Exhibiting at SEMICON Japan 2024 - Sain Japan Co., Ltd.

A stainless steel coupling developed specifically for liquid cooling systems used in semiconductor manufacturing processes.

The Sain Ultra Flow SC is a special version of the Ultra Flow with a screw connection or double ferrule tube fitting. It is specially designed for liquid cooling systems used in semiconductor manufacturing processes and is made of stainless steel. Its flat-face design prevents liquid dripping during attachment and detachment, effectively preventing contamination in clean environments and leakage of refrigerants with high global warming potential. Additionally, its low pressure loss and high flow characteristics contribute to improving the overall energy efficiency of the system.

• Heat exchanger

Minimal air intrusion and leak-free attachment and detachment. Compact auto-coupling suitable for integration into server racks.

Designed for thermal management applications that require minimal air ingress and leak-free attachment and detachment. The unique design prevents damage to seals during attachment and detachment under pressure, ensuring a highly airtight fit. Automatic alignment features enable blind connections. Made from durable and corrosion-resistant stainless steel and hardened anodized aluminum alloy. The temperature range for the specially developed nitrile (NBR) seals in this series is -40°C to 80°C. EPDM seals are also available.

• others

Universal standard for high-efficiency quick disconnects for liquid cooling systems.

The Universal Quick Disconnect (UQD) was developed as a global standard for quick disconnect couplings within the Open Compute Project (OPC). UQD is an open standard for leak-free quick couplings for data center liquid cooling, developed under the leadership of Intel. Being an open standard, any manufacturer's products can be connected as long as they comply with the UQD specification. With years of experience in providing high-quality quick connect couplings that meet a wide range of applications through precise manufacturing, our UQD couplings not only comply with the standard but exceed its specifications.

• Other Batteries

TEAM SPEC / Compliant with STANAG 3756, no liquid leakage. Coupling for liquid transfer.

Smart Flow Drive Lake Couplings are designed to support safe, efficient, and environmentally friendly fluid transfer in harsh environments where safety is a priority. With minimal components and no need for additional valves, they allow for leak-free connections and disconnections, saving both time and costs. They are commonly used in AdBlue distribution, road and rail tankers, offshore applications, marine bunkering, and IBC filling. Smart Flow Couplings feature a safety factor of five times the operating pressure of 2.5 MPa, regardless of size or material. This is unique in the industry, and for applications requiring higher pressures, you can choose Smart Flow aluminum units as a lighter and more cost-effective alternative to competitors' stainless steel units. Compliance with TEAM SPEC and STANAG 3756 standards ensures compatibility with products from other manufacturers. Additionally, FDA-approved O-rings are available to meet the stringent safety and hygiene standards required for use in food and beverage manufacturing.

• Other Batteries

Coupling for chiller piping of semiconductor manufacturing equipment.

The key to successful thermal management is operational time and reliability. Therefore, high-quality products designed to ensure long-term reliability are necessary. UltraFlow is a quick coupling for liquid-cooled high-performance electronics, featuring a flat face design that prevents liquid leakage and offers excellent durability. It achieves improved lifespan of cooling systems and reduced running costs with high flow characteristics and low pressure loss.

• Other Batteries

Screw-type connection coupling for cooling water circulation devices (CDU)

The Ultra Flow STC Screw-to-Connect Coupling is a large-diameter version of the Ultra Flow series that prevents liquid dripping. Due to its large diameter and high flow rate, significant force is required for connection; however, the Ultra Flow STC overcomes this by using a screw-in design, making it easy to connect. Like other products in the Ultra Flow series, it features excellent characteristics such as high durability, extremely low pressure loss, and no liquid dripping. By combining our years of experience in drip-free hydraulic couplings with new technology in liquid cooling, we have created an efficient quick-connect coupling based on a proven design.

• Other Batteries

● No liquid leakage ● Three safety features available as options ● Usable up to 315℃

The Sain water and various liquid non-drip coupling can be connected with a simple one-touch action (just push the nipple into the coupling), and thanks to its unique valve design, there is absolutely no liquid leakage during disconnection. Additionally, if safety is a concern, three types of safety features are available as options: 1. Color coding for easy identification of liquids and pressure, 2. Key codes to prevent incorrect port connections, and 3. A safety lock mechanism to prevent unexpected disconnections. By choosing Calretz as the sealing material, it can be used at temperatures up to 315°C. Furthermore, upon request, couplings and nipples without built-in valves can also be used as standard.

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Fujikohsuhou Industrial Co., Ltd. will hold an online seminar titled "Tips for Setting Laser Hardening Conditions" on July 20, 2025 (Wednesday). In laser hardening, factors such as output and speed are related to the quality of hardening. We will explain how output and speed are connected to quality factors. This seminar is aimed at those who are looking to start utilizing laser hardening. 【Recommended for】 ■ Those who want to learn about methods for setting laser hardening conditions ■ Those who want to obtain technical information about laser hardening

Take the 'first step' in DX talent development in Fukuoka. We will hold a free seminar where you can learn reskilling strategies that can be applied in the field through case studies and experiences! 'I've become responsible for DX, but I don't know where to start.' This is a participatory seminar aimed at representatives from small and medium-sized enterprises in Fukuoka City, Fukuoka Prefecture, where you can learn the 'first steps' in DX talent development and implementation support. While introducing case studies of representative DX tools such as Power Automate and Power BI, you will experience hands-on sessions with Copilot, allowing you to grasp practical small-start methods that can be implemented on-site. The content also includes specific success stories from the Fukuoka region, along with tips for promoting understanding and advancement within your organization.

We will be exhibiting at INCHEM TOKYO 2025, which will be held at Tokyo Big Sight from September 17 (Wednesday) to September 19 (Friday). This time, we will host many events, including special project stages and mini-seminars. At our booth, we will introduce our solutions and technologies based on the theme of "Sustainable Plant Engineering" from three different concepts. Please be sure to stop by our booth, East Hall 6, K-17.

The Siemens EDA Tech Forum is a technical event aimed at sharing the latest technological trends, case studies, and solutions to challenges with everyone involved in the design and development of silicon systems and electronic systems, while addressing evolving technologies, the densification and complexity of designs, and various design challenges, all while meeting requirements for quality, safety, and reliability. The goal is to deepen insights and networks towards achieving sustainable business. The forum covers a wide range of topics, from advanced design technologies and methods in fields such as 3D ICs, chiplets, chips for AI and ML (machine learning), and IC packaging, to the design, analysis, and collaborative development of electronic systems, including printed circuit boards, across multiple domains, as well as building ecosystems both internally and externally using digital threads. Through case presentations and explanations of design methods by industry leaders, it supports solutions to challenges faced in daily design work from all directions. This is a free technical event that requires pre-registration. We hope you will participate!

The TOPPAN Group, consisting of TOPPAN Edge Inc., TOPPAN Digital Inc., and AiOi System Co., Ltd., will hold a co-hosted webinar aimed at solving challenges in the logistics field on August 20, 2025 (Wednesday). In this webinar, we will introduce a wealth of immediately useful information, including key points of the Comprehensive Logistics Efficiency Act, practical approaches to logistics DX through data utilization, and examples of improvements using subsidies. ▼ Recommended for: - Personnel facing challenges in logistics data analysis for business improvement - Logistics companies aiming to optimize warehouse operations and improve productivity - Companies interested in learning about logistics improvement cases utilizing subsidies - Companies considering the use of RFID in logistics operations ▼ Event Overview Date and Time: August 20, 2025 (Wednesday) 14:00–15:00 Format: Online (pre-registration required) Participation Fee: Free Co-hosted by: TOPPAN Edge / TOPPAN Digital / AiOi System We hope this seminar will serve as an opportunity to consider "what to start with and how to proceed" regarding the challenges faced by the logistics industry. We sincerely look forward to your participation.