Henkel Japan will showcase coatings, adhesives, and glues that contribute to sustainability at TOKYO PACK 2024.

Henkel Japan's Packaging Division will exhibit at "TOKYO PACK 2024 - Tokyo International Packaging Exhibition 2024," showcasing paper coatings and various adhesives and glues that contribute to sustainability.
At the Henkel booth, we will introduce paper coatings that serve as alternatives to plastic, as part of our efforts to reduce plastic usage, as well as soft packaging coatings that can reduce sealant film usage. We will also propose solvent-free adhesives and barrier coatings as part of our initiatives to reduce CO2 emissions. Additionally, we will present content from our exhibitions at drupa 2024 held in Germany this June and Labelexpo Americas 2024 held in the United States last month.
<Exhibition Content>
■ AQUENCE EPIX Series [Demonstration]
■ LOCTITE LIOFOL Solvent-Free Adhesive for Soft Packaging Laminates [New Product]
■ LOCTITE LIOFOL Series Coatings [New Product]
■ TECHNOMELT PS Series
■ AQUENCE PS Series

Date and time | Wednesday, Oct 23, 2024 ~ Friday, Oct 25, 2024 10:00 AM ~ 05:00 PM |
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Capital | Tokyo Big Sight East Halls 1 to 6 |
Entry fee | Charge 1,000 yen (including tax) However, it is free if you register in advance on the web. |
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