high-definition flexible printed circuit boards have made it possible to form ultra-fine circuits through the fusion of MSAP technology and via filling techniques!

The miniaturization and high functionality of electronic devices are advancing, and along with this, there is a demand for finer circuit formation. One method for forming wiring by etching copper foil (subtractive method) and a high-resolution circuit formation method is to form wiring by plating on ultra-thin copper foil (semi-additive method). The method we are introducing this time is one of the semi-additive methods, called "MSAP (Modified Semi Additive Process)." By using the MSAP method, it has become possible to achieve ultra-fine lines and high-density pattern formation, which is difficult with the subtractive method. Additionally, by combining it with the "via filling technology," which fills through-hole holes with copper plating, it becomes possible to create wiring on the through-holes, further increasing wiring density. **Features of the MSAP Method:** - Circuit formation through plating deposition enables high-precision fine wiring. - Excellent rectangularity of wiring cross-section contributes to reduced transmission loss. - Superior for high-frequency substrates/IC mounting. By merging these two processing technologies, we have realized "ultra-fine high-density FPC." #FlexibleSubstrate #Substrate #HighResolutionSubstrate #Flex #FlexiblePrintedCircuitBoard

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Surface treatment with plating to prevent light reflection, enabling micron-level ultra-fine processing! It is widely applied in fields such as electronic components and semiconductors.

"Electroforming" is a technology that deposits a nickel plating layer through electroplating to form metal products with high precision. There are three types of cross-sectional shapes to choose from: the "overhang type," where the product is deposited to cover the photoresist; the "straight type," which has a linear thickness shape; and the "laminated type," which consists of multiple layers. It enables ultra-fine processing at the micron level, which is difficult with etching, and is widely applied in electronic components, precision machinery parts, automotive parts, and the semiconductor field. [Features] - Enables ultra-fine processing at the micron level, which is difficult with etching - Reduces initial costs by eliminating the need for molds, allowing for the formation of three-dimensional cross-sectional shapes - Widely applied in electronic components, precision machinery parts, automotive parts, and the semiconductor field *For more details, please refer to the PDF document or feel free to contact us.

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We have newly added the "RB Catcher," a log capture device installed on impermeable sediment control dams in flow sections, to our product lineup and have started sales. The RB Catcher is directly attached to the upstream part of the impermeable sediment control dam to enhance log capture functionality. Unlike the conventional straight arrangement, it features a structural layout that creates gaps between units, ensuring that water flow is maintained without causing blockages after capturing logs. This allows for the reliable capture of subsequent logs without overflow, preventing damage downstream. By adding this new log capture device to our lineup, we will flexibly respond to various needs in the field.

This time, the ACS-5000 is available as a facial recognition terminal compatible with FaceMe Security's add-on feature "Face Terminal," enabling access control management that combines "advanced anti-spoofing features" with high-speed facial recognition powered by edge AI. ■ Main Features 1. Accelerated Authentication Processing FaceMe Security is optimized for the MediaTek Genio 700's NPU, achieving faster facial recognition processing and reduced CPU load compared to processing with only the CPU. It ensures stable authentication without delays even during peak times, such as clocking in and out, contributing to alleviating congestion. 2. Advanced "Anti-Spoofing" Optimized for the IR + RGB camera mounted on the ACS-5000. It can quickly detect fraudulent authentication using photos, videos, or 3D masks within 0.6 seconds, ensuring reliable identity verification. 3. Door Control Without Additional Equipment FaceMe Security can directly control the digital I/O of the ACS-5000, allowing for the construction of an access control management system without the need for additional equipment. This simplifies system configuration and reduces implementation costs.

Do you have any concerns or requests regarding wired bed exit sensors? × Tangling or tripping over wired cables × Cable disconnection or damage × Worrying about forgetting to turn the switch back on after temporarily stopping the sensor. × Wanting to be notified of bed exits even from a location far from the nurse call outlet. Such concerns can be resolved simply by connecting our wireless nurse call linked set to the sensor! Our wireless nurse call linked set allows you to connect bed exit sensors like "Ugo-kun," "Foldable Thin Matta-kun," "Ayumi-chan," and "Just Place Pole-kun" to transmitters and receivers, reducing wiring around the bed area, alleviating concerns about tripping or falling due to cables, and contributing to a tidier work environment. Furthermore, it enables the use of bed exit sensors even from locations far from the nurse call outlet, allowing for more flexible equipment placement.

The non-contact beam touch sensor "HA-T401/HA-T520" has a compact detection range, making it an ideal automatic door sensor for installation on automatic doors facing narrow corridors or busy streets. Depending on the application and installation location, you can choose between "non-vision mounting type" and "non-vision built-in type." 【Features】 ● With the beam touch sensor, you can open and close the automatic door simply by bringing your hand close without touching it, ensuring hygiene. ● Depending on the installation environment, such as single sliding or bi-parting doors, the detection range can be set in four configurations: left, center, right, and a total of 12 spots. ● Two types of activation row settings are available to reduce unnecessary opening and closing of the automatic door due to cross traffic, contributing to energy-saving effects. ● The touch switch and infrared sensor are integrated, allowing for a switch between beam touch and infrared sensor with a single model. 【Recommended for such locations!】 ☑ Entrance facing a busy corridor ☑ Counter or sign near the door ☑ Buildings facing narrow corridors ☑ Buildings that prioritize aesthetics ☑ Hospitals and facilities that consider hygiene ☑ Large facilities with many doors ◎ For more details, please download the materials or contact us.

The receiver section of the radio is designed to receive signals properly even when influenced by other radios used in the world, and standards have been established for this purpose, requiring designs that comply with these standards. This time, I will briefly discuss the wireless standards for the receiver section! 【Contents】 ■ Minimum reception sensitivity ■ Adjacent channel selectivity ■ Receiver intermodulation ■ Spurious response ■ Harmonic emission * For more details, please refer to the PDF document or feel free to contact us.