【TTL】Microfabrication technology! Applying technologies such as electroplating, silicon etching, and glass etching to the development of various advanced technologies!

Forming bumps (micro-protrusions) with a minimum diameter of Φ20µm at the terminal section of the FPC. The bumps are used as contact points and applied in high-precision circuit inspections, etc. (Flexible substrate)

The bump FPC is a bump generation technology that our company specializes in, applied to the FPC. When combined with our contact clips and hand presses, it is ideal for testing fine-pitch insertion terminals and display lighting tests. *For more details, please refer to the PDF materials or feel free to contact us. #Flexible #FPC #FlexibleCircuitBoard #FlexiblePrintedCircuitBoard #CircuitBoard #PrintedCircuitBoard #Special #Bump #ShortLeadTime #MassProduction

• others

Micron-level ultra-fine processing is possible! It is widely applied in fields such as electronic components and semiconductors.

"Electroforming" is a technology that forms metal products with high precision by depositing a nickel plating layer through electroplating. There are three types of cross-sectional shapes to choose from: the "overhang type," which deposits the product to cover the photoresist; the "straight type," which has a linear thickness direction; and the "laminated type," which consists of multiple layers. It enables ultra-fine processing at the micron level, which is difficult with etching, and is widely applied in electronic components, precision machinery parts, automotive parts, and the semiconductor field. [Features] ■ Enables ultra-fine processing at the micron level, which is difficult with etching ■ Reduces initial costs by eliminating the need for molds, allowing for the formation of three-dimensional cross-sectional shapes ■ Widely applied in electronic components, precision machinery parts, automotive parts, and the semiconductor field *For more details, please refer to the PDF document or feel free to contact us.

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【Basic Knowledge - PowerPoint Version Download Available!】The standard manufacturing process of Taiyo Kogyo, which has focused on small quantities and a wide variety, has been compiled into a document!

This document introduces the manufacturing process of FPC (Flexible Printed Circuit) conducted by Taiyo Kogyo Co., Ltd. A PowerPoint version has been added! * The PowerPoint version can be downloaded from 'Sample Software'. How are flexible printed circuit boards made? This material is for those who want to learn about FPC. It explains the manufacturing process after the design of standard specification FPC. [Contents (excerpt)] ■ Exposure ■ Through-hole drilling ■ Copper plating ■ Dry film lamination ■ Exposure * The download will provide a PDF version. * The PowerPoint version can be downloaded from 'Sample Software'. [The urban development and medical food technology site will only provide a PDF version] #CircuitBoard #FlexiblePrintedCircuitBoard #FlexibleCircuitBoard #FPC #Flex #BasicKnowledge

• Piping and electrical wiring materials
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Ultra-fine lines, high density, and high-definition flexible printed circuit boards have made it possible to form ultra-fine circuits through the fusion of MSAP technology and via filling techniques!

The miniaturization and high functionality of electronic devices are advancing, and along with this, there is a demand for finer circuit formation. One method for forming wiring by etching copper foil (subtractive method) and a high-resolution circuit formation method is to form wiring by plating on ultra-thin copper foil (semi-additive method). The method we are introducing this time is one of the semi-additive methods, called "MSAP (Modified Semi Additive Process)." By using the MSAP method, it has become possible to achieve ultra-fine lines and high-density pattern formation, which is difficult with the subtractive method. Additionally, by combining it with the "via filling technology," which fills through-hole holes with copper plating, it becomes possible to create wiring on the through-holes, further increasing wiring density. **Features of the MSAP Method:** - Circuit formation through plating deposition enables high-precision fine wiring. - Excellent rectangularity of wiring cross-section contributes to reduced transmission loss. - Superior for high-frequency substrates/IC mounting. By merging these two processing technologies, we have realized "ultra-fine high-density FPC." #FlexibleSubstrate #Substrate #HighResolutionSubstrate #Flex #FlexiblePrintedCircuitBoard

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Surface treatment with plating to prevent light reflection, enabling micron-level ultra-fine processing! It is widely applied in fields such as electronic components and semiconductors.

"Electroforming" is a technology that deposits a nickel plating layer through electroplating to form metal products with high precision. There are three types of cross-sectional shapes to choose from: the "overhang type," where the product is deposited to cover the photoresist; the "straight type," which has a linear thickness shape; and the "laminated type," which consists of multiple layers. It enables ultra-fine processing at the micron level, which is difficult with etching, and is widely applied in electronic components, precision machinery parts, automotive parts, and the semiconductor field. [Features] - Enables ultra-fine processing at the micron level, which is difficult with etching - Reduces initial costs by eliminating the need for molds, allowing for the formation of three-dimensional cross-sectional shapes - Widely applied in electronic components, precision machinery parts, automotive parts, and the semiconductor field *For more details, please refer to the PDF document or feel free to contact us.

• others

An article about the resin-based lightweight formwork system "PERI DUO" has been published in the "Construction News" (November 7, 2025)! "PERI DUO" is a new system formwork made of resin that can be used for walls. It is made from a newly developed material called "Politec," which is high-strength and lightweight. With fewer components, it is easy to handle. It allows for increased reuse and is an environmentally friendly lightweight formwork that is flexible on the construction site! 【DUO Product Features】 ■ New system formwork made of resin ■ High strength and lightweight ■ Fewer components and easy to handle ■ 100% recyclable *For more details about this product, please feel free to contact us. PERI Japan Co., Ltd.

[To the owners of parking lots and parking lot construction companies] "I'm worried about not colliding with pedestrians when leaving the parking lot in my car..." Among vehicle entrances to parking lots, stores, residences, and factories, those particularly facing sidewalks or roadways are expected to pose risks of dangerous incidents such as collisions with pedestrians or between vehicles. To alleviate such concerns, Hotron proposes a [Departure Warning Sensor] that detects vehicle departures using various sensors and alerts the surroundings with LED lights and buzzers. The device consists of a simple configuration of "Sensor" + "Controller" + "Switching Power Supply (24V)" + "LED Rotating Light." *Please note that a separate control panel including the controller and switching power supply (24V) is required when using the departure warning system. *We kindly ask customers to arrange for the switching power supply (24V), LED rotating light, control panel, circuit breakers, etc. Since it can be retrofitted, it can also be used for existing parking lot entrances. We hope this will contribute to safer vehicle passage for everyone. ◎ For more details, please contact us or download the catalog.

【New Product Announcement】 UV - Ultra-Compact Irradiator LSP26FUV Series Released High intensity yet compact, a palm-sized cube-type ultra-compact UV irradiator. It offers a variety of UV wavelengths and can be used for a wide range of applications. Due to its compact size that fits in the palm of your hand, it is very convenient for simple inspections and research experiments, as well as other small tasks. *Details about the product features and specifications are currently being prepared. They will be published soon, so please wait a little longer. For more information, please feel free to contact us.

Japan Aluminum Co., Ltd. will exhibit at the High-Performance Materials Week "Adhesive and Joining EXPO" ~Proposing solutions for joining aluminum and resin~ This exhibition is one of the events that make up the "High-Performance Materials Week," which features cutting-edge material technologies, and is one of the largest comprehensive exhibitions in Japan for adhesives, joining machines, and fastening technologies. The Japan Aluminum Group will showcase various functional surface treatments currently under development, focusing on the joining solution PAL-fit for aluminum and resin. We sincerely look forward to your visit and hope you take this opportunity to see our offerings. https://www.nikkeikinholdings.co.jp/news/news/p2025110501hd.html Event Dates: November 12 (Wed) to 14 (Fri), 2025 10:00 AM to 6:00 PM (Ends at 5:00 PM on the final day) Venue: Makuhari Messe Hall 7 (Chiba City, Chiba Prefecture) Our Booth: Hall 7, 42-26

In recent years, with the increasing push for DX (digital transformation) and valuable feedback from all users in the field, we will be fully renewing "Compass PLUS." The new Compass PLUS will leverage its traditional strengths while completely revamping its design, functionality, and usability, thereby further enhancing its value in practical use. The official release is as follows, so please wait a little longer until then. 1) Improved visibility and operability 2) Enhanced intuitiveness 3) Streamlined information sharing These are the main points of improvement, and it will be available starting December 16, 2025. For an overview of the renewal, please download the materials. We are also planning an online briefing session, so please download the materials for more details as well. Renewal date: Tuesday, December 16, 2025 Temporary suspension period: Monday, December 15, 2025, 17:00 – 19:00 *Due to the renewal, data updates for observation devices (wave height, weather, water level, noise and vibration) will be suspended during the temporary suspension period. However, viewing of forecast information and other various information will still be possible as usual.