Exhibition: Tokyo - Invitation to Exhibit at TOKYO PACK 2024 (Tokyo International Packaging Exhibition)

Overwhelming lightness × high strength: Capable of stacking 1,000 kg of products in three layers! 100% recyclable and environmentally friendly.

The "Eco Board Palette" is a paper pallet with outstanding strength. It can flexibly adapt to various applications. It is available in a wide range of variations and sizes, from lightweight to ultra-heavy, and size changes can be made freely. Additionally, no wooden or metal molds are required. It contributes to environmental considerations under the "SDGs" and to "White Logistics" through palletization! 【Features】 ■ Strong compression and bending strength ■ Improved workability ■ No fumigation or disinfection required ■ Strong in high humidity ■ 100% recyclable ■ Stable manufacturing through mechanization *For more details, please download the PDF or contact us.

• Material handling systems and equipment

No disinfection or fumigation required for export. Suitable for packaging of bundled items, rolls, precision parts, and large, heavy products! Despite being made of paper, it can also accommodate heavy items (over 1000 kg).

The "Eco Board Sleeve Set" is a comprehensive packaging system that does not require disinfection or fumigation during export. Unlike wooden packaging, it does not use nails, making assembly and disassembly easy. Since all components, including the pallet, sleeve, and lid, are made of paper, there is no risk of damaging products with nails or splinters. Additionally, it allows for flexible design tailored to the product, enabling efficient transportation. It contributes to environmental considerations under the "SDGs" and supports "White Logistics" through palletization! 【Features】 ■ Core structure that makes it difficult for moisture to penetrate, strong in high humidity ■ Capable of handling heavy loads (over 1000kg) despite being made of paper ■ Lightweight and easy to handle! Leads to reduced transportation costs ■ Mass production and short delivery times are possible while maintaining high quality due to mechanized manufacturing ■ Easy to handle even for women *For more details, please refer to the external link page or feel free to contact us.

• others

Safe transportation of delicate roll products such as film products without damage! Made with reinforced cardboard and thick paper, it is 100% recyclable.

The "Eco Board Bearing Set" is a roll packaging system that significantly reduces the weight of packaging materials. It has strong compression and bending strength, allowing for the safe transportation of delicate products while preventing damage and load collapse during transport. We offer a "U-shaped Bearing Set" that improves work efficiency by allowing the product shaft to be passed through from the top with a U-shaped hole design, and a "Vertical Roll Packaging Set" that allows for stacking. We contribute to environmental considerations under "SDGs" and to "White Logistics" through palletization! 【Features】 ■ No fumigation or disinfection required ■ 100% recyclable ■ Customizable design ■ Lightweight ■ Strong compression and bending strength ■ Suitable for high humidity conditions *For more details, please refer to the PDF document or feel free to contact us.

• Packaging materials

Paper-made lifting rods that enhance efficiency and convenience when transporting heavy items. Being made of paper, they are very lightweight, and their soft cross-section minimizes the risk of damaging products! Custom designs are also possible.

"Eco Block" is a product that can enhance the efficiency and convenience of transporting heavy items. Made of paper, it is lightweight and easy to design to fit specific dimensions. When using "Rinoki," unlike wood, the height and strength are uniform, preventing the product from warping. Additionally, the cross-section is soft, making it less likely to damage the items, providing peace of mind. 【Features】 ■ No need for fumigation or disinfection ⇒ Fumigation treatment cost: 0 yen ■ 100% recyclable as it does not use nails or metal ■ Custom design ⇒ Original design improves loading efficiency ■ Strong compressive strength ■ Lightweight, improving work efficiency *For more details, please refer to the external link page or feel free to contact us.

• others

In the field of food and health food research and development, an increasing number of companies are facing the following challenges: - Difficulty in exploring new functional materials and differentiation themes, leading to a depletion of research topics. - While they are collecting information from conferences and papers, they struggle to translate this into research themes directly related to their products. - They remain limited to competing similar products and follow-up projects, failing to establish uniqueness. - Although there are seeds of ideas, they struggle to elevate them to scientific hypotheses and build the necessary foundations for internal approval. Behind this lies a "wall of execution" that cannot be overcome by traditional information gathering and research processes. In this webinar, we will introduce a new R&D approach to break through these challenges. It is a next-generation research and development scheme that combines AI-driven hypothesis generation, which has achieved results in drug discovery, with scientific hypothesis verification by a food human trial CRO. This will allow for the transformation of vague ideas into scientifically verifiable projects, simultaneously achieving the construction of persuasive foundations for upper management and differentiation development.

Fujikohsuhou Industrial Co., Ltd. will hold an online seminar titled "Tips for Setting Laser Hardening Conditions" on July 20, 2025 (Wednesday). In laser hardening, factors such as output and speed are related to the quality of hardening. We will explain how output and speed are connected to quality factors. This seminar is aimed at those who are looking to start utilizing laser hardening. 【Recommended for】 ■ Those who want to learn about methods for setting laser hardening conditions ■ Those who want to obtain technical information about laser hardening

Take the 'first step' in DX talent development in Fukuoka. We will hold a free seminar where you can learn reskilling strategies that can be applied in the field through case studies and experiences! 'I've become responsible for DX, but I don't know where to start.' This is a participatory seminar aimed at representatives from small and medium-sized enterprises in Fukuoka City, Fukuoka Prefecture, where you can learn the 'first steps' in DX talent development and implementation support. While introducing case studies of representative DX tools such as Power Automate and Power BI, you will experience hands-on sessions with Copilot, allowing you to grasp practical small-start methods that can be implemented on-site. The content also includes specific success stories from the Fukuoka region, along with tips for promoting understanding and advancement within your organization.

We will be exhibiting at INCHEM TOKYO 2025, which will be held at Tokyo Big Sight from September 17 (Wednesday) to September 19 (Friday). This time, we will host many events, including special project stages and mini-seminars. At our booth, we will introduce our solutions and technologies based on the theme of "Sustainable Plant Engineering" from three different concepts. Please be sure to stop by our booth, East Hall 6, K-17.

The Siemens EDA Tech Forum is a technical event aimed at sharing the latest technological trends, case studies, and solutions to challenges with everyone involved in the design and development of silicon systems and electronic systems, while addressing evolving technologies, the densification and complexity of designs, and various design challenges, all while meeting requirements for quality, safety, and reliability. The goal is to deepen insights and networks towards achieving sustainable business. The forum covers a wide range of topics, from advanced design technologies and methods in fields such as 3D ICs, chiplets, chips for AI and ML (machine learning), and IC packaging, to the design, analysis, and collaborative development of electronic systems, including printed circuit boards, across multiple domains, as well as building ecosystems both internally and externally using digital threads. Through case presentations and explanations of design methods by industry leaders, it supports solutions to challenges faced in daily design work from all directions. This is a free technical event that requires pre-registration. We hope you will participate!