Reiwa 6 Fiscal Year JSNDI Autumn First Examination Preparation Course (Japan Non-Destructive Testing Industrial Association, Eastern Japan Branch) Information in Tokyo

For those considering certification exams for ultrasonic flaw detectors! It is possible to purchase the Level 1 and Level 2 test piece sets simultaneously.

We would like to introduce the practical exam preparation set <UI-27> that we handle. We offer Level 1 and Level 2 of JSNDI, along with the "UI-27," which includes a carrying case, battery, and PC software. This is a must-see for those considering certification exams for ultrasonic flaw detectors. Additionally, it is possible to purchase the Level 1 and Level 2 test piece sets simultaneously. Please feel free to contact us if you have any requests. 【Set Contents】 ■ UI-27 ■ Carrying Case ■ Battery ■ PC Software ■ Calibration Certificate *For more details, please refer to the PDF materials or feel free to contact us.

• Other measuring instruments

We have JSNDI Level 1 and Level 2 available! A must-see for those considering certification exams for ultrasonic testing equipment.

We would like to introduce our practical exam preparation set 'UI-S9/UI-R1' that we handle. This set includes JSNDI Level 1 and Level 2, featuring the standard model (JSNDI specifications standardly equipped) "UI-S9" and the JSNDI specification specialized model "UI-R1." Additionally, the JSNDI Level 1 includes vertical prism test specimens for UT Level 1 and vertical flat plate test specimens, while JSNDI Level 2 includes test specimens for vertical UT Level 2 and angled T-joint test specimens as part of the preparation set. 【Set Contents】 ■ UI-S9 ■ UI-R1 ■ Carrying case ■ Soft case and hand strap ■ PC software ■ Calibration certificate *For more details, please refer to the PDF document or feel free to contact us.

• Other measuring instruments

JSNDI function, waterproof compatible! Exam preparation products available as common options.

We would like to introduce our product, the 'UI-R1', which is compatible with the JSNDI specification. This product conforms to the basic operational specifications of the JSNDI digital ultrasonic flaw detector. It includes common options for exam preparation materials, providing all the necessary equipment for UT qualification exam preparation. Please feel free to contact us if you have any requests. 【Features】 ■ JSNDI functionality ■ Waterproof design ■ Exam preparation materials (common options) available ■ Conforms to the basic operational specifications of the JSNDI digital ultrasonic flaw detector * For more details, please refer to the PDF document or feel free to contact us.

• Other measuring instruments

JSNDI function, waterproof! Exam preparation items available as common options.

We would like to introduce our product, the 'UI-R1', which is compatible with the JSNDI specifications. This product complies with the basic operational specifications of the JSNDI digital ultrasonic flaw detector. It includes common options for exam preparation materials, providing all the necessary equipment for UT qualification exam preparation. Please feel free to contact us if you have any requests. 【Features】 ■ JSNDI functionality ■ Waterproof design ■ Exam preparation materials (common options) available ■ Complies with the basic operational specifications of the JSNDI digital ultrasonic flaw detector *For more details, please refer to the PDF document or feel free to contact us.

• Other measuring instruments

JSNDI functionality, waterproof design! Exam preparation items available as common options.

We would like to introduce our product, the 'UI-R1', which is compatible with the JSNDI specification. This product complies with the basic operational specifications of the JSNDI digital ultrasonic flaw detector. It includes common options for exam preparation materials, providing all the necessary equipment for UT qualification exam preparation. Please feel free to contact us if you have any requests. 【Features】 ■ JSNDI functionality ■ Waterproof design ■ Exam preparation materials (common options) available ■ Complies with the basic operational specifications of the JSNDI digital ultrasonic flaw detector *For more details, please refer to the PDF document or feel free to contact us.

• Other measuring instruments

In the field of food and health food research and development, an increasing number of companies are facing the following challenges: - Difficulty in exploring new functional materials and differentiation themes, leading to a depletion of research topics. - While they are collecting information from conferences and papers, they struggle to translate this into research themes directly related to their products. - They remain limited to competing similar products and follow-up projects, failing to establish uniqueness. - Although there are seeds of ideas, they struggle to elevate them to scientific hypotheses and build the necessary foundations for internal approval. Behind this lies a "wall of execution" that cannot be overcome by traditional information gathering and research processes. In this webinar, we will introduce a new R&D approach to break through these challenges. It is a next-generation research and development scheme that combines AI-driven hypothesis generation, which has achieved results in drug discovery, with scientific hypothesis verification by a food human trial CRO. This will allow for the transformation of vague ideas into scientifically verifiable projects, simultaneously achieving the construction of persuasive foundations for upper management and differentiation development.

Fujikohsuhou Industrial Co., Ltd. will hold an online seminar titled "Tips for Setting Laser Hardening Conditions" on July 20, 2025 (Wednesday). In laser hardening, factors such as output and speed are related to the quality of hardening. We will explain how output and speed are connected to quality factors. This seminar is aimed at those who are looking to start utilizing laser hardening. 【Recommended for】 ■ Those who want to learn about methods for setting laser hardening conditions ■ Those who want to obtain technical information about laser hardening

Take the 'first step' in DX talent development in Fukuoka. We will hold a free seminar where you can learn reskilling strategies that can be applied in the field through case studies and experiences! 'I've become responsible for DX, but I don't know where to start.' This is a participatory seminar aimed at representatives from small and medium-sized enterprises in Fukuoka City, Fukuoka Prefecture, where you can learn the 'first steps' in DX talent development and implementation support. While introducing case studies of representative DX tools such as Power Automate and Power BI, you will experience hands-on sessions with Copilot, allowing you to grasp practical small-start methods that can be implemented on-site. The content also includes specific success stories from the Fukuoka region, along with tips for promoting understanding and advancement within your organization.

We will be exhibiting at INCHEM TOKYO 2025, which will be held at Tokyo Big Sight from September 17 (Wednesday) to September 19 (Friday). This time, we will host many events, including special project stages and mini-seminars. At our booth, we will introduce our solutions and technologies based on the theme of "Sustainable Plant Engineering" from three different concepts. Please be sure to stop by our booth, East Hall 6, K-17.

The Siemens EDA Tech Forum is a technical event aimed at sharing the latest technological trends, case studies, and solutions to challenges with everyone involved in the design and development of silicon systems and electronic systems, while addressing evolving technologies, the densification and complexity of designs, and various design challenges, all while meeting requirements for quality, safety, and reliability. The goal is to deepen insights and networks towards achieving sustainable business. The forum covers a wide range of topics, from advanced design technologies and methods in fields such as 3D ICs, chiplets, chips for AI and ML (machine learning), and IC packaging, to the design, analysis, and collaborative development of electronic systems, including printed circuit boards, across multiple domains, as well as building ecosystems both internally and externally using digital threads. Through case presentations and explanations of design methods by industry leaders, it supports solutions to challenges faced in daily design work from all directions. This is a free technical event that requires pre-registration. We hope you will participate!