【TTL】Microfabrication technology! Applying technologies such as electroplating, silicon etching, and glass etching to the development of various advanced technologies!

Forming bumps (micro-protrusions) with a minimum diameter of Φ20µm at the terminal section of the FPC. The bumps are used as contact points and applied in high-precision circuit inspections, etc. (Flexible substrate)

The bump FPC is a bump generation technology that our company specializes in, applied to the FPC. When combined with our contact clips and hand presses, it is ideal for testing fine-pitch insertion terminals and display lighting tests. *For more details, please refer to the PDF materials or feel free to contact us. #Flexible #FPC #FlexibleCircuitBoard #FlexiblePrintedCircuitBoard #CircuitBoard #PrintedCircuitBoard #Special #Bump #ShortLeadTime #MassProduction

• others

Micron-level ultra-fine processing is possible! It is widely applied in fields such as electronic components and semiconductors.

"Electroforming" is a technology that forms metal products with high precision by depositing a nickel plating layer through electroplating. There are three types of cross-sectional shapes to choose from: the "overhang type," which deposits the product to cover the photoresist; the "straight type," which has a linear thickness direction; and the "laminated type," which consists of multiple layers. It enables ultra-fine processing at the micron level, which is difficult with etching, and is widely applied in electronic components, precision machinery parts, automotive parts, and the semiconductor field. [Features] ■ Enables ultra-fine processing at the micron level, which is difficult with etching ■ Reduces initial costs by eliminating the need for molds, allowing for the formation of three-dimensional cross-sectional shapes ■ Widely applied in electronic components, precision machinery parts, automotive parts, and the semiconductor field *For more details, please refer to the PDF document or feel free to contact us.

• others

【Basic Knowledge - PowerPoint Version Download Available!】The standard manufacturing process of Taiyo Kogyo, which has focused on small quantities and a wide variety, has been compiled into a document!

This document introduces the manufacturing process of FPC (Flexible Printed Circuit) conducted by Taiyo Kogyo Co., Ltd. A PowerPoint version has been added! * The PowerPoint version can be downloaded from 'Sample Software'. How are flexible printed circuit boards made? This material is for those who want to learn about FPC. It explains the manufacturing process after the design of standard specification FPC. [Contents (excerpt)] ■ Exposure ■ Through-hole drilling ■ Copper plating ■ Dry film lamination ■ Exposure * The download will provide a PDF version. * The PowerPoint version can be downloaded from 'Sample Software'. [The urban development and medical food technology site will only provide a PDF version] #CircuitBoard #FlexiblePrintedCircuitBoard #FlexibleCircuitBoard #FPC #Flex #BasicKnowledge

• Piping and electrical wiring materials
• others

Ultra-fine lines, high density, and high-definition flexible printed circuit boards have made it possible to form ultra-fine circuits through the fusion of MSAP technology and via filling techniques!

The miniaturization and high functionality of electronic devices are advancing, and along with this, there is a demand for finer circuit formation. One method for forming wiring by etching copper foil (subtractive method) and a high-resolution circuit formation method is to form wiring by plating on ultra-thin copper foil (semi-additive method). The method we are introducing this time is one of the semi-additive methods, called "MSAP (Modified Semi Additive Process)." By using the MSAP method, it has become possible to achieve ultra-fine lines and high-density pattern formation, which is difficult with the subtractive method. Additionally, by combining it with the "via filling technology," which fills through-hole holes with copper plating, it becomes possible to create wiring on the through-holes, further increasing wiring density. **Features of the MSAP Method:** - Circuit formation through plating deposition enables high-precision fine wiring. - Excellent rectangularity of wiring cross-section contributes to reduced transmission loss. - Superior for high-frequency substrates/IC mounting. By merging these two processing technologies, we have realized "ultra-fine high-density FPC." #FlexibleSubstrate #Substrate #HighResolutionSubstrate #Flex #FlexiblePrintedCircuitBoard

• others

Surface treatment with plating to prevent light reflection, enabling micron-level ultra-fine processing! It is widely applied in fields such as electronic components and semiconductors.

"Electroforming" is a technology that deposits a nickel plating layer through electroplating to form metal products with high precision. There are three types of cross-sectional shapes to choose from: the "overhang type," where the product is deposited to cover the photoresist; the "straight type," which has a linear thickness shape; and the "laminated type," which consists of multiple layers. It enables ultra-fine processing at the micron level, which is difficult with etching, and is widely applied in electronic components, precision machinery parts, automotive parts, and the semiconductor field. [Features] - Enables ultra-fine processing at the micron level, which is difficult with etching - Reduces initial costs by eliminating the need for molds, allowing for the formation of three-dimensional cross-sectional shapes - Widely applied in electronic components, precision machinery parts, automotive parts, and the semiconductor field *For more details, please refer to the PDF document or feel free to contact us.

• others

We would like to inform you that, in order to further strengthen and enhance our sales and service operations, there will be changes to our Nagoya Sales Office as of April 1st, as detailed below. ■ Relocation of Nagoya Sales Office 【New Address】 〒460-0003 6th Floor, Sando Building, 1-7-27 Nishiki, Naka Ward, Nagoya City, Aichi Prefecture TEL: 052-212-6520 / FAX: 052-212-6521 *Please note that the TEL and FAX numbers will also change. Taking this opportunity, all of our staff will continue to make even greater efforts. Please feel free to contact us.

We will introduce the implementation results of the sensor technology developed by the Hotron Group, which has been cultivated over more than half a century, through customer case studies. In addition to automatic door sensors, we also offer a wide range of vehicle detection sensors and nursing/care sensors. We have many implementation examples available, so please take a look at the case study page.

iPick Co., Ltd., a partition manufacturer, will explain the definition of non-combustible materials under the Building Standards Act and their importance in office interiors. Fire-resistant materials are classified into three categories: non-combustible, quasi-non-combustible, and flame-retardant, based on safety during a fire. At iPick, we handle aluminum partitions that have received non-combustible certification, demonstrating high fire resistance, which is required by "interior restrictions" depending on the size and use of the building. Selecting appropriate materials is crucial not only for protecting the lives of employees but also from the perspective of asset protection and business continuity planning (BCP). We propose the creation of safe spaces that balance compliance with regulations and design. ＊＊＊＊＊＊＊＊＊＊＊＊＊＊＊＊＊＊＊ For the design and construction of interior partitions from offices to toilet booths, leave it to iPick, the partition specialist manufacturer! "We are accepting reservations for live office and showroom tours." 6F NMF Kanda Iwamotocho Building, 3-8-16 Iwamotocho, Chiyoda-ku, Tokyo For inquiries, feel free to contact our toll-free number 0120-020-720 (Weekdays 10:00 AM to 5:00 PM)!

JECA FAIR 2026 will be exhibiting at the 74th Electrical Installation Industry Exhibition. Dates: May 27, 28, 29 Venue: Tokyo Big Sight, Halls 1, 2, 3, and 8 We look forward to your visit.

The JRE Disaster Assessment Support System Gragram, jointly developed by Hakusan Industrial Co., Ltd. (Headquarters: Fuchu City, Tokyo, President: Minoru Yoshida https://www.hakusan.co.jp/) and JR East Japan Architectural Design Co., Ltd. (Headquarters: Shibuya City, Tokyo, President: Yoshihiko Ito https://www.jred.co.jp/), has been implemented in all buildings of the TAKANAWA GATEWAY CITY, which will have its grand opening on March 28, 2026, and OIMACHI TRACKS, which will open to the public. For more details, please refer to the link below.