Starting today! Collaborative Robot UR Online Exhibition Fall 2024

A compact collaborative robot arm with a load capacity of 30kg!

The UR30 is a high-performance collaborative robot with a payload capacity of 30 kg and a reach of 1300 mm. Despite its 30 kg payload capacity, its compact size allows it to handle heavy objects in limited spaces, making it suitable for tasks such as machine tending and palletizing.

• Palletizing System

High-performance collaborative robot arm with a load capacity of 20kg!

The UR20 is a high-performance collaborative robot with a payload capacity of 20 kg and a reach of 1750 mm. It can be used for a variety of applications, from palletizing to machine loading.

• Palletizing System

Collaborative robot with a movable weight of 16kg!

The Universal Robots e-series has a payload capacity of 16kg and a reach radius of 900mm. We provide an ecosystem of UR robots and peripheral devices for users considering highly flexible automation with an eye toward the future, enabling collaborative technological innovations, achieving a high level of user satisfaction from the perspective of the user, and catering to various applications.

• Palletizing System

A robot arm ideal for automating lightweight processes with a lifting capacity of 5kg and a reach radius of 850mm!

The UR5e from Universal Robots has a payload capacity of 5kg and a reach radius of 850mm. It is ideal for automating lightweight processes. Like other series, it offers quick setup and programming, but the highly customizable UR5e is designed to seamlessly integrate into any production environment, regardless of industry, company size, or product nature.

• Picking robots (shelf transport robots, arm picking robots)

Collaborative robot arm with a movable weight of 12.5 kg and a maximum reach radius of 1300 mm!

The 10e, with a lifting capacity upgraded from 10kg to 12.5kg, offers high precision with a maximum reach radius of 1300mm. It also demonstrates excellent functionality for tasks such as packaging and palletizing.

• Picking robots (shelf transport robots, arm picking robots)

Small collaborative robot arm

The UR3e is compact yet powerful. It has a payload capacity of 3 kg and a reach radius of 500 mm. All end joints can rotate 360 degrees, and the end joint at the tip can rotate indefinitely. The UR3e is ideal for assembly tasks involving lightweight components that require space-saving and precise implementation, as well as for automating tabletop tasks.

• Picking robots (shelf transport robots, arm picking robots)

In the field of food and health food research and development, an increasing number of companies are facing the following challenges: - Difficulty in exploring new functional materials and differentiation themes, leading to a depletion of research topics. - While they are collecting information from conferences and papers, they struggle to translate this into research themes directly related to their products. - They remain limited to competing similar products and follow-up projects, failing to establish uniqueness. - Although there are seeds of ideas, they struggle to elevate them to scientific hypotheses and build the necessary foundations for internal approval. Behind this lies a "wall of execution" that cannot be overcome by traditional information gathering and research processes. In this webinar, we will introduce a new R&D approach to break through these challenges. It is a next-generation research and development scheme that combines AI-driven hypothesis generation, which has achieved results in drug discovery, with scientific hypothesis verification by a food human trial CRO. This will allow for the transformation of vague ideas into scientifically verifiable projects, simultaneously achieving the construction of persuasive foundations for upper management and differentiation development.

Fujikohsuhou Industrial Co., Ltd. will hold an online seminar titled "Tips for Setting Laser Hardening Conditions" on July 20, 2025 (Wednesday). In laser hardening, factors such as output and speed are related to the quality of hardening. We will explain how output and speed are connected to quality factors. This seminar is aimed at those who are looking to start utilizing laser hardening. 【Recommended for】 ■ Those who want to learn about methods for setting laser hardening conditions ■ Those who want to obtain technical information about laser hardening

Take the 'first step' in DX talent development in Fukuoka. We will hold a free seminar where you can learn reskilling strategies that can be applied in the field through case studies and experiences! 'I've become responsible for DX, but I don't know where to start.' This is a participatory seminar aimed at representatives from small and medium-sized enterprises in Fukuoka City, Fukuoka Prefecture, where you can learn the 'first steps' in DX talent development and implementation support. While introducing case studies of representative DX tools such as Power Automate and Power BI, you will experience hands-on sessions with Copilot, allowing you to grasp practical small-start methods that can be implemented on-site. The content also includes specific success stories from the Fukuoka region, along with tips for promoting understanding and advancement within your organization.

We will be exhibiting at INCHEM TOKYO 2025, which will be held at Tokyo Big Sight from September 17 (Wednesday) to September 19 (Friday). This time, we will host many events, including special project stages and mini-seminars. At our booth, we will introduce our solutions and technologies based on the theme of "Sustainable Plant Engineering" from three different concepts. Please be sure to stop by our booth, East Hall 6, K-17.

The Siemens EDA Tech Forum is a technical event aimed at sharing the latest technological trends, case studies, and solutions to challenges with everyone involved in the design and development of silicon systems and electronic systems, while addressing evolving technologies, the densification and complexity of designs, and various design challenges, all while meeting requirements for quality, safety, and reliability. The goal is to deepen insights and networks towards achieving sustainable business. The forum covers a wide range of topics, from advanced design technologies and methods in fields such as 3D ICs, chiplets, chips for AI and ML (machine learning), and IC packaging, to the design, analysis, and collaborative development of electronic systems, including printed circuit boards, across multiple domains, as well as building ecosystems both internally and externally using digital threads. Through case presentations and explanations of design methods by industry leaders, it supports solutions to challenges faced in daily design work from all directions. This is a free technical event that requires pre-registration. We hope you will participate!